BSP 2007/142-722

“Business Support Programme for Bulgaria, Romania, Croatia and Turkey”

RoHS directive

10 th July 2008 Kwidzyn Poland

1

outline

•Legislative background •What is it about •Restricted elements and compunds •Exemptions •Testing methods •Summary

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Resolution of 25 January 1988 on a Community action programme to combat environmental pollution by cadmium

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Legislative background

 Directive 2002/95/EC of the European Parliament and of the Council 27 th January 2003 on the

r estriction o f the use of certain h azardous s

ubstances in electrical and electronic equipment

RoHS RoHS training, 10/07/08, Kwidzyn PL 4

WEEE and RoHS

W aste E lectrical and El ectronic E quipment WEEE

as set out in Directive 2002/96/EC of 27 January 2003 Reduce the load of electronic waste:  heavy metals  flame retardants

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Directive is not the same as state law of the EU member State. States have been given 18 moths for incorporating the law into their own RoHS training, 10/07/08, Kwidzyn PL 6

What is it about

    Approximate the laws of the Member States Contribute to the protection of human health Environmental Disposal of w aste el ectrical and e lectronic e quipment

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restricted elements compounds

   

Mercury Cadmium Lead Chromium



Fire retardants Hg Cd Pb Cr (VI) RoHS training, 10/07/08, Kwidzyn PL 8

restricted elements compounds



PBB (polybrominated biphenyls) Br (n) Br (n)



PBDE (polybrominated diphenyl ethers) O Br (m)



…will there be more RoHS training, 10/07/08, Kwidzyn PL Br (n) 9

concentration

Maximum concentration in homogeneous material 0,01% Cadmium 0,1% Mercury Lead Chromium (VI) PBB (polybrominated biphenyls) PBDE (polybrominated diphenyl ethers) 10 RoHS training, 10/07/08, Kwidzyn PL

Homogeneous material

Homogeneous material means a material that can not be mechanically disjointed into different materials.

PCB

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element (plastic cover chip, etc.) powder

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What equipment is covered

 electrical and electronic equipment falling under the categories 1, 2, 3, 4, 5, 6, 7 and 10 set out in Annex IA to Directive No 2002/96/EC (WEEE) and to electric light bulbs, and luminaires in households 

Devices that use electric current or electromagnetic field or generation, transfer, measure of such

not exceeding 1000 V AC 1500 V DC

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Link annex IA

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What equipment applies

1. Large household appliances 2. Small household appliances 3. IT and telecommunications equipment 4. Consumer equipment 5. Lighting equipment 6. Electrical and electronic tools (with the exception of 8… 9… large-scale stationary industrial tools) 7. Toys, leisure and sports equipment 10. Automatic dispensers Annex IA to Directive No 2002/96/EC (WEEE)

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WEEE

Annex IA (1)

1. Large household appliances

 Large cooling appliances  Refrigerators     Freezers Other large appliances used for refrigeration, conservation and storage of food Washing machines Clothes dryers             Dish washing machines Cooking Electric stoves Electric hot plates Microwaves Other large appliances used for cooking and other processing of food Electric heating appliances Electric radiators Other large appliances for heating rooms, beds, seating furniture Electric fans Air conditioner appliances Other fanning, exhaust ventilation and conditioning equipment

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What equipment applies

1. Large household appliances 2. Small household appliances 3. IT and telecommunications equipment 4. Consumer equipment 5. Lighting equipment 6. Electrical and electronic tools (with the exception of 8… 9… large-scale stationary industrial tools) 7. Toys, leisure and sports equipment 10. Automatic dispensers Annex IA to Directive No 2002/96/EC (WEEE)

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Producer:

   manufactures and sells electrical and electronic equipment under his own brand; resells under his own brand equipment produced by other suppliers, a reseller not being regarded as the ‘producer’ if the brand of the producer appears on the equipment, as provided for in; or imports or exports electrical and electronic equipment on a professional basis into a Member State.

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Entering into force from 1 July 2006 new electrical and electronic equipment put on market

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Exemptions

Does not apply to spare parts for the repair, or to the reuse, of electrical and electronic equipment put on the market before 1 July 2006

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Exemptions

Exemptions from the substitution requirement should be permitted if substitution is not possible from the scientific and technical point of view or if the negative environmental or health impacts caused by substitution are likely to outweigh the human and environmental benefits of the substitution

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Exemptions Hg

    Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.

Mercury in straight fluorescent lamps for general purposes not exceeding: — halophosphate 10 mg — triphosphate with normal lifetime 5 mg — triphosphate with long lifetime 8 mg Mercury in straight fluorescent lamps for special purposes.

Mercury in other lamps not specifically mentioned in this Annex.

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Exemtions Pb

   Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.

Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead),

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Exemtions Pb

   Lead in solders for servers, storage and storage array systems (exemption granted until 2010), Lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication, Lead in electronic ceramic parts (e.g. piezoelectronic devices).

 Lead in lead-bronze bearing shells and bushes (2005/717/EC)

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Exemption Pb

     Lead used in compliant pin connector systems 2005/747/EC Lead as a coating material for the thermal conduction module c-ring 2005/747/EC Lead and cadmium in optical and filter glass 2005/747/EC Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight 2005/747/EC Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages 2005/747/EC

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Exemption Pb

   Lead in linear incandescent lamps with silicate coated tubes 2006/310/EC Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications 2006/310/EC Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb) 2006/310/EC

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Exemption Pb

  Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliaryamalgam in very compact Energy Saving Lamps (ESL) 2006/310/EC Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD) 2006/310/EC  Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC; 2006/690/EC

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Exemptions Pb

    Lead and cadmium in printing inks for the application of enamels on borosilicate glass 2006/691/EC Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems 2006/691/EC Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames 2006/691/EC Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors 2006/691/EC

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Exemption Pb

   Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes 2006/691/EC Lead oxide in the glass envelope of Black Light Blue (BLB) lamps 2006/691/EC Lead alloys as solder for transducers used in high powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers 2006/691/EC

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Exemption Pb

  Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting 2008/385/EC Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes 2008/385/EC

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Exemption Cd

 Cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations  Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more 2008/385/EC

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Exemption Cr (VI)

 Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators  Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007 2006/692/EC

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Exemptions fire retardants

 DecaBDE in polymeric applications (2005/717/EC)

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Exemption

… 8. Medical equipment 9. Devices for control and monitoring …

Category 8 and 9 in Annex IA to Directive No 2002/96/EC (WEEE)

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evaluation

  Mercury in straight fluorescent lamps for special purposes, Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications (with a view to setting a specific time limit for this exemption)  Evaluation of exemptions every 4 years

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Occurrence of restricted chemicals

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Source: guide from Ministry of Economy

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Occurrence of restricted chemicals

Mercury Hg RoHS training, 10/07/08, Kwidzyn PL 35

Occurrence of restricted chemicals

PBB PBDE RoHS training, 10/07/08, Kwidzyn PL 36

Country

EU (incl. N, S)

RoHS like regulations

Entry date for

into force

Restricted

substances Product Scope 1.7.2006

Hg, Cd, Pb, CrVI,

PBB, PBDE defined product categories

USA / California

1.1.2007 Hg, Cd, Pb, CrVI only for larger displays, extension of the scope (beginning 2010) fallen through

China

1.3.2007 like EU RoHS

EIPs (substance bans only for selected EIPs) South Korea

1.7.2008 like EU RoHS

USA / New Jersey 1.2.2009 like EU RoHS+PVC RoHS training, 10/07/08, Kwidzyn PL all electronic products, automotive

electronics

only for larger displays and computers

Source:Jutta Muller IZM Fraunhofer

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Testing methods

Testing procedures IEC 62321

Procedures for the Determination of Levels of Regulated Substances in Electrotechnical Products

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Testing methods



Screening: XRF (X-ray Fluorescence)

    Non destructive Fast Needs reference material Calibration

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Testing methods



„Wet chemistry”

ICP-MS (Inductively Coupled Plasma Mass Spectrometry) ICP-OES (Inductively Coupled Plasma-Optical Emission Spectroscopy) CV-AAS (Cold Vapor Atomic Absorption Spectrometry) AAS (Atomic Absorption Spectrometry)    Destructive, digestion Time vs precision Calibration

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Testing procedure

LOD (Limit od Detection) = 3 s

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Further steps



March 2008 Oko Institute report



May 2008 stakeholders workshop



June 2008 Final version of report



October 2008 revision made by EC of RoHS RoHS training, 10/07/08, Kwidzyn PL 42

Pros & Cons

- Lead-free solders have a higher melting point

requiring higher process temperatures

- Lead-free solders are significantly harder, which

can increase the likelihood of cracks instead of plastic deformation, which is typical for lead containing solders

- Energy consumption - Costs to upgrade to technology standard

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Pros & Cons

+ Health benefits +Environment + Reliability concerns RoHS training, 10/07/08, Kwidzyn PL 44

Useful links

http://eur-lex.europa.eu/LexUriServ /LexUriServ.do?uri=CELEX:32002L0095:EN:NOT http://eur-lex.europa.eu/LexUriServ /LexUriServ.do?uri=CONSLEG:2002L0095:20061014:EN :PDF http://ec.europa.eu/environment/waste/weee/legis_en.

htm FAQ

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amendments

       2005/717/EC 2005/747/EC 2006/310/EC 2006/690/EC 2006/691/EC 2006/692/EC 2008/385/EC  … more to come

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