Transcript Don Beaty (DLB Associates) Chair ASHRAE TC 9.9

ASHRAE Technical Committee TC 9.9
(Mission Critical Facilities, Technology Spaces, & Electronic Equipment / Systems)
www.tc99.ashraetcs.org
Slide 1
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Different World’s of IT & Facilities
Datacom Equipment (IT) – 2 to 5 years
Building Cooling System – 10 to 25 years
5 x (2 to 5 years) = 10 to 25 years
Mismatch in refresh rate – multiple refreshes of datacom
equipment during the lifecycle of a building cooling system
Building Industry pressured by concerns about;
Over-design, Under-design, Stranded capacity
Ashrae Applications Handbook
• Chapter 36 – Owning & Operating Cost
• Table 3 Service Life – 10 to 35 years
Slide 2
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Bottomline

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2 Years in the IT industry can be a lifetime (full life
cycle)
TC 9.9 must always consider that although 2 years
borders on being a blip in the Institutional World, it is
very significant in the IT World.
The industry is in dire needs of the information now; 2
years from now is a lifetime!!!
We must manage our resources & use all practical
expediting means to publish unbiased material quickly
Slide 3
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The Challenge – Macro – Micro / Full Range
Relative Scale Comparison – Rack to Room
Assume a Rack at 5 to 10 square feet
Assume a Room at 5,000 to 10,000 square feet
Relative scale difference is 1,000 to 1
Slide 4
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ASHRAE Overview
1. ASHRAE (formed 1894) is non profit technical society; specializes in cooling.
2. ASHRAE has over 50,000 members & 2,000 technical committee members
3. ASHRAE focuses on maintaining an unbiased role within the industry
4. ASHRAE actively writes standards, guidelines, model codes, etc.
5. ASHRAE has over 100 standards / guidelines, almost 100 technical
committees.
Ice Cooled System
(Circa 1890)
General Electric Room Cooler
(Circa 1932)
Slide 5
Computer Room Air Conditioner
(Circa 1970)
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ASHRAE - What is Commercialism?

Commercialism is inclusion of visual, written, or verbal references to
ANY ORGANIZATION for the promotion or commercial advantage of that
organization or the commercial disadvantage of a competing organization.

What is not allowed:
 References to companies, universities, consulting firms, contracting
agencies, research agencies, government agencies & governmentsponsored agencies
 Inclusions of tradenames, names of software, logos or other readily
recognized identifiers related to the HVAC&R industry
 Inference that ASHRAE approves or endorses any product, software or
system for any reason, even if the product, software or system complies
with an ASHRAE standard.
 Copies of papers or portions, or other information SHALL NOT be made
available at ASHRAE technical sessions, symposia, seminars, or forums.
Slide 6
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ASHRAE – Commercialism

Pipe Manufacturer – related to HVAC
industry
 Cover it up

Computer manufacturer logos. Is it a
company related to HVAC industry?
 If so, cover it up.
 If not, cover it up.
– could leave it if covering up is
too difficult
Slide 7
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What’s an ASHRAE Technical Committee (TC)?

A group of volunteers who provide the Society with expertise in a
specific field or subject (Manufacturers, Consultants, Researchers,
Universities, Utilities, Regulators, Contractors, and Government).

Participate in 5 Areas
 Standards
 Handbooks
 Program
 Technical Activities
 Review technical papers submitted to the Society

Advise Society on technical matters related to the TC’s expertise.
Slide 8
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ASHRAE Website - Overview
www.ashrae.org
Slide 9
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Overview of ASHRAE – Technical Committee TC9.9
Title:
Mission Critical Facilities, Technology Spaces, & Electronic Equipment
Mission Statement
To be recognized amongst all areas of the datacom industry as the unbiased
engineering leader in HVAC & an effective provider of technical datacom
information.
Scope
All datacom facilities:
datacom stands for data processing &
communication facilities.
It includes rooms or closets used for
communication, computers, or electronic equipment.
Slide 10
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ASHRAE TC 9.9 - Membership

Producer of Datacom Equipment
(manufacturers of computer hardware, HVAC
equipment, software vendors, etc)

User of Datacom Equipment
(facility owners, operators, managers, etc)

General Interest
(government agencies, utilities, consultants, academia,
testing laboratories, etc.)
Slide 11
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ASHRAE TC 9.9 - Representatives
Category
Total Number
Producer of Datacom (IT) Equipment
59
End User of Datacom (IT) Equipment
32
General Interest (consultants, agencies, etc)
26
International Representatives (8)
Slide 12
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TC 9.9 Website
www.tc99.ashraetcs.org
Slide 13
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TC 9.9 History / Milestones - Overview

Year 2001 – Requested permission to form a new Ashrae
Technical Group (TG)

