Transcript LPKF ProtoLaser U3 - Electronics For You Expo

LPKF Inhouse PCB Prototyping
LPKF Laser & Electronics AG
Osteriede 7
D-30827 Garbsen
Deutschland
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Tel.: +49-(0)5131-7095-0
Fax: +49-(0)5131-7095-90
[email protected] · www.lpkf.de
© 2009
LPKF Rapid PCB Prototyping
Dipl.-Ing. Angel Martínez
Sales Manager
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© 2009
LPKF Worldwide
Suhl Germany
Bejing China
Garbsen Germany
Detroit USA
Erlangen Germany
Tianjin China
Naklo Slovenia
Suzhou China
Tualatin (OR) USA
Chengdu China
Shanghai China
Tokyo Japan
Shenzhen China
Hong Kong China
Legend
Head office / production
Production
Sales subsidiary
Representation
„We work internationally and in partnership“
(from the LPKF corporate mission statement)
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© 2009
Core Skills
„Everything we do
aims at the
economical success
of our customers“
(from the LPKF
corporate mission
statement)
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Markets
Markets, Segments, Product Lines
Product Lines
Segments
Electronics
ProtoMats
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Rapid Prototyping
Cutting and Structuring
Lasers
ProtoLasers
PCB Production
Lasers
Accessories
StencilLasers
Laser
Direct
Structuring
(LDS)
Plastics
Photovoltaic
Joining
Technologies
Thin Film
Technologies
LaserPlasticWelding
Laser
Scribers
© 2010
LPKF Inhouse PCB prototyping
Why Inhouse prototyping?
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Fast:
Independent:
Environmentally friendly:
Flexible:
Secure:
No waiting time
No supplier
No chemicals
Lots of possibilities and different uses
Design data stays inhouse
© 2009
LPKF Inhouse PCB prototyping
Typical applications
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Digital and analog prototypes
Multilayer prototypes up to 8 layers
RF & Microwave prototypes
Flex- and rigid-flex prototypes
2½ D applications such as housings
Engraving and cutting of front panels
© 2009
LPKF Inhouse PCB prototyping
LPKF prototyping line
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Structuring
Multilayer
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Through-hole plating
SMT
assembling
PCB
© 2009
LPKF Inhouse PCB prototyping
LPKF ProtoMat series
Standard & RF prototyping by milling technology
Unmatched in:
• Speed
• Resolution
• Ease-of-use
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© 2009
LPKF Inhouse PCB prototyping
LPKF ProtoLaser
Direct structuring of printed circuit boards
• High speed laser structuring
• Rubout without substrate damage
• Fine lines
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© 2009
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© 2009
New Addition to the
LPKF ProtoLaser Family – U3
Structuring laminated materials
Insulation and ablation
of metal surfaces
Specification on
FR4-material
18µm CU (1/2 oz):
• Line/Space 70µm / 30µm
• Single Pad = 100µm
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© 2011
New Addition to the
LPKF ProtoLaser Family – U3
Structuring laminated materials
Structure Rogers materials
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© 2011
LPKF ProtoLaser U3 –
Applications
Processing with hatching
Structure Alumina
Structure ITO
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Opening solder resist
© 2011
LPKF ProtoLaser U3 –
Applications
Cutting & Drilling
Working process:
• Contour
max. 0,8 mm !!
ceramic
polyimide
LTCC
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© 2011
LPKF ProtoLaser U3 –
Applications
Cutting & Drilling
Working process:
• Contour
max. 0,8 mm !!
rigid-flex
Alumina
Microvias
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© 2011
Thank you for your attention!
LPKF Laser & Electronics AG · Osteriede 7 · 30827 Garbsen · www.lpkf.de
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© 2011