Etch and Plating Resist

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Transcript Etch and Plating Resist

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Etch / Plating Resist

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What is resist A photo resist is a chemical product that, under the influence of UV light, changes its chemical nature.

Resist without UV: is washed away during resist development Resist with UV: is NOT washed away during resist development protects the copper in the etch batch is stripped away after etching

Remark:

1 Etch resist: print & etch of inner layers 2 Plating resist: print, plate & etch of outer layers Eric Janssens May 2013 Slide 2 a b

What is resist

Liquid photo resist (20%)

• Curtain, roller- or spray coated • Thickness: 5 - 20µm • Pro: high resolution • Contra: dust inclusions and chemical sensitivity 

Dry photo resist (80%)

• Cold, hot or wet laminated • Thickness: 25 - 75µm • Pro: high yield and good tenting • Contra: line width Eric Janssens May 2013 Slide 3 Tenting: Via’s must be tented to avoid resist getting in the via a b

Traditional resist printing

Workflow:

• Design • Image and develop film, check • Coat, laminate resist • Image resist • If laminated: peel cover layer • Develop resist • Etch • Strip 

Working with resist is:

• A time consuming process step • Expensive • Fixed data • Ecological unfriendly Eric Janssens May 2013 Slide 4 a b

Inkjet resist printing

Principle:

• apply etch / plating resist • directly on the panel • using a set of Inkjet nozzles mounted on a XY table • ie without the use of a phototool or screen 

Workflow:

• Design • Print (with pin curing) • Curing (thermal and/or UV) • Etch • Strip Eric Janssens May 2013 Slide 5 a b

Inkjet resit printing

Advantages:

• Reduce cost - no phototool, less production steps - shorter production cycle, higher yields • Registration panel per panel / distortion compensation - front-to-back - outer layer to inner layer • Design changes & variable data per board • Fast (no set up) • Ecology Eric Janssens May 2013 Slide 6 a b

Quid May 2013

R&D project is in progress

Jetability and etch resistance: OK

Stripability: concepts are tested

Planning

• One ER fieldtest in operation by end 2013 • Proliferation of ER in 2014 • Concept study PR Eric Janssens May 2013 Slide 7 a b

Quid May 2013

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Quid May 2013

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Quid May 2013

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Competition: Dow (Rohm and Haas)

www.dowelectronicmaterials.com

Eric Janssens May 2013 Slide 11

Phase shift ink

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Competition: MacDermid

www.macdermid.com

Eric Janssens May 2013 Slide 12 a b

Competition: MuTracx

www.mutracx.com

Spin-off from OCE Technologies (Canon)

Announces Lunaris: print system and etch resist for IL

Phase shift inkl

Uses Predict

Fieldtest summer 2010 in EU

Commercially available by mid 2011

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Competition: MuTracx

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System supplier: MuTracx

lunaris animation.avi

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Conclusion

Inform your customers and prospects on our plans Gather as much information as possible Eric Janssens May 2013 Slide 16 a b