Year 2002 – TG 9 HDEC starts

Year 2003 – TG 9 HDEC becomes TC 9.9

Year 2004 – First book, first symposium, transferred to
Ashrae Website, & handbook chapter rewritten

Year 2005 – Second book, major membership expansion, &
industry needs survey

Year 2006 – Third book, focus on international membership,
address industry needs survey topics, seventh symposium,
third forum
Slide 14
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TC 9.9 History / Milestones – 2001 & 2002
Year – 2001

Title & Scope for new Technical Group is submitted to
Ashrae

Title: High Density Electronic Equipment Facility Cooling

Scope: To access, develop and maintain guidelines on
cooling high density loads such as 100 watts / s.f. or greater.
Year – 2002

January Ashrae approves formation of Technical Group TG
9 HDEC

June first TG 9 HDEC Meeting held (Hawaii)
Slide 15
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TC 9.9 History / Milestones – 2003

Created committee website (private web site since Ashrae
hosted web site was not yet available)

June – first TG 9 HDEC / TC 9.9 sponsored seminar
(Kansas)

June – approved to become a TC (promoted from temporary
status of TG to permanent status of TC)
 Title: Mission Critical Facilities, Technology Spaces, &
Electronic Equipment
 Scope: All datacom facilities (datacom stands for data
processing & communication facilities). It includes rooms
or closets used for communication, computers, or electronic
equipment.
December – first Journal Article published

Slide 16
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TC 9.9 History / Milestones – 2004

January – transferred TC 9.9’s privately hosted website to
Ashrae

January – first TC 9.9 sponsored Symposium (Anaheim)

January – first meeting with other interested organizations
(7x24, TIA, BICSI, Uptime, LBNL, Critical Facilities Roundtable)

January – first special publications book published (Thermal
Guidelines for Data Processing Environments)

January – first press release

January – TC 9.9 Mission Statement
 To be recognized amongst all areas of the datacom industry as
the unbiased engineering leader in HVAC & an effective
provider of technical datacom information.
Slide 17
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TC 9.9 History / Milestones – 2004 cont.

Spring – completely rewrote Applications Handbook
Chapter 17 & submitted to Ashrae

June – second TC 9.9 sponsored Symposium (Nashville)

June – publishing of monthly report on TC 9.9 Website
starts

July – first Insights Article published (warning about
Handbook Chapter 17 being dated)

Fall – first course presented based on TC 9.9 published
material (7 by 24 Exchange Conference)

December – second Journal Article published
Slide 18
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TC 9.9 History / Milestones – 2005

January – second special publications book published
(Datacom Equipment Power Trends & Cooling Applications)

January – second press release

February – third TC 9.9 sponsored Symposium (Orlando)

February – first TC 9.9 sponsored Forum (Orlando)

February – submit request to create a new Standards
Committee for 127 (CRAC units) to rewrite the standard

April – first Journal publication with multiple articles from
TC 9.9 (4 articles in the same issue)
Slide 19
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TC 9.9 History / Milestones – 2005 cont.

June – major expansion of roster including increased focus
on end users & consultants

June - fourth TC 9.9 sponsored Symposium (Denver)

June – first TC 9.9 co-sponsored Symposium (TC 7.9
Commissioning)

Summer – Data Center Dynamics (conferences) includes link
to TC 9.9 website

Summer – first Handbook CD published that includes the
work of TC 9.9

December – seventh Journal Article published
Slide 20
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TC 9.9 History / Milestones – 2006

