Transcript physics.ucr.edu

Endcap Muons
John Layter
US CMS Collaboration Meeting
May 19, 2001
US CMS Collaboration Meeting, UC Riverside, May 19, 2001
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Outline
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Muon System Overview
CSC Production
FAST Sites
Electronics Progress
Integration and Installation
CPA, ETC
Plans for the next six months
Summary
US CMS Collaboration Meeting, UC Riverside, May 19, 2001
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CMS Endcap Muon System
360 CSCs, not counting ME1/1 and ME4
•144 Large CSCs (3.4x1.5 m2):
72 ME2/2 chambers
72 ME3/2 chambers
•Small CSCs (1.8x1.1 m2):
72 ME1/2 chambers
72 ME1/3 chambers
•20o CSCs (1.9x1.5 m2):
36 ME2/1 chambers
36 ME3/1 chambers
•Frontend Electronics:
•170K Cathode channels
140K Anode channels
•Trigger&DAQ
(on-chamber part)
•Alignment&Services
US CMS Collaboration Meeting, UC Riverside, May 19, 2001
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Endcap Muon System
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EMU - Yearly BCWS
FY01 is the second largest year of EMU funding:
• Production of chambers at Fermilab at nominal rate
• Purchasing of significant part of FE electronics
• Finalization of integration and installation design
EMU BCWS by Fiscal Year
9,000,000
8,000,000
7,000,000
6,000,000
5,000,000
4,000,000
3,000,000
2,000,000
1,000,000
0
FY96
FY97
FY98
FY99
US CMS Collaboration Meeting, UC Riverside, May 19, 2001
FY00
FY01
FY02
FY03
FY04
FY05
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EMU Chamber Status
Fermilab Site (Panels for 410 CSCs; Assembly of 148 Large CSCs):
• Panel production since 5/99; 52% of chambers done; on schedule
• CSC assembly since 6/00; 32/148 large CSCs done; ~2 wks late
UF and UC Sites (Final Assembly and System Tests of Large CSCs)
• First 5 CSCs arrived at UC and UF; long term HV test will start
• Begin mounting and testing electronics 9/01, ~3 mo. late
• Delivery of on-chamber electronics is on critical path
PNPI Site (114 smaller CSCs)
• Critical tooling commissioned; 2 chambers assembled
• PRR—June 7-8; start production in August
IHEP Site (148 smaller CSCs)
• Critical tooling arrived, being commissioned, begin assembly
• PRR—July 30-31; start production in September
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FNAL Factory Status Chamber
assembly at MP9
10/1/01
11/1/01
12/1/01
1/1/02
2/1/02
3/1/02
4/1/02
5/1/02
6/1/02
7/1/02
8/1/02
9/1/02
10/31/01
11/30/01
12/31/01
1/31/02
2/28/02
3/31/02
4/30/02
5/31/02
6/30/02
7/31/02
8/31/02
9/30/02
FY03 Summary
Grand Total
10/7/02
10/14/02
10/21/02
10/28/02
11/4/02
11/11/02
11/18/02
11/25/02
12/2/02
12/9/02
12/16/02
12/23/02
2
2
-
30
-
-
2
-
1
-
-
1
1
-
-
-
-
-
1
1
120
-
FY02
FY03
Goal = 148 Chambers
80
40
DONE
43
41
39
37
35
33
31
29
Shortage
27
0
-40
M onth in production
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-
FY01
25
-
-
-
-
-
-
1
-
1
1
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FY00
23
-
-
-
1
1
-
-
1
-
-
-
-
30
10/1/02
11/1/02
12/1/02
1/1/03
2/1/03
3/1/03
4/1/03
5/1/03
6/1/03
7/1/03
8/1/03
9/1/03
-
-
21
30
FY02 Summary
Grand Total
October
November
December
January
February
March
April
May
June
July
August
September
3
3
3
4
4
4
CSC Production at MP9(ME234/2)
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10/31/00
11/30/00
12/31/00
1/31/01
2/28/01
3/31/01
4/30/01
5/31/01
6/30/01
7/31/01
8/31/01
9/30/01
-
-
19
10/1/00
11/1/00
12/1/00
1/1/01
2/1/01
3/1/01
4/1/01
5/1/01
6/1/01
7/1/01
8/1/01
9/1/01
2
2
Total
ME4/1
-
17
2
1
2
2
9
9
FY01 Summary
Grand Total
October
November
December
January
February
March
April
May
June
July
August
September
-
-
FY00 Summary
Grand Total
October
November
December
January
February
March
April
May
June
July
August
September
1
1
1
1
Total
ME3/1
-
15
Total
ME1/3
-
13
Total
ME2/1
-
11
Total
ME1/2
9
Total
ME234/2
-
7
10/31/99
11/30/99
12/31/99
1/31/00
2/28/00
3/31/00
4/30/00
5/31/00
6/30/00
7/31/00
8/31/00
9/30/00
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To
3
10/1/99
11/1/99
12/1/99
1/1/00
2/1/00
3/1/00
4/1/00
5/1/00
6/1/00
7/1/00
8/1/00
9/1/00
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From
Number of Chambers
Week
October
November
December
January
February
March
April
May
June
July
August
September
• 32 large CSCs assembled by May
2001
• > 20% complete
• Production ~ at nominal rate
• ~ On schedule
US CMS Collaboration Meeting, UC Riverside, May 19, 2001
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Chamber Assembly
Gluing Station
(anode bars, gap bars are glued to panels)
Winding Station
Soldering Station
(wires are wound directly on panels)
(automated soldering of wires)
Wire Tension/Spacing Station
Ionized Air Knife Station
(tension and spacing of wires are checked)
(dust is removed from wires and panels)
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Assembly Station
(panels are stacked to make chamber)
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CSCs at UC FAST Site
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CSCs at UC FAST Site
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CSC Production at PNPI
Preproduction
Prototype (P3)
assembled at PNPI
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CSC production at IHEP
Critical tooling
received
Wire Tension measurement machine
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Functions of Electronics
Acquire precise muon data for offline
analysis
• Cathode strips: precise azimuthal position (in
bending plane) in each layer by interpolation
of induced strip charges.
