Transcript ALICE - Niels Bohr Institute

Si-FMD status
Forward Detector meeting,
CERN, 11 March 2003
Børge Svane Nielsen
Niels Bohr Institute
1.
2.
3.
4.
5.
Geometry of Si-FMD
Material constants
Electronics strategy
Cables and DCS
Heat dissipation and cooling
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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FWD detectors layout
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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Si1, T0_r & V0_r layout
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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FMD ring layout
Full FMD =
3 inner rings +
2 outer rings
256
Inner:
Rin=4.2 cm
Rout=17.2 cm
Outer:
Rin=15.4 cm
512
Rout=28.4 cm
20x2x256=10,240
10x2x512=10,240
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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Si1 mechanics model 1:1
Outer ring still missing
Beam pipe support ring
Si detectors
Support plate
Digitizer card
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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Si2 layout
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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Si3, T0_l & V0_l layout
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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Si1 assembly
Connector(s) for
power, control, read-out
Si detectors
Hybrid
Read-out electronics card
on support plate back side
Support plates
Si detector
Forward Detector Meeting, 11 Mar 2003
VA1’’ preamp+shaper: 128 ch
Børge Svane Nielsen, NBI
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Material constants
Material type and thickness of one Si detector ring:
Layer
Material
Thickness
Heat
conductivity
(W/m·K)
Silicon
detector
Si
0.3 mm
84
2330
678
Hybrid
Al2O3
0.5 mm
35
3970
880
FE
electronics
air + chips
10 mm
(mostly air)
Support
Carbon fibre
or aluminium
honeycomb
20.5 mm C or Al
+ 10 mm air
C: 24
Al: 222
C: 2200
Al: 2700
C: 691
Al: 900
Forward Detector Meeting, 11 Mar 2003
Density
(kg/m3)
Specific
heat
(J/kgK)
Børge Svane Nielsen, NBI
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Material constants
Material type and thickness of one Si detector ring:
Layer
Material
Thickness
Interaction
length
Radiation
length
Silicon
detector
Si
0.3 mm
0.6 · 10-3
0.3 · 10-2
Hybrid
Al2O3
0.5 mm
2.0 · 10-3
1.0 · 10-2
FE
electronics
air + chips
10 mm
(mostly air)
Support
Carbon fibre
or aluminium
honeycomb
20.5 mm C or Al
+ 10 mm air
Total thickness of one Si ring:
Forward Detector Meeting, 11 Mar 2003
C:
Al:
10-3
C: 2.6 ·
Al: 2.5 · 10-3
5.2 · 10-3 I
5.1 · 10-3 I
C: 0.5 · 10-2
Al: 1.1 · 102
1.8 · 10-2 X0
2.4 · 10-2 X0
Børge Svane Nielsen, NBI
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Read-Out strategy
FMD Read-Out and Control Electronics
ON DETECTOR
IN
COUNTING
ROOM
IN CAVERN
FMD Segment
Analog serial link
(10 MHz)
 0.5 m
FMD Digitizer
Detector
Data Link
(50-60 m)
FMD RCU
CTRL
DDL - INT
ALTRO
Digital serial
links
(15-20 m)
CTRL
ALTRO
CTRL
BOARD
CTRL
TTC-RX
Slow-Control
Interface
ALTRO
Local
Controller
Data
receiver
Read-out CTRL
VA
VA read-out
control
1 ring: 10/20 segments
Full FMD: 70 segments
Slow control
& Trigger
Trigger &
Slow Ctrl
2 Digitizers
10 Digitizers
1 RCU per side
2 RCU’s
1 DDL per side
2 DDL’s
BSN, 21 Nov 2002
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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FEE test setup (1)
FMD FEE test
Ext trigger
ALTRO tester
CTRL
Ext clock
ALTRO
Power
Biases
Si
detector
Clock
10 MHz
VA
CTRL
Trig in
BSN, 21 Nov 2002
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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FEE test setup (2)
Si-strip detector
+ VA’’ preamp
VA’’ read-out controller
ALTRO tester
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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FMD electronics
FMD channel count
Segments
(wafers)
Phi
sectors
Radial
strips
FE
channels
VA chips
(128 ch/chip)
ALTRO
chips
FMD
Digitizers
FMD
RCU
Si1 inner
10
20
512
10,240
80
6
2
1
Si1 outer
20
40
256
10,240
80
6
2
Si2 inner
10
20
512
10,240
80
6
2
Si2 outer
20
40
256
10,240
80
6
2
Si3
10
20
512
10,240
80
6
2
Total
system
70
140
51,200
400
30
10
Note:
1
2
We have increased the number of strips,
use more integrated FE chips with dynamic range 0-20 mips
– red values are changed.
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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FMD
28/02/03
Control room
(ACR)
[FSM?]
Database(s)
PVSS II
PVSSFMD
II DCS
OPC
client
PVSS II
DIM
client
User interface
Ethernet
PVSS II
PVSS
C II
OPS client
OPC client
OPC client
CAEN OPCserver
CAEN OPCserver
DIMserver
?
PCI-CAN?
PCI-CAN?
PCI-Profibus
PCI-CAN?
E
E
P
Counting room
PVSS II
C
2
DCS
Ethernet is
considered as
alternative
1
CAEN ?
DDL
CAEN ?
1
FMD-RCU
Cavern
2
TTC
(PCI? VME?)
P?
70
LV
140
LV
10
20
300?
10
Detector
Preamps
FMD
Digitizers
High Voltage
Preamps
Digitizers
15
Crate Control
Inside magnet
HV
LVL0
trig
Heat dissipation
Heat dissipated by FE electronics of one Si detector ring:
VA1’’ preamp chip (128 channels): 235 mW
 80 chips = 19 W / ring
Read-out electronics and power distribution:  5 W / ring
Cooling: air flow between Si detector and support plate
radiation from VA chips to support plate
active (water) cooling of support plate?
Forward Detector Meeting, 11 Mar 2003
Børge Svane Nielsen, NBI
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Si-FMD timetable
A
FRONT END (FE) READ OUT ELECTRONICS
Completed
1
Demonstrate functionality of conceptual layout of FEE
(Viking PA chip, control system, interface to ALTRO test board)
April 1 2003
2
Final choice of VA pre-ampl. chip. RO test
June 1, 2003
3
Test FEE system coupled to sample Si detector. Source and electron beam tests.
June 1, 2003
4
Design, construction and test of prototype FMD digitizer card (FMDD), RO test with
’mini’ FMD-RCU
October 1,
2003
5
Full Si detector element + electronics chain RO with realistic RCU and DDL link to DAQ.
June 1 , 2004
B
MECHANICS AND INTEGRATION
Completed
1
Full scale model manufactured (Si1)
Feb 1, 2003
2
Cabling and Cooling issues resolved
April 1, 2003
3
Full integration sequence decided
June 1, 2003
C.
SILICON DETECTOR
Completed by
1
Complete market survey
Feb 1, 2003
2
3
4
Define final specs
Place order for prototype with industry
Delivery Si-wafer prototype
Mar 1, 2003
April 1, 2003
June 1, 2003
5
Start production of Si-hybrid FEE card
June 1, 2003
6
Delivery prototype hybrid
Aug 1, 2003
7
Si prototype test with FEE and BEE test RO setup
Forward Detector Meeting, 11 Mar 2003
8
Place final order for Si with industry
Dec 1, 2003
Børge Svane Nielsen, NBI
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April1, 2004