Transcript Document
Project 139: Developing Eco-friendly
Radio Absorbing Materials (RAM) for
Anechoic Chambers
Qian Xu
http://www.cgeinnovation.org/
http://www.rainfordemc.com/
Outline
• Background Information
• Research Questions
• Systematic Solutions
Qian Xu, 2
Background Information
Micro-level
Macro-level
How to design
the chamber
?
Pictures from: ETS LINDGREN
http://www.ets-lindgren.com/
Pictures from: www.cst-china.cn
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William H. Emerson, IEEE Trans. on Antenn. And Propag., Vol. AP21, No. 4, July, 1973.
• Mid 1930’s: Theoretical and experimental work.
• 1936: First patented absorber.
• WWII(1939-1945): Germany: Schornsteinfeger(Wesch
material & Jauman absorber ), US: HARP(Halpernanti-radar-paint) by Halpern at MIT Radiation
Laboratory, Salisbury screen.
• 1945-1950: Broad-band absorber.
• The early 1950’s: First “dark rooms”.
• The late 1950’s: New generation of broad-band.
absorbers(-40dB normal), antenna pattern comparison
method, new chamber shape, shielded anechoic
chambers.
• 1960’s: Low frequency absorber(-40dB 100MHz), 3rd
generation RAM (-60dB normal), improved absorber
measurement(Free-space VSWR), tapered chamber
by Emerson.
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S. M. J. Razavi, M. Khalaj-Amirhosseini, and A. Cheldavi, PIER B,
Vol. 19, 367-383, 2010.
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Outline
• Background Information
• Research Questions
• Systematic Solutions
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Research Questions
1. How to choose/analyse/optimise RAM?
Ferrite tiles
Hybrid
Pyramid
Pictures from: http://www.rainfordemc.com/anechoic-materials.html
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Research Questions
2. How to design/analyse/optimise the whole chamber?
Tapered Chamber
Picture from:
http://www.mobilemag.com/2010/07/16/apples100-million-test-chamber-droid-eris-andblackberry-bold-9700-suffer-the-same/
Compact Chamber
Aircraft Chamber
Picture from:
http://gtresearchnews.gatech.edu/gtricompact-range/
Picture from:
http://www.rainfordemc.com/aircraftchamber.html
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Outline
• Background Information
• Research Questions
• Systematic Solutions
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Systematic Solutions: Macro-level
• Key problem: Whole chamber design
Trial and error/cut and try
Ray Tracing
Full wave simulation
Accuracy
• Commercial Software: CST (FEM, FITD), HFSS (FEM),
Feko (MoM)
• Friendly GUI, General simulation software, Pricy, High
performance computers(cluster), Time consuming
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Trial and error
• Empirically based, mostly determined by lower frequency limit.
• Thickness~Reflectivity
W=1/2L
• Extraneous energy level~Reflectivity (Free Space VSWR
Method)
Picture from: Electromagnetic Anechoic Chambers A Fundamental Design
and Specification Guide, Leland H. Hemming, Chapter 9.3.2
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Free Space VSWR Method
Repeated again for horizontal and vertical polarisation.
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Free Space VSWR Method
Ripple:
Extraneous
signal :
If a 0.3dB ripple
is observed 20dB
down from the
peak, the
extraneous signal
level is -55dB
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Full Wave Method
• Algorithm limit
N PO/SBR/GO
N*log(N) MLFMM
N1.1~1.2 FDTD
N2 FEM
N3 MoM
Frequency
Electrical Size
/Physical Size
Electrical Volume
10MHz
0.5λ/15m
0.125λ3
100MHz
5λ/15m
125λ3
1GHz
50λ/15m
125E3λ3
10GHz
500λ/15m
125E6λ3
40GHz
2000λ/15m
8E9λ3
• Consider lossy(inhomogeneous) material
FEM, FDTD, GO
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Ray Tracing/GO(Geometric Optics)
• High frequency approximation
T=R+G+P(dB)
normalized to direct ray in dB
Ref: Electromagnetic Wave Theory, J. A. Kong, p.722.
T=Total strength R=reflection coefficient
G=Antenna pattern gain P=Propagation parameter
Ref: Electromagnetic Anechoic Chambers A Fundamental Design and
Specification Guide, Leland H. Hemming, Chapter 5.2.3
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Ray Tracing/GO Workflow
Modified rectangular, Compact Range, Tapered
Preprocessing: Modeling (.stl)
Mesh Generation,
Material/Boundary Assignment
GND, side-wall, back-wall….
different area with different reflectivity
Ray Tracing Code
GPU,
Parallel
Field Distribution
1st order, 2nd order, 3rd order reflection
(Propagation direction, Amplitude, Phase)
Performance & Cost
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Expected Results
• Performance
Field uniformity (±?dB)
• Cost
• Debug/Optimize
1st order, 2nd order, 3rd order
reflection can be used to find
the source of extraneous signal.
Ref: Minimum usage of ferrite tiles in anechoic chambers, S. M. J.
Razavi, M. Khalaj-Amirhosseini, and A. Cheldavi. PIER B, Vol. 19, 367387, 2010.
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Thank you!