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COMPANY PROFILE 2006. 07
“ High Technology for Display Devices ”
SEKWANG TECHNOLOGIES CO., LTD
I N D E X
1. OFFICE AND ADDRESS 2. COMPANY PROFILE 3. COMPANY HISTORY 4. ORGANIZATION 5. CERTIFICATION 6. DEALING ITEM
6-1. MODULE ASS’Y 6-2. LCD ASS’Y MACHINE
7. FACTORY APPEARANCE 8. LOCATION
2p
1. OFFICE AND ADDRESS
OFFICE ADDRESS TEL HEAD OFFICE & FACTORY BUNDANG OFFICE (SEOUL) HONG KONG BRANCH SHENZHEN BRANCH (CHINA)
351, BUKJUNG DONG, YANGSAN,KYUNGNAM KOREA 8F MIDO PLAZA BLDG, #158 GEUMGOK-DONG, BUNDANG-GU, SEONGNAM-SI, GYEONGGI-DO KOREA.
ROOM10, 6F., WAH SHING IND.CENTRE, 11-13 SHING YIP STREET,KWUN TONG, KOWLOON,HONG KONG.
82-55-372-3151~3 82-31-713-5710 852-2997-7176~8 86-755-2609-7641
SUZHOU BRANCH (CHINA)
YING XIANG HUA YUAN 3 –1401ROOM XINGHAI STREET SUZHOU CHINA 86-512-6763-4211
FAX
82-55-372-3154 82-31-716-6416 852-2997-7588
MOBILE PHONE
82-11-9544-3151 82-11-877-5710
82-11-323-4611 [email protected]
852-9364-6338 [email protected]
SEKWANG TECHNOLOGIES CO., LTD
3p
2. COMPANY PROFILE
> COMPANY NAME : Sekwang Technologies Co.,Ltd. > PRESIDENT : D. W. Kim ( 金東佑 ) > ESTABLISHMENT : 20.JAN.1995
> CORPORATION REGISTERED No . : 184511-0026557 > EMPLOYEES : 130 >
CAPITAL
> ADDRESS :
USD 800,000
: 351, Bukjung Dong, Yangsan, Kyungnam,Korea TEL) 055-372-3151~3. FAX) 055-372-3154 E-MAIL) [email protected]
> PLANT SIZE : 1,691 M²/SITE AREA : 3,089 M²(4 FL) / FLOOR AREA > MAIN PRODUCT - LCD MODULE ASS’Y EQUIPMENTS / PANEL EQUIPMENTS : Design, Manufacturing & Sales For ACF, FOG, COG, COF, TAB BONDER, AUTO POL ATTACH M/C, END SEAL, COG INSPECTION M/C, FPC CUTTING M/C, INLINE AUTO COG/FOG BONDING M/C - LCD MODULE ASSEMBLY PRODUCTS : Design, Assembling & Sales For BACK LIGHT MODULE
SEKWANG TECHNOLOGIES CO., LTD
4p
3. COMPANY HISTORY
2006. OCT.
Developed FPC Cutting M/C
OCT.
Developed Auto Pol Attach M/C
JUL .
MAY.
Developed Auto Trace Tester ( 3.5 SEC) Start to Develop Middle size(3”~7”) COG+FOG bonding M/C (Tact time 3.9sec) ( Planed to finish within Oct.)
APR.
MAR.
Start to Develop auto Pol attach M/C. (3.5sec) ( Planed to finish within Sep.) Start to Develop small size(1”~4”) COG+FOG bonding M/C (Tact time 3.5sec) ( Planed to finish within Sep.) Acquired ISO14001:2004 Certificate for LCD Equipment & LCD BLU assembly.
2005. AUG.
JUL .
JUN.
MAR.
Developed Semi Auto COF Bonding M/C. (Tact time 6.5sec) Developed Loading & Cleaning M/C. Developed Auto Trace Tester. Patent Application about In Line type COG+FOG Bonding M/C. Delivered In Line type COG+FOG Bonding M/C. (Tact time 4.5sec)
2004. JUN.
MAY.
FEB.
Developed IN LINE FOG Bonding M/C.
Acquired ISO-9001 Certificate for LCD Equipment & LCD BLU Assembly.
Developed IN LINE COG Bonding M/C.
2003. JUN.
FEB.
2002. JAN.
Developed Camera Module Bonding M/C For SAMSUNG TECHWIN. Establish R & D Center at YANGSAN Factory Move to YANGSAN New Factory
1999. JAN.
Established Panel Line Equipment manufacturing factory for STN LCD line.
(Pol Attach M/C, Scribe M/c. Break M/C, End Seal M/C, LC Cleaning M/C, LC Filling M/C)
1998. AUG.
Establish Module Line Equipment manufacturing factory for STN LCD line.
(TCP Bonder. ACF M/C, COG M/C, COF M/C, TAB cutting M/C, Hot Bar M/C, Clean booth)
SEKWANG TECHNOLOGIES CO., LTD
5p
3. COMPANY HISTORY
1996. MAR.
Make a Representative Agreement with PUCKA for FPCB.
Start to Assembly Back Light(640*480) for Large size of Colour STN Module.
1995. JUN.
MAR.
MAR.
JAN.
Opened the business for Back Line Process Equipments of LCD Start to make LCD Module OEM for Samsung SDI.
Make a Representative Agreement with ONPRESS PRINTED CIRCUIT LTD(H.K) & MICRO CIRCUIT LTD(H.K) for PCB sales in Korea Founded to supply the best material for LCD, LCD Module and Equipments in Korea
SEKWANG TECHNOLOGIES CO., LTD
5p
4. ORGANIZATION
SEKWANG TECHNOLOGIES CO., LTD
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5. CERTIFICATION
1) Environment Management System Certificate - KMA Registrations & Assessments Inc.
