Transcript Session 5.2

ECID vs Device ID
Bill Eklow
Cisco
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1
Moore’s Law – Transistor Count
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2
Board Level Complexity
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3
Moore Complexity
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4
Combined Line Card
Chips@Cisco 2005
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5
Why Chips Fail in System
Supplier
test
escapes
CM
database
Inaccuracy
DPMO
ICT &
XRAY
escapes
CM
diagnostic
issues
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ASIC
design,
marginality
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Board
design
Issues
Environmental
6
Returning Bad Components
board fails
functional test
ICT retest *
Pass
Re-verified
at debug
X-ray retest
Confirmed
Pass
BScan
Remove failed
ASIC
and replace it
Pass
Confirmed
ASIC fail to
Supplier for retest
X-ray retest
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Pass
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ICT retest
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Pass
Board to
production
7
Root Causing Bad Components
Focused ASIC RMA
Supplier
coverage ok?
no
Add more
coverage
fail
Supplier FA
yes
Supplier retest
pass = NTF
Retest NTFs
in system
fail
Diagnose fail
pass
•Test escape? Environmental fail?
•Bad Diags? Good ASIC?
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ATE Test escape?
8
Please – No More Moore!!!!
 Device complexity/gate count/speed increasing
 Component volumes increasing
 Product Diversity increasing
 Disconnect between Manufacturing and Engineering
 Disconnect between CMs and Component Suppliers
 Field Failures???
 Result: Systemic Component Problems rarely get fixed
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9
Collaboration in a Virtual Supply Chain
EMS
Partners
Component
Suppliers
Quality Data
Infrastructure
System
Integrator
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Customer
10
What is eCID?
 eCID is acronym for, “electronic
chip ID”
w1234
– Initiated by IBM
– Now a requirement for all new
ASICs
– Accessible via JTAG or CPU
 In IBM case, 112 bit string
contains the following information
– Lot ID
– Wafer ID
– X / Y location of die in a wafer
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For example,
eCID = {lot xyz, w1234, 4, 2}
11
Wafer Map Analysis : feedback mech.
Voltage
“Good”
Neighbors
Pass
Freq
“Bad”
Neighbors
+ Edge die
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Margin
Variation
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12
End-to-End Process Data
Key Analysis Tools
 ECID regionality analysis
 Parametric characterization
data for anomalies
0
5
10
15
20
25
30
Actions Taken
 Tightened test limits
reducing product failures
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13
Benefits
 Component Suppliers get data, not parts
 Can apply component yield methodologies to system
failures (Virtual Vertical Integration)
 Process automation
 Much finer granularity for traceability
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14
Issues
 Standardizing access and format of ECID data
 Device ID???
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15
Device ID
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Challenges
 Full ICT may go away
 Functional diagnostics
– Hard to scale
– Need pilot project to test out
 Need IT support
– Escalate the priority
 Current pilot
– Not running for all ASIC/CM/Supplier
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