W ELCOME TO THE ICOPS 2012 V ORPAL W ORKSHOP

14:00: I NTRODUCTION TO

C ARY

) 14:30: I NTRODUCING N T ECH AUTILUS -X ( AND

P S

V ORPAL

TOLTZ

) 14:50: S IMULATING M FDTD (

A L IKHANSKII

) EDICAL P LASMAS USING 15:10: C OFFEE B REAK 15:30: A EROSPACE PLASMAS AND (V ORPAL /N AUTILUS CO SIMULATION ) (

A LEX L IKHANSKII

) 16:00: V IZUALISATION TECHNIQUES WITH HDF5 FILES (

J S MITH

) 16:20: CCP CHAMBER SIMULATIONS

(P S TOLTZ

) AND

D

ONCLUDING REMARKS

AVID S MITHE

AND

M ING

(

J S MITH HIEH L

)

IN

(

J

John Cary CEO Jonathan Smith Tech-X UK Ltd & Cockcroft-Tech-X SIMULATIONS EMPOWERING YOUR INNOVATIONS Industrial Fellow

What are the p

la

ns for today?

•

Show how to get answers using Vorpal

•

Work with you on various plasma modeling problems

•

Get your feedback

In this introduction:

•

Overview of Tech-X

•

Recent additions to Vorpal

•

Roadmap for Vorpal

SIMULATIONS EMPOWERING YOUR INNOVATIONS

www.txcorp.com

With 18 years of experience, Tech X’s mission is to provide customers with the best computational software and engineering services to enable their breakthroughs in research, development, design, and operations • •

High-performance computational software

•

High-performance visualization and HPC application front ends

•

Enhancing code performance Other development including quality and portability

Partners and Collaborators

Our partners and collaborators are at the leading edge of science and technology. They represent a broad spectrum of efforts to discover, describe, predict and exploit the complex behaviors of matter and energy.

Customers and Commercial Partners

We provide our customers with both off-the shelf and customized solutions addressing their advanced technology needs.

Tech-X has a history of discovery and recognition

2008 Crab Cavity Visualization 2011 AVS Innovation Award

Far reaching discoveries Tech-X UK Ltd wins 2010 knowledge business of the year

SIMULATIONS EMPOWERING YOUR INNOVATIONS

Laser-Plasma Accelerator

Department of Energy Visualization Awards

Vorpal: Past and Future (Road Map)

• OOPIC Pro • 5.0 improvements • 5.2 improvements • Road Map  6.0 features  7.0 features SIMULATIONS EMPOWERING YOUR INNOVATIONS

OOPIC Pro has reached its end of life

• All OOPIC Pro features will be supported by Vorpal 6.0, which furthermore has a host of other features (3D, better parallelism, more solvers, …) • Support will have to be at a volunteer basis after December 31, 2012 • XOOPIC remains available SIMULATIONS EMPOWERING YOUR INNOVATIONS

Vorpal: Plasma and EM modeling framework

• • • Broad range of plasma, EM and ES models  Particle-in-cell, Boltzmann fluid, Euler fluids  Cut-cell algorithms for accurate electromagnetics in complex geometries Runs on largest-scale parallel supercomputers, routinely on > 30,000 node concurrently Extensive implementations of plasma-material interaction physics    Sputtering Secondary emission, Ionization, recombination, nuclear reactions SIMULATIONS EMPOWERING YOUR INNOVATIONS

Vorpal: Wide range of applications

• • • • • • • • • Widely used in government, industry and academia (all projects below with involvement of Tech-X personnel) High-energy physics: Laser Wakefield Accelerators Aerospace: Plasma engines, dielectric barrier discharges Photonics: Bandgap structures, meta-materials Surface interaction: Multipactoring, electron cloud effects High-Power Microwave: Cavity optimization, Magnetrons, Gyrotrons Semiconductor manufacturing: Surface deposition reactors Ion sources: Electron cyclotron resonance ion sources High energy-density physics: laser fusion, inertial confinement fusion (ICF) SIMULATIONS EMPOWERING YOUR INNOVATIONS

Vorpal 5.0 (Sep 2011)

• Improved Visualization Environment • Simulations in Cylindrical Coordinates • Improved Framework for Collisions • Electromagnetic Simulations on GPUs • Improved Restart Performance • Improved Documentation • VorpalComposer (VisIT based visualization) SIMULATIONS EMPOWERING YOUR INNOVATIONS

Composer Toolkit Approach:

Customizable Workflow bridges the gap to HPC

Vorpal 5.2 (March 2012)

• Inclusion of new, improved port macros.

• More cylindrical examples • Improvements to particle post-processing • External circuit improvements • Further enhancements to visualization tools.

 Improved cylindrical visualizations  Improved phase-space plots SIMULATIONS EMPOWERING YOUR INNOVATIONS

Vorpal 6.0 (expected Aug-Sep 2012)

• • • • • Remote control and visualization Implicit electromagnetics Improved parallel performance Modularity Flexible collision framework to allow  Collisional recombination  1->2 body decay • Allow user definition of all process rates/cross sections  Cross sections  Field ionization  Secondary electron yield  Sputtering • User definable post analysis SIMULATIONS EMPOWERING YOUR INNOVATIONS

Vorpal 7.0 (expected Aug-Sep 2013)

• • • • • • • • Constructive Solid Geometry Input file generation  Syntax highlighting  Context sensitive help  Validation (strong typing)  Preview of calculated variables  'Tree view' More CAD readers (STEP, SAT) Space-charge limited emission (Child Langmuir) Coulomb collisions Embedded boundary electrostatics Higher-performing particles  AVX  GPU  MIC?

Neutral fluid flow, with fluid heated by the plasma INNOVATIONS

• •

We are looking for user input

What do you need?

What can make your life easier?

[email protected]

Tech-X UK Ltd Daresbury Innovation Centre Sci-Tech Daresbury Keckwick Lane Warrington WA4 4FS +44 (0) 1925 320 210 [email protected]

Tech-X Corporation 5621 Arapahoe Ave. Boulder, CO 80303 Tel: +1 303 448 0727 SIMULATIONS EMPOWERING YOUR INNOVATIONS