Transcript Enlight Wafer Clean 343 and 324 as Post Ingot Saw Preclean

Product Selector
Interconnect Technologies
PWB
Jan 2014
PWB Product Selector
Innerlayer Manufacture
Surface
Prep
Photo
Resist
Image
Transfer
Develop
Etch
Film
Strip
Innerlayer
Bond
Outerlayer Manufacture
Drill
Deburr
Desmear
PTH
Photo
Resist
Image
Transfer
Develop
Final
Finish
Solder
Mask
Surface
Prep
Tin
Strip
Etch
Film
Strip
Plate
Cu & Sn
Dow EM
No
Dow EM
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Multilayer
DES & SES
Developers
Film Strippers
Resolve 9033
Surfacestrip 715
Surfacestrip 419
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Resolve 9033
Surfacestrip 419
Surfacestrip 715
Envirostrip 785
Antifoam 2750
Dowfax DF146 Antifoam
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EQC-1 Equipment Cleaner
Tin / Tin Lead Strippers
Ancillaries
Envirostrip 785
Antifoam 2750
Dowfax DF-146
EQC-1 Equipment Cleaner
High concentration potassium carbonate developer
Fast, clean Outerlayer stripper, 3-6% v.v
Lower cost stripper with higher caustic content than SS419
Nitric based tin stripper
Silicone based antifoam
Non silicone antifoam recommended for developer,
stripper and waste treatment applications
Equipment Cleaner for developer modules
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Innerlayer Bond
Black Oxide
Oxide
Alternative
Preclean
Spray Cleaner 742
Circuposit Etch 3330
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Acid spray cleaner
Mono Persulphate etch
Black Oxide
Probond 80
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Traditional black oxide
Oxide Reducer
PB Oxide Converter
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Oxide reducer, to eliminate pink ring
Preclean
Circubond Cleaner 140
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Alkaline cleaner to remove light oxides and chlorides
Predip
Circubond Predip 2217
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Acidic Predip
Etch
Circubond Treatment 2218
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Peroxide, sulphuric etch for enhanced structure and
peel strength
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Liquid Resist
Negative LPR
Positive LPR
Negative ED
Positive ED
Photoposit SN68H-3
Photoposit SP24
EAGLE 2100 ED
Photoresist
PEPR 2400
Photoresist
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Photoposit SN68H-3
Fast photo speed, developing & stripping. 8 - 10um thickness
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Photoposit SP24
Exceptional resolution & fine line capability. 5 - 6um thickness
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Eagle 2100 ED Photoresist
Negative working electrophoretic resist
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PEPR 2400 Photoresist
Positive working electrophoretic resist
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Inkjet
Etch Resist
Lithojet 210
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Lithojet 210
UV Cure able acrylic hybrid MP 65 – 72C
Print and Etch
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Making Holes Conductive
Desmear
PTH
Circuposit 3000-1
Solvent Swell
Hole Prep 3304
Hole Prep 4126
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Standard choice for most materials
New high performance sweller
Permanganate Etch
Promoter 3308
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Sodium permanganate concentrate
Neutraliser
Neutraliser 4190
Neutraliser 3314
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Non peroxide neutraliser. Contains conditioner
Stabilised peroxide neutraliser
Conditioner
Conditioner 3320A
Conditioner 3325
Conditioner 3323A
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Acidic, mild conditioner
Neutral – mild alkaline conditioner
Strong, alkaline conditioner
Microetch
Circuposit 3330
Circuposit 3336
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Mono Persulphate etch
Stabilised peroxide microetch
Catalyst
Circuposit Predip 3340
Circuposit Catalyst 3344
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Salt Predip for Catalyst 3344
Palladium Tin colloidal catalyst
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No accelerator required with C3000-1
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Universal electroless copper
Low build, high build, vertical or horizontal
Accelerator
Electroless Copper
Circuposit 3350-1
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Electroplate Copper
Cleaners
Electroposit PC Cleaner
Ronaclean PC-960
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General purpose acid cleaner
Easy to rinse, general purpose acid cleaner
DC Vertical
Copper Gleam HT-55
Electroposit 1400
Electroposit 1300
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High throw, excellent distribution DC Copper bath. CVS Control
Thick panel, low CD bath
Low cost Hull Cell control DC bath compatible with DM processes
DC Horizontal
Copper Gleam HS-200
Copper Gleam SB-H
Copper Glean HGX
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Bright, high CD horizontal DC bath
Matt, high CD horizontal bath
High levelling, low stress for flex
PPR Vertical
Copper Gleam CuPulse
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High performance vertical pulse bath
PPR Horizontal
Copper Gleam PPR-H
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High throw, high CD, horizontal pulse bath
Viafill
Microfill EVF
Microfill LVF-3
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DC Viafilling
Viafilling for HDI at low surface copper thickness
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Electroplate Tin / Tin-lead
Tin
Ronastan EC-1
Solderon PC-T
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Sulphuric acid based tin etch resist
MSA based tin etch resist
Tin Lead
Solderon PC
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MSA based tin lead etch resist
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Final Finish
ENEPIG
ENIG
Preclean
Ronaclean PC960
Electroposit PC Cleaner
Circuposit Etch 3330
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Catalyst
Ronamerse SMT CF
Aurolectroless SMT
Aurolectroless SMT-G
Aurolectroless SMT 525G
Nickel
Duraposit SMT 88
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Palladium
Gold
Pallamerse SMT 2000
Aurolectroless SMT
Aurolectroless SMT-G
Aurolectroless SMT 525G
Standard immersion gold
EDTA Free immersion gold
New EDTA free Low Gold (0.6g/l). Very dense gold offering major cost savings
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Final Finish
Electrolytic Nickel
Nikal PC-5
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Sulphate or sulphamate nickel
Electrolytic Gold
Ronovel CM-97
Ronovel N
Auronal BGA
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Cobalt hardened Gold
Nickel hardened Gold
Pure Gold
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