Transcript 인천화학 Incheon Chemical Co.

PRODUCTS GUIDE
General Plating
Ver 8.01
Address : #173-90, GAJWA-DONG, SEO-GU, INCHEON, KOREA
인천광역시 서구 가좌동 173-90
TEL : (032) 578-4711 / FAX : (032) 578-4716
1. Inorganic Compound
인천화학㈜
Incheon Chemical Co.,Ltd
Nickel Compounds
Product Name
Conc.
Formula
Packing
Nickel Sulfate
Ni : 22% min
NiSO4·6H2O
20Kg
Nickel Chloride
Ni : 24% min
NiCl2·6H2O
20Kg
Nickel Sulfamate (65%)
Ni : 11.8% min
Ni(SO3NH2)2 sol 65%
20Kg
Nickel Sulfamate (60%)
Ni : 11% min
Ni(SO3NH2)2 sol 60%
20Kg
Nickel Carbonate
Ni : 35% min
NiCO3
20Kg
1. Inorganic Compound
인천화학㈜
Incheon Chemical Co.,Ltd
Copper & Zinc Compounds
Product Name
Conc.
Formula
Packing
Copper Cyanide
Cu : 70.6% min
CuCN
15Kg, 25Kg, 50Kg
Zinc Cyanide
Zn : 55% min
Zn(CN)2
15Kg, 25Kg
Sodium Copper Cyanide
Cu : 24.5% min
Na2Cu(CN)3
25Kg
Potassium Copper Cyanide
Cu : 27.5% min
K2Cu(CN)3
15Kg, 30Kg
Copper Fluoborate
Cu : 12.5%
Cu(BF4)2
25Kg
MS - Cu
Cu : 9.5% min
Cu(CH3SO3)2
25Kg
Brass Salt
-
-
15Kg
Imitation Gold
-
-
15Kg
1. Inorganic Compound
인천화학㈜
Incheon Chemical Co.,Ltd
Tin & Lead Compounds
Product Name
Conc.
Formula
Packing
MS - TIN
Sn : 300g/L min
Sn(CH3SO3)2
30Kg
MS - Lead
Pb : 500g/L min
Pb(CH3SO3)2
30Kg
Stannous Fluoborate
Sn(BF4)2 : 45%
Sn(BF4)2
25Kg
Lead Fluoborate
Pb(BF4)2 : 50%
Pb(BF4)2
25Kg
Stannous Chloride
Sn : 52% min
SnCl2·2H2O
20Kg
Stannous Sulfate
Sn : 54.5%
SnSO4
20Kg
Sodium Stannate (42.5%)
Sn : 42.5 %
Na2SnO3·3H2O
20Kg
Sodium Stannate (36%)
Sn : 36 %
Na2SnO3·3H2O
20Kg
Product Name
Conc.
Formula
Packing
Silver Nitrate
Ag : 63.4% min
AgNO3
1Kg
Silver Compounds
1. Inorganic Compound
인천화학㈜
Incheon Chemical Co.,Ltd
Other Compounds
Product Name
Conc.
Chromic Acid
Formula
Packing
Origin
CrO3
25Kg
Japan (JCI, 日本精工)
MSA
70% min
CH3SO4H
25Kg
GERMANY (BASF)
Copper Sulfate
Cu : 25.4% min
CuSO4·5H2O
20Kg
CHINA (GOOD CHEMICAL)
Fluoroboric Acid
45, 50% min
HBF4
25Kg
CHINA, FRANCE
Potassium Cyanide
98.5% min
KCN
50Kg
USA, GERMANY, JAPAN
Rochelle Salt
99.0% min
KNaC4H4O6·4H
2O
25Kg
SPAIN (PAHI)
Sulfamic Acid
99.5%
NH2SO3H
25Kg
JAPAN, TAIWAN
Potassium Tiocyanide
97.0% min
KSCN
25Kg
GERMANY (RUETGERS)
Sodium Cyanide
98.0% min
NaCN
50Kg
KOREA (TAEKWANG)
Sulfuric Acid
95%, 61.5%
H2SO4
30Kg
KOREA (DAESUNG SCI.)