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January – Data Center Journal (online publication)
includes link to TC 9.9 website
January – sixth TC 9.9 sponsored Symposium
(Chicago)
January – third book published (Design
Considerations for Datacom Equipment Centers)
Slide 21
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ASHRAE Handbook Series
ASHRAE Handbook Series is the backbone resource of the HVAC Industry
Slide 22
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TC 9.9 Datacom Book Series
1)
Thermal Guidelines for Data Processing Environments
(published 2004)
2)
Datacom Equipment Power Trends & Cooling Applications
(published 2005)
3)
Design Considerations for Datacom Equipment Centers
(published 2006)
4)
Liquid Cooling Design Considerations for Datacom Equipment
Centers (not yet published)
5)
High Density Data Centers – Case Studies & Other Considerations
(not yet published)
6)
Datacom Energy Considerations & Total Cost of Ownership
(not yet published)
Slide 23
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Thermal Guidelines Book – Overview
Chapter 1 – Introduction
Chapter 2 – Equipment Environment
Specifications
Chapter 3 –Environmental Measurement
Chapter 4 – Equipment Placement &
Airflow Patterns
Chapter 5 – Equipment Manufacturer’s
Heat & Airflow Reporting
People from these firms participated:
ANCIS, APC, Ceyba, Cisco, CRS, Cray, DataAire, Dell, DLB, Echelon, EMC,
Engineered Refrigeration Sys, Flomercs Inc, Fujitsu, Hellmer Medved Engineers,
Hitachi, HP, IBM, Innovative Research, Intel, LBNL Labs, Liebert, Lucent, Mallory
& Evans, Motorola, NCR, Sun, Telecordia, Unisys, Uptime Institute
Slide 24
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Thermal Guidelines Book – Equipment Environmental
Classifications
ASHRAE Thermal Guidelines for Data Processing Environments
Equipment Environment - Class Requirements
Class
Air Conditioning
Environmental Control
Example
1
Yes
Tight
Servers & storage products
2
Yes
Loose
Servers & storage products
3
Yes
No
Workstations, PCs, &
printers
4
No
No
Point of sales equipment
Courtesy of Ashrae
Slide 25
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Environmental Conditions
ASHRAE Thermal Guidelines for Data Processing Environments
Table 2.1 Equipment Environment Specifications
Class
Allowable
Dry Bulb
(°C)
Recommended
Dry Bulb (°C)
Allowable
% Relative
Humidity
Recommended
% Relative
Humidity
1
15 to 32
20 to 25
20 – 80
40 - 55
2
10 to 35
20 to 80
20 – 80
40 - 55
3
5 to 35
NA
8 - 80
NA
4
5 to 40
NA
8 - 80
NA
Max. altitude = 10,000 feet with dry bulb de-rating applied in some cases.
Courtesy of Ashrae
Slide 26
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Datacom Equipment Power Trends & Cooling Applications

Chapter 1 – Introduction

Chapter 2 – Background

Chapter 3 – Load Trends & their Applications

Chapter 4 – Air Cooling.

Chapter 5 – Liquid Cooling.

Appendices include – Collection of Terms; Additional Trend Chart, Information
/ Data; Electronics, Semiconductors, Microprocessors, ITRS; Micro Macro
Overview of Datacom, Equipment Packaging

People from these firms participated – Alcatel, ANCIS, ATI, Cisco, Cray,
DataAire, Dell, DOD, DLB, EMC, EYP, Fanniemae, Freescale, Fujitsu, Hellmer
Medved Engineers, HP, IBM, Intel, LBNL Labs, Liebert, Mallory & Evans,
Motorola, Nortel, Sun, Syska & Hennesey, Taylor Engineering, Uptime Institute
©2005 ASHRAE TC9.9
Slide 27
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Power Trends Book – Old Trend Chart (Uptime Institute 2000)
Original 15 members included:
Amdahl, Cisco, Compaq, Cray, Dell,
EMC, HP, IBM, Intel, Lucent, Motorola,
Nokia, Nortel, Sun, Unisys
MAJOR IT EQUIP. MANUFACTURERS
Equipment manufacturers recognized the need for more tangible trend info
(equipment vs. chip loads), formed the “Thermal Management Consortium”.
1.Consortium prepared the trend chart & Uptime Institute published it.
2.Trend chart was widely quoted BUT seldom understood or applied.
3.Measured load remained below projections (created doubt)
Slide 28
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Power Trends Book –The Uptime Institute
2000 Published Trend Chart)
Amdahl
Cisco
Compaq
Cray
Dell
EMC
HP
IBM
Intel
Lucent
Motorola
Nokia
Nortel
Sun
Unisys
Slide 29
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Overview of ASHRAE – Overview of “Data Considerations”
Part 1 Datacom Facility Basics
Chapter 1 Introduction; Chapter 2 Design Criteria; Chapter 3
HVAC Load Considerations; Chapter 4 Computer Room
Cooling Overview; Chapter 5 Air Distribution; Chapter 6
Liquid Cooling
Part 2 Other Considerations
Chapter 7 Ancillary Spaces; Chapter 8 Contamination;
Chapter 9 Acoustical Noise Emissions; Chapter 10
Structural & Seismic; Chapter 11 Fire Detection &
Suppression; Chapter 12 Commissioning; Chapter 13
Availability & Redundancy; Chapter 14 Energy Efficiency
ANCIS, APC, Bell South, Citigroup, Data Aire, Dell, DOD, DLB, EDS,
EYP, Fannie Mae, Fluent, Fujitsu, Heapy Engineering, HP, IBM, Intel,
LBNL, Liebert, Mallory & Evans, Nelson Acoustical, Nortel, Rice
University, Stulz, Sun, Syska & Hennessy, Tier 4 Consulting, Wright Line
Slide 30
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Datacom Book Series
The first 3 books provide core information that is usable
to technical and nontechnical readers

