Transcript Intel Centrino Duo Mobile Technology

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Best business
power to succeed
on the move
Toshiba brings you the best interpretation of the
Intel® Centrino® Duo Mobile Technology promise.
Copyright © 2006 Toshiba Corporation. All rights reserved.
Mobile computer market is experiencing double-digit growth
• End-user computing demands and usage are expanding
• Outstanding opportunity to grow sales
• Mobile market growth is 3x the rate of desktops
17%
Compound
Annual growth
90
80
70
Total Mobile PC Shipments
(millions)
60
50
Intel supports this
growth by launching
‘Napa’, the next
generation mobile
platform
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30
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0
2002
2003
2004
2005
2006
2007
2008
Source: Gartner, May 2004
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• Toshiba notebooks
offer the ideal mix
of technology,
performance and
quality for success
on the move and
enhanced real-time
communication.
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• Intel® Centrino®
Duo Mobile
Technology helps
your business to
succeed by taking
mobile performance
and communication
to the next level.
Best business power
to succeed on the move
• Gaining the competitive
edge and growing the
business depend on a
responsive workforce
able to work together
as a team and to
respond quickly to
customers.
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Best business power
to succeed on the move
Increased processing power
Improved connectivity
Impressive multitasking
Better manageability
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Intel® Centrino® Duo Mobile Technology
Next generation mobile platform
Processor
Q2’2004
Q1’2005
Q1’2006
Intel® Pentium® M
Processor
Dothan 400 MHz
Intel® Pentium® M
Processor
Dothan 533 MHz
Intel® Core™ Duo
Processor
667 MHz
Yonah
855
Chipset Family
Mobile Intel® 915
Express Chipset
Family
Mobile Intel® 945
Express Chipset
Family
Calistoga
Intel®
PRO/Wireless
2200BG Network
Connection
Intel® PRO/Wireless
2915ABG Network
Connection
Intel® PRO/Wireless
3945ABG Network
Connection
Golan
Chipset
Intel®
Wireless
Carmel
Refresh
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Sonoma
Napa
Intel® Centrino® Duo Mobile Technology
Improvement versus previous version
• Increased Performance
– Dual Core processor with 667MHz FSB
– Generation 3.5 Intel® Integrated Graphics
– DDR2/667 Dual Channel Memory
• Enhanced Wireless Communication
– Latest IEEE 802.11 Standards
• Form Factor
– Reduced Calistoga package size
– Golan MiniCard Form Factor
• Improved Battery Life
– Targeting 5 Hour Battery Life*
Platform
Sonoma
Napa
CPU
Dothan
Single Core
Yonah
Dual Core
FSB
533 MHz
667 MHz
Wireless
CLX2 ABG
MiniPCI
form factor
Golan ABG
MiniCard
form factor
Memory.
DDR2
400/533 MHz
DDR2
533/667 MHz
Chipset
Alviso &
ICH6-M
Calistoga &
ICH7-M
PATA
SATA
Ethernet
Integrated 10/100
based on PC1e
Integrated
10/100/1G
Based on PCIe
Audio
Intel® High
Definition Audio
Intel® High
Definition Audio
ODD
Significant platform enhancements extending mobility value proposition
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/ * Battery life may vary depending on applications, power management settings and features utilized.
Intel® Centrino® Duo Mobile Technology
Overview of Platform Feature
Target Platforms
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–
Processor
Transportable
Full Size
Thin & Light
Mini-Note & Sub-Note
– Yonah Dual Core,
– Yonah Single Core
– FSB 533/667 MHz
Yonah
TV
CRT
Graphics Memory & IO Controller
– Main Memory:
• 4 & 2 GB max memory:
256 MB, 512 MB, 1 GB, 2GB modules
• DDR2 400/533/667 MHz, 1-2 Channels
• 1 SO-DIMM per channel
– Int. Graphics: Gen 3.5 Core
• 1.05V: 133, 166, 250 MHz
• 1.50V: 400 MHz
• Intermediate Z in Classic Mode
• VLD/iDCT, 4X HWMC
– Key Media features
• TV-Out & LVDS, SDVO w/ lane reversal
• D-connector support
• Video Capture via x1 PCI Express* input
– Ext. port PCI Express x16 (PEG)
– x2, x4 DMI support with lane reversal
– I/O Support: ICH7M
• 6 PCI Express* ports, 8 USB 2.0 ports
• 2 SATA , 1 PATA
• PCI, LPC, SPI
• Azalia & AC ’97
• Intel® Matrix Storage Manager 5.5
for SATA HDD/ODD
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FSB 667MHz
DDRII SO-DIMM
LVDS
Flat Panel
Discrete
Gfx
PCIE x16
Calistoga
DDR II 667MHz
Golan
WLAN
DMI x4
2 Ports
x1
1 Port
x1
GbE
x1
ExpressCard*
ExpressCard* x1
docking
6 PCIE Ports
PATA
ICH7M
Azalia /
AC 97
LPC
x2
SPI Flash
TPM 1.2
LPC
8 ports
SIO/EC
Communication Interfaces
– Golan WLAN with mini-card form factor
– Tekoa Gbit Ethernet with Intel® Active Management Technology
Intel® Centrino® Duo Mobile Technology
Advancing the 4 vectors of mobility
Revolutionary Performances
Increased Battery Life
Dual core changes the experience –
more responsive; true multitasking
Intel® Digital Media Boost
>1.7X Floating Point
>1.8X Integer
>200 Enabled Applications
Intel®
Dynamic Power Coordination
Display Power Savings Technology 2
Extended Battery Life Techniques
5+ Hours of Battery Life*
>1/2 W Platform Power Savings
Enhanced Deeper Sleep
Intel® Centrino® Duo Mobile Technology
Intel® Core™
Duo Processor
Intel® 945
PM/GM/GMS Chipset
Form Factor Improvements
Intel® PRO/Wireless
3945ABG
More intelligent Wireless
WLAN in Mini Card form factor
Small Form Factor Chipsets
LV/ULV Processors
More capability in T&L FF
~50% reduction in WLAN FF
1.1” & Thinner Notebooks
Leading QoS & APIs to improve VoiP
Automatic Selection of Optimum AP
Validation of Select WWAN Vendors
Increased Range / Connectivity
Simplified & More Powerful SW
Optimizations for Cisco* Networks
The whole is greater than the sum of the parts
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/ * Battery life may vary depending on applications, power management settings and features utilized.
