Moldex3D Technology Update: Design Innovation Solvers

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Transcript Moldex3D Technology Update: Design Innovation Solvers

Advanced Hot Runner Setting
Moldex3D_TIPs_20150401
Apr, 1st, 2015
Main Features of Advanced Hot Runner (AHR) Module
> All hot runner component supported
Valve pin design
– Hot Runner Metal
• Bushing, manifold, nozzle, valve pin…
– Heating System
• Heating rod/coil, sensor…
– Boundary Conduction
• Insulating air gap, heat conduction face…
Hot runner metal
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Heat conduction face
Heating rod/coil
Hot Runner Metal Component – Moldex3D Mesh
> To attribute Hot Runner Metal component in Moldex3D-Mesh
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Hot Runner Metal Component – Designer
> To attribute Hot Runner Metal component in Designer
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Heat Conduction Faces
- Heat conduction face : Heat conduction face is the conductible interface between hot runner metal
and mold base (mold insert).
- Insulating air gap : The condition will be insulation without heat conduction face setting between hot
runner metal and mold base (mold insert).
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Heat Conduction Faces – Moldex3D Mesh
> To assign Heat Conduction Faces in Moldex3D Mesh
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Heat Conduction Faces – Designer
> To assign Heat Conduction Faces in Designer
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Heating System
Heating Rod
Sensor
 Each heating rod can be assigned a sensor node control in process setting
 Once heating rod (or cooling channel) contacts with hot runner metal, it will be considered that part
of hot runner metal (within insulating air gap)
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Computation Parameter
How to activate Air Gap Boundary
> In Cool computation parameter tab, enable
“Apply air gap boundary condition on hot
runner metal”
> Default air gap boundary is ideal heat insulation
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Heat Transfer Coefficient of Air Gap
> Heat transfer coefficient of air gap can be
adjusted in Filling/Packing Advanced
Setting.
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Air Gap Boundary Condition
> Air gap boundary will be assigned on contact face between Hot runner metal and Mold
base (Mold insert)
> Once heating rod (or cooling channel) contacts with hot runner metal, it will be
considered that part of hot runner metal (within insulating air gap)
Heat dissipation from conduction face
Conduction
face
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Air gap B.C.
Appendix 1
> Relation between HTC and thickness of air gap (thickness 0.5 cm ~ 25 cm)
HTC
8
7
HTC(W/m^2.K)
6
5
4
HTC
3
2
1
0
0
12
5
10
15
Thickness (cm)
20
25
Appendix 2
> Relation between HTC and thickness of air gap (thickness 0.02 cm ~ 0.5 cm)
HTC
250
HTC(W/m^2.K)
200
150
HTC
100
50
0
0
13
0.1
0.2
0.3
Thickness (cm)
0.4
0.5
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