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Funding & Appropriation Requests
Conceptual Design
Design & Construction
Operation
Slide 31
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TC 9.9 Ashrae Papers & Presentations - Overview
Seminar (June 2003)
Data Center & Telecommunication Room Cooling of High
Density Heat Loads (5 presentations)
Symposium (January 2004)
High Density Electronic Equipment Facility Cooling (4 papers)
Forum (January 2004)
High Density Heat Loads in Data Centers &
Telecommunications Facilities
Symposium (June 2004)
High Density Cooling Loads Update June 2004 (3 papers)
Symposium (February 2005)
High Density Cooling Loads Update January 2005 (3 papers)
Forum (February 2005)
Thermal Guidelines - One Year Later: Has it worked for you,
& what else is needed?
Symposium (June 2005)
High-Tech Facility Commissioning (4 papers)
Symposium (June 2005)
High Density Cooling Loads Update June 2005 (6 papers)
Seminar (June 2005)
Datacom Cooling: Equipment & Facility Perspective (5
presentations)
Symposium (January 2006)
High Density Cooling Loads Update January 2006 (3 papers)
Forum (January 2006)
Mission Critical Facilities: Issues & Roadmap
Slide 32
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TC 9.9 Ashrae Papers & Presentations
Session
Paper / Presentation
Seminar (June 2003)
Magnus Herrlin
GR-3028-CORE: Thermal Management in telecommunications Offices
Roger Schmidt
Data Center Environmental Requirements
Christian Belady
Data Center Air Cooling Guidelines
Allen Buskirk
Measuring and Reporting Computing equipment Heat Loads
Donald Beaty
Best Practices in Data Center and Telecom Room Design
Roger Schmidt, et. al.
Evolution of Data Center Environmental Guidelines
Michael Wilson, et. al.
A Thermal Bus System for Cooling Electronic Components in High
Density Cabinets
Lennart Stahl
Cooling of high heat density rooms today and in the future
Cullen Bash, C. Patel, R.
Sharma
Efficient Thermal Management of Data Centers - Immediate and Longterm Research Needs
Forum (January 2004)
Donald Beaty
High Density Heat Loads in Data Centers and Telecommunications
Facilities
Symposium (June 2004)
Suhas Patankar
Distribution of Cooling Airflow in a Raised-Floor Data Center
Roger Schmidt
Thermal Profile of a High Density Data Center
Donald Beaty
Liquid Cooling of Electronic Equipment: Friend or Foe
Symposium (January 2004)
Slide 33
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TC 9.9 Ashrae Papers & Presentations
Session
Paper / Presentation
Symposium (February 2005)
Neil Chauhan
High-Density Cooling of Data Centers and Telecom Facilities - Part 1
Dan Dyer
High-Density Cooling of Data Centers and Telecom Facilities - Part 2
under review
Thermal Roadmap for Telecom Equipment
Forum (February 2005)
Donald Beaty
Thermal Guidelines - One Year Later: Has it worked for you, and what
else is needed?
Symposium (June 2005)
Charles Kieffer
Commissioning of Bio-Containment Facilities
Don Beaty, Roger Schmidt
Commissioning combined with CFD for Datacom Performance,
Adaptability & Reliability
William McCartney
Electronic Test Room Commissioning
Terry L. Rodgers
An Owner’s Perspective on Commissioning of Critical Facilities
Symposium (June 2005)
Christopher Kurkjian, Jack Air Conditioning Design for Data Centers – Accommodating Current
Glass
Loads and Planning for the Future
Magnus Herrlin
Rack Cooling Effectiveness in Data Centers and Telecom Central
Offices: The Rack Cooling Index (RCI)
Paul Leonard & Fred
Phillips
The Thermal Bus Opportunity: A Quantum Leap in Data Center Cooling
Potential
Yumi Maeda, Seshimo
Study of a Cooling System for the Telecommunication Base Site
Yu, and Takashi Okazaki
Vali Sorell, Steve
Escalante, and Jun Yang
A Comparison of Underfloor and Above-floor Air Delivery Systems in a
Data Center Environment Using CFD Modeling
Roger Schmidt
Thermal Profile of a High Density Data Center -Hot Spot Heat Fluxes of
512 watts/ft2
Slide 34
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TC 9.9 Ashrae Papers & Presentations
Session
Paper / Presentation
Seminar (June 2005)
Christian Belady
Equipment Perspective: Part 1
Roger Schmidt
Equipment Perspective: Part 2
Robin Steinbrecher
Equipment Perspective: Part 3
Donald Beaty
Facilities Perspective: Part 1
Christopher Kurkjian
Facilities Perspective: Part 2
Forum (January 2006)
Donald Beaty
Mission Critical Facilities: Issues and Roadmap
Symposium (January 2006)
Joe Prisco
Contamination Sources and Prevention in Data Processing
Environments
Vali Sorell
An Analysis of the Effects of Ceiling Height on Air Distribution in Data
Centers
Budy D. Notohardjono
Seismic Considerations of Datacom Equipment
Slide 35
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