Hydrochloric Acid
35%
HCl
20Kg
KOREA (DAESUNG SCI.)
Hydrogen Peroxide
35%
H2O2
20Kg
KOREA – OCI
Sodium Hydroxide
98%
NaOH
25Kg
KOREA – DONGHAE CHEM.
인천화학㈜
Incheon Chemical Co.,Ltd
2. Nickel Additive
Bright & Barrel Nickel Process
Product Name
Application
Features
Product Name
Make Up
NICSTAR
Superior leveling.
Suitable for iron
& iron alloy.
Very high leveling, high brightness, high speed.
Very high White deposits.
Very good throwing power.
NICSTAR-CAR
NICSTAR-BRI
ICN-P
10ml
0.5ml
1ml
SUCCESS-20
Barrel Plating
(2type)
High leveling.
High brightness, good throwing power.
SUCCESS-CAR
SUCCESS-BRI
ICN-P
10ml
0.5ml
1ml
SUCCESS-X50
Barrel Plating
(1ype)
High leveling.
High brightness
Good throwing power. Easy control.
SUCCESS-MU
SUCCESS-X50
ICN-P
20ml
0.6ml
1ml
Semi-bright & PCB Ni.
Product Name
Application
ICN-SM50
Non-coumarin type products.
Requiring corrosion resistance
and clingingness.
Features
For high corrosion resistant underplating.
High ductile deposits ant a very low tensile
stress.
Product
Name
Make Up
ICN-SM
1ml
인천화학㈜
Incheon Chemical Co.,Ltd
2. Nickel Additive
Nickel Sulfamate Process
Product Name
Application
ICN-B1, B2
Connectors, electroforming
applications and printed
circuitboards
Lower stress in sulfamate nickel or
Watt solution. Capable of leveling to
a limited degree for high corrosion
resistant and high ductile.
Nickel Sulfatmate additive
Lower stress in sulfamate nickel or
Watt solution. Capable of leveling to
a limited degree for high corrosion
resistant and high ductile.
ICN-SM 50
Features
Product Name
Make Up
ICN-B1
ICN-B2
ICN-P
15ml
0.2ml
1ml
ICN-SM 50
20m
Special Nickel Process
Product Name
Application
ICN-P
Suitable for PCB, Nickel
Sulfamate wetting agent.
Pit preventer.
Features
Pit preventer for air agitation.
Adding a small amount lowers
surface tension.
Product Name
Make Up
ICN-P
1ml
인천화학㈜
Incheon Chemical Co.,Ltd
3. Copper Additive
Acid Copper Plating Process
Product Name
Application
Features
Product Name
Make Up
CUESTAR
Decorative plating onto general
metal product and plastic materials
Excellent brightness and
leveling.
Mirror bright deposits after
shortest plating time.
Very low running cost.
Cuestar-MU
Cuestar-A
Cuestar-B
4ml
0.7ml
0.5ml
ICU-200
Big and wide reel to reel line.
Suitable for high temperature and
high sulfuric acid contents.
Suitable for high
temperature and high
sulfuric acid contents.
Dye-free system.
ICU-201
ICU-202
3.2ml
2.4ml
Dye-free system.
Wide density and good
throwing power.
Easy control.
ICU-401
ICU-402
3.2ml
1ml
Application
Features
Product Name
Make Up
Iron and iron alloy, copper
alloy, zinc and zinc alloy for
strike and bright plating
Excellent brightness and
leveling.
Wide density and good throwing
power.
Easy control.
CY-1000
20ml
ICU-400
Big and wide reel to reel line.
Suitable for high temperature and
high sulfuric acid contents.
Bright Cyanide Copper Plating
Product Name
CY-1000
4. TIN ADDITIVE
인천화학㈜
Incheon Chemical Co.,Ltd.
