N25Q SPI Flash Packages for Ultrathin PCs November 2012

©2012 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

April 29, 2020 | ©2012 Micron Technology, Inc. |

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Package Types

Package

DFN 5x6 DFN 6x8 SOP8W (208 mils)

Lead Count

8 8 8

Lead Pitch (mm)

1.27

Package Size (mm)

5 x 6 x 1.0

1.27

1.27

6 x 8 x 1.0

7.90 x 5.28 x2.5

Micron PC-grade products parts offer the best available package solutions for PCB layout optimization April 29, 2020 | ©2012 Micron Technology, Inc. |

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DFN 5x6 DFN 6x8 SOP8W

Available Memory Sizes

32Mb 64Mb 128Mb

April 29, 2020 | ©2012 Micron Technology, Inc. |

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Suggested Land Pattern

▶ ▶ ▶ ▶ Land Pattern: Combinations of lands used to mount a particular component Courtyard: Small rectangular area that provides a minimum electrical and mechanical clearance around the combined component and land pattern boundaries Silkscreen: Printed area of where the component will be placed, with related orientation indicator Assembly: Maximum area allowed for component mounting on PCB Land pattern design based on IPC-7351B standard April 29, 2020 ©2012 Micron Technology, Inc. |

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Land Pad Design Recommendations

SOP8W Packages Land Pattern Courtyard Silkscreen

R1

Assembly

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DFN Packages

| ©2012 Micron Technology, Inc. |

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SOP8W (208 mils)

LAND PATTERN C Y 7.5

1.7

X 0.6

SILKSCREEN R1 R2 5.15

6 ASSEMBLY A

nom

B

nom

5.62

5.95

COURTYARD V1 9.4

V2 6.3

| ©2012 Micron Technology, Inc. |

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DFN 6x8

LAND PATTERN C Y1 7.8

0.8

X Y2 0.45

0.8

SILKSCREEN R1 8 R2 6 ASSEMBLY A

nom

B

nom

8.8

6.4

COURTYARD V1 V2 9.3

6.7

| ©2012 Micron Technology, Inc. |

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DFN 5x6 Punched (32Mb, 64Mb)

C Y1 X Y2 R1 R2 A

nom

B

nom

V1 V2 LAND PATTERN 5.5

1.05

0.45

1.05

SILKSCREEN 3.8

5 ASSEMBLY 6 5 COURTYARD 6.8

5.4

| ©2012 Micron Technology, Inc. |

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DFN 5x6 Sawn (128Mb)

C LAND PATTERN 5.7

Y1 X 0.95

0.45

Y2 0.95

SILKSCREEN R1 R2 4.1

5 A

nom

ASSEMBLY 6 B

nom

5 COURTYARD V1 V2 6.9

5.4

| ©2012 Micron Technology, Inc. |

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April 29, 2020

SOP8W and DFN 6x8 Land Pattern Compatibility

▶ The DFN 6x8 and SOP8W have similar overall footprints; both packages fit in the same area on the PCB.

▶ Dashed areas in the bottom figure indicate the matching footprint areas for the DFN 6x8 and the SOP8W.

SOP8W DFN 6x8 April 29, 2020 | ©2012 Micron Technology, Inc. |

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▶ ▶

SOP8W and DFN 6x8 Land Pattern Compatibility

All dimensions for the DFN 6x8, particularly its pads, are smaller than the corresponding maximum dimensions for the SOP8W package. If the PCB is designed according to the DFN land pattern dimensions, it’s possible that the board might accept either package. (It’s up to the designer to verify that this is the case.) Another difference between the packages is that the DFN has a central conductive pad. Although this does not require a physical, solder connection, it’s recommended that the PCB tracks do not run below the DFN package because they may short-circuit to the central pad.

Notes: 1. The left-hand illustration shows a PCB layout with tracks running below the package, which is only allowed on the SOP8W and cannot be used with the DFN.

2. The right-hand illustration shows a PCB topology that could be used for either the SOP8W or the DFN.

©2012 Micron Technology, Inc. |

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