testing of mixed signal products Test conditions Reporting Errors

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Transcript testing of mixed signal products Test conditions Reporting Errors

Challenges of
Single Event Upset and Transient
Testing and Characterization of
Mixed Signal Products
Kirby Kruckmeyer
Agenda
• Overview of National Semiconductor’s radiation
programs
• Standards and guidelines for Single Event Effect
(SEE) testing of mixed signal products
– Test conditions
– Reporting Errors
– Single Event Upset and Transient Definitions
• Challenges for SEE testing
• Case Studies
– Ultra High Speed Analog to Digital Converter
– Ultra Low Power Digital to Analog Converter
• Summary
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National - A Major Space Supplier
• 30+ years in the Space Market
– QMLV qualified products
– One of only 10 RHA (Radiation Hardness Assured)
QML suppliers
• Radiation Testing
– TID
60Co
gamma cell in South Portland, Maine and Santa Clara, California
– ELDRS: ELDRS Free products
– SEE: SEL, SEU and SET testing
Per EIA/JEDEC JESD57 and ESA/SCC 25100
• World class Supply Chain Management
– Dedicated space program managers
3
Total Dose Improvements on Legacy
Products
Continue to work on radiation performance for existing devices
• Radiation process developed to improve total dose
performance - National’s Scotland plant
Before
Today
– LM137
10 krad
30 krad
– LF411
10 krad
50 krad
– LM101
10 krad
50 krad
– LM111
10 krad
100 krad
– LM136
10 krad
100 krad
– LM158
10 krad
100 krad
– LM124
10 krad
100 krad
– LM139
10 krad
100 krad
– LM117
10 krad
100 krad
– LM117HV
3 krad
100 krad
– LP2953
10 krad
In Process
4
ELDRS-Free Products!
• We test them so you don’t have to
• Every wafer tested and qualified at low
dose rates
– per Mil-Std-883 method 1019 condition D
– Low dose rate of 10 mrad/s (36 rad/hr)
– Biased and unbiased
• DSCC unique low dose rate certified part
numbers
ELDRS-Free LM139
• ELDRS Free Products
LM111
LM139
LM117
LM158
LM124
LM193
LM136-2.5
LMP2012
•Products in Qualification
• Low Dose Rate Qualified
LM101
LM185
LM117HV
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LM119
LM2940
LM137 LM6142
LM2941
National is more than just the LM124
Recent New Product Releases:
• ADC08D1000WGFQV1 GS/s 8 bit Analog to Digital
Converter
• ADC08D1520WGFQV1.5 GS/s 8 bit Analog to Digital
Converter
• ADC128S102WGRQV
General Purpose 12 bit Analog to
Digital Converter – mW Power
• DAC121S101WGRQV
General Purpose 12 bit Digital to
Analog Converter – mW Power
• LMP2012WGLQMLV
Precision Rail to Rail Operational
Amplifier
• ADC14155WGRQV
155 MS/s 14 bit Analog to Digital
Converter
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How to test a Mixed Signal Part
• Mixed signal inputs and
outputs
VA
– How do you monitor it all?
• What supply voltage?
– Many parts have wide operating
ranges
– What is worst case?
VIN
DOUT
DIN
VOUT
CONTROL LOGIC
CLOCK
CLOCK OUT
CHIP
SELECT
• Static or dynamic inputs?
– A 1 GS/s ADC will never be used with static inputs
– How to monitor a product in dynamic mode?
• No universal test system
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Testing GuidanceLimited For Mixed Signal Products
• Test development typically starts with FPGA’s and memories, then
moves to analog parts. Mixed signal products are usually an
afterthought
– Sandia proton spec in development - using memories as driver
– NASA new SEE guidelines (digitally oriented) and Linear SEE Testing
Guidelines
• Standards – Oriented towards digital products
– EIA/JEDEC Standard
JESD57
• Only mentions bit flips; no guidance on analog outputs or transients
• No mention of mixed signal products
– ASTM Standard Guide
F 1192 – 00
• Two definitions for transients, but no guidance on testing for them
• No mention of mixed signal products
– ESA/SCC Basic Specification
25100
• “Analogue and mixed analogue/digital technologies may generate false
outputs or transients as the result of SEE. Test system shall be capable of
monitoring and logging these effects.”
8
How to Report the Results? - Digital
Is it “errors per bit” or some other measure?