• Anode wires: precise timing and coarse radial
position.
Generate primitives for Level 1 trigger
• Identify Local Charged Track (LCT) segments
using cathode and anode signals.
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Electronics System Layout
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Radiation Tolerance Tests
Measure Single Event Upset (SEU) and Total
Ionization Dosage (TID) effects with 63 MeV
proton beam at UC Davis.
Measure effects due to Displacement damage of
bipolar and biCMOS with 1MeV neutrons at OSU.
Results:
• Negligible degradation of analog performance due to
TID (>10kRad) or displacement (2x1012 cm-2 neutrons).
• No latch-ups observed up to p fluence of 2x1012 cm-2.
• SEUs in FPGAs observed and cross sections measured.
All SEUs recoverable by reloading FPGAs. SEU rate at
peak LHC luminosity manageable for CFEB, but higher
for ALCT.
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On-chamber Electronics I
Three out of four on-chamber boards
designed and tested:
• Cathode Front End Board (CFEB)
• Anode Front End Board (AFEB)
• Low Voltage Distribution Board (LVDB)
Most of the components for these boards
(excluding rad hard LV-regulators)
procured in quantities sufficient to start
production
Production costs at or below estimates
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On-chamber Electronics II
LV-regulators (CERN design, standard for
LHC experiments) are not available.
Will define the schedule of production
of CFEB and LVDB. On critical path
ALCT being redesigned using Xilinx
FPGA (faster reloading) to deal with
SEU problem. Preproduction boards to
be delivered by September 2001. On
critical path
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Status of On-chamber
Boards
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Off-chamber Electronics
Progress made on next round of
prototype boards and on VME custom
backplane.
Updated versions of the prototype
boards will be delivered to the FAST
sites during this summer.
These will be used for tests of massproduced on-chamber electronics
assembled with chambers.
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Integration & Installation
Infrastructure:
• Walkways
• Piping, cooling, cabling
• Chamber mounting
Installation:
• Fixture
• Strategy
• Schedule
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Mounting Detail
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Chamber Mounts
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Mounting Precision
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Integration and installation design
• EMU integration design
advanced (mechanical,
gas, cooling, power)
• Installation procedures
being defined
• Installation fixture
fully designed and built
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CSC installation fixture
Counterweight movement keeps balance w/ or w/o chamber
Chamber can rotate at any angle
Counterweight
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Chamber Production and
Installation Schedule (V31)
• CMS Schedule V31: Installation of all CSCs on the
surface at SX5, beginning in 2002.
• Very tight, advanced by ~1 year compared to V30.
Pressure on production and installation rate.
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EMU Critical Path Analysis - I
FY01: Delivery of on-chamber electronics is
on the critical path:
• ALCT Board redesign and start of
production
• Rad Hard Voltage regulators:  CFEB,
LVDB production
FY02: CSC assembly at FAST sites and
installation at CERN is on the critical path
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EMU Critical Path Analysis - II
FY03: CSC Installation (station ME3) is on
the critical path:
• short installation window (two shifts necessary)
FY04: CSC Installation (station ME1) is on
the critical path:
• RPCs must be installed before CSCs
• HE, EE, SE, ME1/1 cables should be installed
before CSCs
• Short installation windows (two shifts)
Available Slack analysis:
~25-30 working days in 2002. Very tight in 2003 –2004.
Need two shifts for production at IHEP and ME1/2,3
installation
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EMU – Estimate to Complete
EMU - ETC 18.9 AYM$
EDIA
(k$)
M&S
Mfg
Labor
(k$)
(k$)
EMU Estimate to Complete: 18.9 Actual Year M$
Dominated by M&S (mostly electronics)
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Plans for the Next 6 Months
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Continue CSC production at Fermilab.
Start production at PNPI and IHEP.
Continue FE electronics production.
Start electronics assembly and begin
chamber tests at FAST sites.
• Complete integration drawings for all
chamber types.
• Begin preparations for receiving and
installing chambers at CERN.
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Summary
• Nominal rate of chamber production at
FNAL achieved. Chamber production on
schedule.
• FE electronics production started; first
cost experience positive.
• LV-regulators and trigger boards on the
critical path; defines beginning of
assembly at FAST sites.
• Endcap infrastructure designed;
installation fixture exists.
• Adequate base program support is critical
to maintain the schedule.
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