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Q4’05
Q1’06
915GM
945GM
Q2’06
915PM features
945PM features
+ Intel® Graphics Media
+ Intel® GMA 950
Accelerator 900
+ Intel® Display Power Saving
+ Intel® Display Power Saving
Technology 2.0
Technology 2.0
915PM
855 Family
533/400MHz FSB
Dual Channel DDR2-533/400
Single Channel DDR2-400
Single Channel DDR333
PCI Express x16
37.5mm x 40mm / FCBGA
H2’06
2006 Corporate Stable
945PM
667/533MHz FSB
DDR2-667/533; 4GB max mem
PCI Express x16
37.5mm x 37.5mm / FCBGA
945GMS
915GMS
400MHz FSB
Single Channel DDR2-400
Intel® Display Power Saving
Technology 2.0
27mm x 27mm / FCBGA
667/533MHz FSB
Single Channel DDR2-533
Intel® Display Power Saving
Technology 2.0
27mm x 27mm / FCBGA
945GMZ
667/533MHz FSB
DDR2-533; 2GB max mem
Intel® GMA 950
37.5mm x 37.5mm / FCBGA
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Value
Mainstream
Performance
Intel® Centrino® Duo Mobile Technology
Chipset roadmap
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910GML
940GML
400MHz FSB
Dual Channel DDR2-400
Single Channel DDR2-400
Single Channel DDR333
37.5mm x 40mm / FCBGA
533MHz FSB
DDR2-533; 2GB max mem
Intel® GMA 950
37.5mm x 37.5mm / FCBGA
Integrated Gfx Only
Integrated + Discrete Gfx
Discrete Gfx Only
Small Form Factor
Intel® Centrino® Duo Mobile Technology
Sales Advantages
Feature
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Intel® Calistoga Graphics
Next Generation Chipset,
Generation 3.5 Integrated
Graphics
- High quality, stable and cost effective graphics
- Support for key 3D features without the added costs
or power of discrete graphics
Intel® Stable Image
Platform Program
Napa - stable image platform
aligned to Napa Q1’06 Launch
- Provides standardized hardware configuration that IT
departments can deploy into the enterprise for a set
period of time
Golan Minicard/ Muroc
Latest IEEE standard support
(including 802.11e)
- Support for real-time applications
- Extended manageability support
New / latest memory technology
- Delivers increased bandwidth for improved system
performance without compromising power for
demanding business applications and multitasking
environments
Out-of-Band HW & SW Inventory,
Remote Reboot & System Control,
Alerting, Event Log, and 3rd Party
Non-Volatile Storage
- Manage all your hardware & software computing assets
- Heal systems remotely regardless of the OS or system
state
- Protect your enterprise against software attacks
Intel’s latest High Definition
Audio specification. Dolby
exclusive licensing is available.
- Enables low power CPU state with audio activity
resulting in power savings
- High quality audio with support for an increased
number of audio streams
- Jack re-tasking enables input or output functionality
as required
Yonah Dual Core - Intel®
First Mobile Dual Core processor
Intel®
Pentium®
Qualify &
Launch
Benefit
Designed to execute multiple
threads simultaneously by using
two cores on one Die
M
Intel®
processo
r915GM &
915PM
Chipsets
Intel®
PRO/Wirel
ess
Deploy &
2200BG
2915ABG
Dual Channel DDR-2
667 MHz Memory
Tekoa GbE & Intel® Active
Management Technology
Azalia - Intel® High Definition Audio
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Increased performance
Support multi-threaded applications
Effective multitasking
Real productivity gains
Intel® Centrino® Duo Mobile Technology
Yonah Processor Overview
Core
1
Core
2
L2
L2
cache
cache
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• 667 MHz Front Side Bus
• Built on Intel’s new 65nm technology
• Two mobile optimized execution cores in a single processor
Bus
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• Intel’s first Dual-Core mobile optimized CPU
• Parallel threads executed on separate cores with dedicated
CPU resources
• Yonah Dual-Core leverages Intel® Hyper-Threading
Technology (HT Technology) ecosystem
Intel® Centrino® Duo Mobile Technology
Benefits for B2B
“I get more done in the same about of time!”
• Greater productivity thanks to dual-core processing and improved
multitasking
“My intensive application runs better!”
• Improved efficiency thanks to the optimized architecture
“I can respond faster to my highly demanding business priorities”
• More responsive computing thanks to faster hardware components
“I can finally do everything, work everywhere, communicate
anytime without boundaries!”
• Improved mobile working thanks to enhanced wireless technologies.
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Intel® Centrino® Duo Mobile Technology
Business Value Proposition
• Business can be more responsive with breakthrough dualcore processing capabilities on new notebooks
• New innovations for enhanced manageability and better
security in today’s increasingly mobile business environment
• New notebooks enable improved battery life to increase
mobility and productivity
• Extended connectivity options on notebooks give employees
more flexibility to collaborate with clients and colleagues
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