• “Errors per bit” is a standard metric for digital product
– Customers put “errors per bit” in PO’s for all kinds of products
– Some datasheets report “errors per bit” on products like PLL’s
• Does not make sense for most mixed signal products?
– What is a bit in a PLL?
– ADC bits have varying values and impact
• ADC: should be reported as complete “code errors”
• PLL’s and clocks: should be reported as output “error rate”
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How to Report the Results? - Analog
Is it a transient (SET) or upset (SEU)?
• SET and SEU are used interchangeably for reporting errors on
analog outputs
• Upset has a clear definition: a logic state change or bit flip
• No consensus on definition of SET
– JESD57 and ESA/SCC 25100 have no definition
– ASTM F 1192 – 00 has two
• 3.1.12 single event transient-SET is a self correcting upset (change) of
state of a bit induced by a single ion strike.
• 3.1.14 single event transients (SET)-SET’s are SE-caused electrical
transients that are propagated to the outputs of combinational logic
IC’s. Depending upon system application of these combinational logic
IC’s, SET’s can cause system SEU.
– Different definitions by NASA and others
• DSET – Transients generated from the digital portion of the product
• ASET – Transients generated from the analog portion of the product
• Analog outputs: should be reported as transients
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Case Study: ADC08D1520WGFQV
8 b Analog to Digital Converter
T/H
Vin
SS1
I+
I-
ADC
bank 1
LVDS
Output
BF2
ADC
bank 2
LVDS
Output
phi1
8
DI
Bf1
SS2
Input
MUX
with
Calibration
Circuit
phi2
1.5Ghz
8
DId
8
BF2
ADC
bank 1
LVDS
Output
BF2
ADC
bank 2
LVDS
Output
phi1
Q+
Q-
8
750 Mhz
T/H
SS1
8
DQ
Bf1
8
SS2
phi2
8
VREF
VBG
CLK+
CLKControl
Inputs
Serial
Interface
8
BF2
CLK/2
÷2
Control
Logic
3
11
Output
Clock
Generator
DQd
ADC08D1520WGFQV Testing
• SEE testing
–
–
–
–
–
Latchup (SEL)
Functional Interrupt (SEFI)
Upset (SEU)
Transient (SET)
Dynamic Inputs
• Need to monitor
–
–
–
–
–
Digital outputs
Clock output
Control logic
Calibration
Supply currents
Output codes
Differential output
Did part setup change
Did calibration drift
Analog and output driver supplies
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ADC08D1520WGFQV Test Challenges
• No easy test system
– Production test system run $750K to $1.5M and are not portable
• High speed testing (1 GHz or greater) difficult in the field
– Coupling seen between the various input and output signals
– Heaters for SEL testing can add noise
– Remote power supply and supply current monitoring can degrade
performance
– Worse in vacuum chamber, with feed throughs
• Considerations if using an FPGA to monitor outputs
– Using a separate clock for the FPGA could add more noise
– If using ADC clock for FPGA, clock upsets could impact output
results
– Monitoring the output clock of ADC can impact the FPGA
performance
• Control registers and calibration circuits cannot be monitored in
real time
• How to detect upsets with dynamic input and output
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Solution – Two Setups
• Output SEU
– Dedicated board for clean signals and
high resolution output– noise floor 5 LSB
– Onboard FPGA to monitor output
– Clean clock output line to FPGA
– Onboard regulator
– Use Beat Frequency and Code Error Test
Method for dynamic testing
• SEL, SEFI and Clock SEU
– Output signal not as critical
– Remote power supply with monitor
and heaters for SEL
– FIFO instead of FPGA so output
clock could be monitored
– Fast Fourier Transform (FFT) run
before and after each ion run to
monitor SEFI
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Beat Frequency and Code Error
Test Method
• Beat Frequency allows part to be tested with input frequency close to 2X
Nyquist
– Output = sample rate – input signal
– Set the input frequency so that the output will change by less than 1 LSB per clock
cycle
• Code Error routine calculates the output delta from one clock cycle to the
next
– An error is recorded if the output delta is more than some threshold
– Set to 6 LSB due to the background noise at the test facility
Output
Code
Input
difference
DId
Channel I
15
DI
Sampled Output
Input Clock
ADC08D1520WGFQV SEE Test Results
• Output code SEU
• Output clock SEU
– Errors are not bit flips in the
digital output, they are code
errors caused by transients
– Error magnitude dependent
upon the input voltage
– Two types of errors seen
– Signal attenuation
– Phase shift
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ADC08D1520WGFQV Cross Section
Curves
Output upset cross section
• Shown in terms of complete
code errors upset events and
not errors per bit
• Figure of Merit Calculation:
3.6 x 10-3 upsets per month
• Outage time (factoring in upset
length): 5.8 ns per month
Clock upset cross section
• Shown in terms of upset
events
• Figure of Merit Calculation:
4.0 x 10-5 upsets per month
• Outage time (factoring in upset
length): 2.1 ps per month
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Case study: DAC121S101WGRQV
12 b Digital to Analog Converter
• How should a Digital to Analog Converter be tested?