2) Innovative Technical (INNO-BIZ) Company Certificate - Small and Medium Business Administration 3) Certificate of Registration - TQCS International (Group) Pty Ltd.
4) Export Prospective Company Certificate - The Centre of Supporting Kyoungnam Regional Small and Medium Company 5) Certificate of Venture Business - Kyoungnam Regional Small and Medium Business Administration 6) The R&D Center Certificate - Korea Industrial Technology Association 7) Certificate - Gyeongnam Export Center, SMBA.
SEKWANG TECHNOLOGIES CO., LTD
13p
5. CERTIFICATION
1) 1) 2) 3) 4)
SEKWANG TECHNOLOGIES CO., LTD
5) 6) 7) 13p
6. DEALING ITEM
ITEM LCD ASS’Y Equipment LCD Module Ass,y Product DESCRIPTION M/C for Module (ACF Bonding M/C, FOG Bonding M/C, COG Bonding M/C, COF Bonding M/C, Hot bar, TAB Cutting M/C, E/T Tester ) M/C for Panel (POL Attach M/C, End seal M/C , Hot press, Scribe M/C, Break M/C.
Seal Cure Oven, LC Filling M/C, POL Cutting M/C,) Back Light Ass,y
SEKWANG TECHNOLOGIES CO., LTD
7p
6-1. MODULE ASS’Y PRODUCT
>
COG (Chip on Glass)
- It is most cost effective design. And it makes a module thinner and lighter.
- It need a larger contact edge of the LCD glass and protection against IR-light. - It is useful for LCD modules in mobile phone and MP3 application.
>
COF (Chip on Flex)
- It can be applied for display driver ICs, which have more than 100um pad pitch.
- It is useful for PDP and CMOS image sensor module application especially.
>
FOG (Film on Glass)
- It is an effective design for the fine pitch and high resolution LCD modules.
- It is useful for LCD modules in mobile phone and PDA application.
SEKWANG TECHNOLOGIES CO., LTD
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FCOF (Flip Chip on Flex)
- It is a new advanced technology for fine pitch and high resolution LCD modules.
- It makes an application smallest, thinnest, lightest and most compact.
8p
6-2. LCD ASS’Y MACHINE
>
POL ATTACH M/C
This machine attach the Polarizer Film to the cell automatically.
It separates protective tape on polarizer film when ell is put on the vacuum stage and moves the stage to attach the polarizer film correctly to the cell.
>
ACF BONDING M/C
This machine is used to attach the ACF tape on the TAB film or glass to improve the conductivity.
>
COG BONDING M/C
This machine is a COG bonding Machine which bonds panel and IC by manual aligning with keeping determined time, temperature and pressure condition.
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COG BONDING M/C
This machine is Semi Auto COG bonding machine which bonds IC on the LCD Panel by auto aligning with keeping determined time, temperature and pressure condition.
SEKWANG TECHNOLOGIES CO., LTD
9p
6-2. LCD ASS’Y MACHINE
>
COG BONDING M/C
This machine is In Line COG bonding m/c which bonds continuous from ACF process to COG process on LCD panel by auto aligning with keeping determined time, temperature and pressure condition.
>
COG BONDING M/C
This machine is In Line type Auto COG Bonding m/c which bonds IC on LCD Panel through ACF bonding, pre bonding, main bonding & unloading by PC and PLC controlled auto operation system.
SEKWANG TECHNOLOGIES CO., LTD
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COF BONDING M/C
This machine is a semi auto COF bonding machine which bonds IC on the FPC panel by auto aligning with keeping determined time, temperature and pressure condition.
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COF BONDING M/C
This equipment bonds the chip on the FPCB named semi auto COF bonding , the process of COF from loading of FPCB, pre bonding, main bonding and unloading will be performed automatically. Every motion of m/c will be controlled by PC and PLC program.
10p
6-2. LCD ASS’Y MACHINE
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FOG BONDING M/C
This machine is used for bonding the TAB LSI and FPC to the LCD glass on the ACF attached.
Bonding stage shift to the left And right side for bonding by shuttle shifting.
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AUTO FOG BONDING M/C
This machine is In Line type Auto FOG bonding machine which bonds FPC on the LCD panel through ACF bonding, pre bonding, main bonding & unloading by PC and PLC controlled auto operation system.
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AUTO TRACE TESTER
This machine is used next process of COG and FOG in tracing of pressure on LCD panel. LCD panel from previous is put in inspection stage to be checked whether it’s “OK/NG” by the camera.
SEKWANG TECHNOLOGIES CO., LTD
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LOADING & CLEANING M/C
This machine is used for LCD loading and LCD Cleaning before COG or FOG bonding. LCD panel are supplied automatically from LCD tray and LCD pad are cleaned with API by wiper and air knife unit.
11p
7. FACTORY APPEARANCE
>
Busan Factory
1.Site Area :1,691M²(512 PY) 2.Floor Area :3,088M²(936 PY) - 1st FL:(825M²) : Equipment Machining & Assembly Factory. - 2nd FL:(1,005 M²) : Back Light Unit Ass’y Line (10,000 class Clean room/330M²) - 3rd FL:(1,005 M²) : Back Light Unit Ass’y Line (1,000 class Clean booth) - 4th FL:(253 M²) : Facilitys for Clean Room
SEKWANG TECHNOLOGIES CO., LTD
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8. LOCATION
SEKWANG TECHNOLOGIES CO., LTD
13p