Transcript Pre_and_post_assembly_IVs_summary

UK Assembly IV Update
UK Pixel Weekly Meeting
Previous update 30/5/2013
13/6/2013
Wafer 2433-14, UK Quad 7. 450um
edge and Quad 5, production
Wafer 2433-13, UK Quad 7, 450um edge
0.0
•
-2.0x10-6
Leakage current (A)
-4.0x10-6
-6.0x10-6
•
-8.0x10-6
-1.0x10-5
-1.2x10-5
-1.4x10-5
-1.6x10-5
Post Assembly
Pre Assembly
Better breakdown performance
• > 400V post – assembly
• < 200V pre - assembly
Lower leakage
• 1.45x10-7 @ 130V Post Assembly
• 6.8x10-7 @ 130V Pre Assembly
• (see look-up table later)
-1.8x10-5
-2.0x10-5
-600 -550 -500 -450 -400 -350 -300 -250 -200 -150 -100 -50
Wafer 2433-13, UK Quad 5, Production
0
0.0
Bias voltage (V)
-5.0x10-6
•
Higher Leakage observed prior to
breakdown
• 1.38x10-5 @ 130V Post
Assembly
• 6.8x10-6 @ 130V Pre Assembly
• (see look-up table later)
Leakage current (A)
-1.0x10-5
-1.5x10-5
-2.0x10-5
-2.5x10-5
-3.0x10-5
-3.5x10-5
-4.0x10-5
-4.5x10-5
-5.0x10-5
-5.5x10-5
Post Assembly
Pre Assembly
-6.0x10-5
-600 -550 -500 -450 -400 -350 -300 -250 -200 -150 -100 -50
Bias voltage (V)
0
Single assembly SC1, Wafer 2615-19
Pre and post assembly IV - Wafer 2615-19, SC1
0
•
Leakage current (A)
-1x10-8
-2x10-8
-3x10-8
Compliance set at 60nA
on post assembly data
-8
-4x10
-5x10-8
Post - Assembly
Pre - Assembly
-6x10-8
-7x10-8
-400
-350
-300
-250
-200
-150
Bias voltage (V)
-100
-50
0
Lower leakage observed
• 8.9x10-9 @ 130V Post Assembly
• 1.1x10-8 @ 130V Pre Assembly
• (see look-up table later)
Comparison of Assembly IV after
Paralene Coating
0.0
Pre and Post Assembly IVs including Post Parylene Coating (PPC)
2873-18, SE3 Assembly 2
-5.0x10-9
-1.0x10-8
Leakage Current (A)
-1.5x10-8
-2.0x10-8
-2.5x10-8
-3.0x10-8
-3.5x10-8
Pre Assembly
Post Assembly
Post Assembly PPC
-8
-4.0x10
-4.5x10-8
-5.0x10-8
-5.5x10-8
-6.0x10-8
-160
-140
-120
-100
-80
-60
-40
-20
0
Bias Voltage (V)
Paralene coating process does not appear to affect performance
Assembly Look-up table
UK Assembly ID
Quad 2
Quad 7
Quad 5
SC1
SE3 Assembly 2
SE4 Assembly 1
SC4 Assembly 4
SC6 Assembly 6
SC9 Assembly 9
SC10 Assembly 10
SC1 Assembly 16
SC2 Assembly 17
SC4 Assembly 18
SC5 Assembly 19
SC6 Assembly 20
SC9 Assembly 15
Pre - Assembly
Post Assembly
Bias (V)
Leakage (A)
Bias(V)
Leakage (A)
-5
-130
-5
-130
-5
-130
-10
-130
-10
-130
-10
-105
-10
-130
-10
-130
2.95x10-7
4.15x10-7
3.15x10-7
6.8x10-7
2.96x10-7
1.06x10-6
8.47x10-9
1.1x10-8
7.6x10-9
2.03x10-8
6.1x10-9
1.27x10-8
6.5x10-9
8.75x10-9
6.58x10-9
1.02xx10-8
-
-
-5
-130
-5
-130
-11
-131
-10
-130
-10
-130
-10
-130
-10
-130
1.22x10-8
1.45x10-7
6.0x10-8
-1.38x10-5
5.6x10-9
8.9x10-9
9.64x10-9
compliance
7.14x10-9
1.9x10-9
6.08x10-9
7.3x10-9
5.65x10-9
7.47x10-9
-20
-130
-10
-130
-10
-130
-15
-135
-15
-135
-15
-135
-15
-135
-15
-135
7.6x10-9
9.5x10-19
6.5x10-9
9.6x10-9
5.1x10-9
1.2x10-8
5.3x10-9
1.16x10-8
5.4x10-9
1.03x10-8
4.9x10-9
1.55x10-8
4.2x10-9
1.18x10-8
5.7x10-9
1.05x10-8
-20
-130
-10
-100
-10
-130
-15
-135
-15
-135
-15
-135
-15
-135
-15
-135
7.2x10-9
9.2x10-9
6.1x10-9
50x10-9
8.6x10-9
1.19x10-8
7.9x10-9
1.4x10-8
7.9x10-9
1.4x10-8
8.39x10-9
1.2x10-8
8.3x10-8
1.19x10-8
2.52x10-8
2.03x10-8
Comment
-
Single module SC9 Assembly 15
SC9 Assembly 15 (a.k.a VTT15)
0
• Some reduced leakage
observed when power is
turned down on the chip
• @ -135V a difference of 5nA
between CP-on and CP - off
-8
-1x10
Leakage Current (A)
-2x10-8
-3x10-8
-4x10-8
-5x10-8
-6x10-8
-7x10-8
Pre-assembly
Post-assembly CP-on (27C)
Post-assembly CP-off (27C)
-8x10-8
-550 -500 -450 -400 -350 -300 -250 -200 -150 -100
Bias Voltage (V)
-50
0
Defect Gallery of Quad 2
Summary and to do
• IV characteristics of the assemblies imply that the bump bonding
process is working well
• Some analysis of the assemblies not performing well is on-going
• Higher breakdown voltages and lower leakage currents (particularly
on quad assemblies) is observed
• The paralene coating process does not appear to affect the assembly
performance
• Complete population of Assembly look-up table
• Compile defect analysis of failed and low performing assemblies