• What operating conditions cause the worst case?
– Cross section
– Transient amplitude and pulse width
• Operating conditions?
– Supply voltage
– Inputs
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Worst Case Conditions for SET for a
Mixed-Signal Part???
• Standards suggest lowest operating voltage
– EIA/JESD 57
“As a rule, the worst case condition is at minimum operating voltage”
– ASTM F1192
“A lower bias (minimum of the specified operating range) promotes bitflips….”
• For analog products, testing shows that maximum operating
voltage and minimum input bias is sometimes the worst case
LM124
LM139
Source: “Testing Guidelines for Single Event Transient (SET) Testing of Linear Devices”
C. Poivoy, et al,
NASA Goddard Space Flight Center
19
DAC121S101WGRQV
12 b Digital to Analog Converter
2.7 V to 5.5 V Supply Voltage Range (1.43 mW)
20
DAC121S101WGRQV
12 b Digital to Analog Converter
2.7 V to 5.5 V Supply Voltage Range (1.43 mW)
20 MHz
Serial input (code range: 0 to 4095)
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DAC121S101WGRQV
12 b Digital to Analog Converter
2.7 V to 5.5 V Supply Voltage Range (1.43 mW)
Rail to
rail
voltage
output
20 MHz
Serial input (code range: 0 to 4095)
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Test Conditions
DAC121S101
Eval Board
Setup inside
chamber
Tested with static input - typical application
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Dependence on Supply Voltage
SET Cross Section vs. LET
for input code = 3482
24
Transient Signatures
Positive
Negative
25
Negative transient dependence on input
code
2
Bi
Ta
1.5
Tb
Xe
Amplitude (V)
1
Kr
Cu
0.5
Ar
Ne
0
-0.5
-1
0
1000
2000
3000
4000
Pulse width (ns)
5000
Input code = 614
001001100110
15% of full scale
26
Negative transient dependence on input
code
2
Bi
Ta
1.5
Tb
Xe
Amplitude (V)
1
Kr
Cu
0.5
Ar
Ne
0
-0.5
-1
0
1000
2000
3000
4000
Pulse width (ns)
5000
Input code = 614
001001100110
15% of full scale
27
Negative transient dependence on input
code
2
2
Bi
Bi
Ta
1.5
Ta
1.5
Tb
Tb
Xe
Kr
Cu
0.5
Ar
Ne
0
Xe
1
Amplitude (V)
Amplitude (V)
1
Kr
Cu
0.5
Ar
Ne
0
-0.5
-0.5
-1
-1
0
1000
2000
3000
4000
Pulse width (ns)
5000
0
1000
2000
3000
4000
Pulse width (ns)
Input code = 3482
110110011010
85% of full scale
Input code = 614
001001100110
15% of full scale
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5000
Negative transient dependence on input
code
2
2
2
Ta
Ta
1.5
Xe
Cu
0.5
Ar
Ne
0
Xe
1
Amplitude (V)
Amplitude (V)
Kr
Tb
Tb
Tb
1
Kr
Cu
0.5
Ar
Ne
0
-0.5
-1
2000
3000
4000
Pulse width (ns)
Input code = 614
001001100110
15% of full scale
5000
Kr
Cu
0.5
Ar
Ne
0
-0.5
-1
-1
1000
Xe
1
-0.5
0
Ta
1.5
Amplitude (V)
1.5
Bi
Bi
Bi
0
1000
2000
3000
4000
Pulse width (ns)
Input code 2048
100000000000
50% of full scale
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5000
0
1000
2000
3000
4000
Pulse width (ns)
Input code = 3482
110110011010
85% of full scale
5000
Summary
• Testing mixed signal products can be complex and
challenging
• There are very few standards or guidelines for
testing mixed signal products
• Some unique test methods are needed
• Mixed signal Single Event Transient and Upset
responses can be very different than for either pure
digital or pure analog products
• It is necessary to characterize a product over all
application conditions that will be used
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