Matt type additive
Product Name
MSN-3000,4000
Use
General matt solder plating
PCB board, chip
PC-MT
MTHS
Lead free matt plating
PCB board, chip, IC Lead frame
Lead free High speed Plating matt
Plating
Lead frame, Component
Special feature
Very stable alloy over Wide range of current
densities.
Excellent Solderability & Throwing power.
Uniform deposit.
Excellent Solderability & Throwing power.
Very stable deposits on high current densities.
Excellent Solderability & Throwing power.
Bright type additive
Product Name
NBSN-5000
Use
Lead free General bright plating
Flexible P.C.B
HBSN-5000
Solder, General bright plating
Flexible P.C.B
NBT
Lead free high speed bright plating
Connector, Pin, Component
Special feature
Very stable deposits over , Wide range of current
densities.
Excellent Solderability & Throwing power.
Very stable alloy over Wide range of current
densities.
Excellent Solderability & Throwing power.
Uniform alloy and stable on high current densities.
Excellent Solderability & Throwing power.
4. TIN ADDITIVE
인천화학㈜
Incheon Chemical Co.,Ltd
Neutral pH
additive(Chip plating)
Product Name
Use
Special feature
Chip plating
Very stable all over Wide range of current densities.
LF-500
Various Chip plating
Excellent Solderability & Throwing power.
인천화학㈜
Incheon Chemical Co.,
5. BROWN OXIDE
Process
Product
Name
Cleaner
CP-10000
Weak alkali cleaner
10%
Temp.: 50℃
Time: 1-3min
Per-Dip
BRO 750AD
Non-H2O2 product
2 %V
Temp.: R.T.
Time: 30~60sec
Superior adhesive strength : 0.
8-1.3kg/cm2
The tone of color is equal and
possible to apply to High Tg
product
BRO 750 : 100%V
Temp.: 35-40℃
Time: 45-60sec
Oxide
BRO-750
Property
Standard
Working
Condition
6. Soft etching Products
인천화학㈜
Incheon Chemical Co.,
M/U
Working
Condition
Amount
of
Etching
EP-250
Etching agent for lactic
acid and hydrogen
Dry film, S/M,
peroxide.
Suitable for former
Formulated suitable
conditioner of
intensity of illumination
electroless copper.
on the surface of
copper.
EP-250: 2-3 %V
H2SO4(95%):5-10 %
V
H2O2(35%): 3-8 %V
Temp.: R.T.
Time: 10-30S
0.7-1.5
um/min
IST-2B
Etching agent for lactic
acid and hydrogen
Dry film, S/M,
peroxide.
Suitable for former
Formulated suitable
conditioner of
intensity of illumination
electroless copper.
on the surface of
copper.
IST-2B: 2-5 %V
H2SO4(95%):8 %V
H2O2(35%): 5 %V
Temp.: R.T.
Time : 10-30S
0.7-1.5
um/min
High-speed
Etching agent
HEP-250
High speed
etching agent to
equalize copper
foil’s thickness of
CCL.
High speed etching.
High stability.
HEP-250: 7-10 %V
H2SO4 (95%): 10 %V
H2O2 (35%): 11 %V
Temp.: 30 ℃
Time : 30-60S
2.0-4.0
um/min
Flash
Etching
FEP-260
Suitable thin and
narrow circuit as a
flipchip board
High stability.
Small amount of
etching.
FEP-260: 5 %V
H2SO4 (95%) : 25 %V
H2O2 (35%): 3 %V
Temp.: R.T.
Time : 20-60S
0.2-0.6
um/min
Product
Name
Application
Property
인천화학㈜
Incheon Chemical Co.,
7. PTH Chemical
Cleaning of Flex, R-F board
Process
Product
Name
Alkaline
Cleaning
Improved
Agent of
Surface
AP 1100
Cleaning/
Conditioning
Function
Remove oxidized substances
and pollutants.
Improve quality of poly imide’s
surface.
·Remove oxidized substances
and pollutants on the board.
Cleaner/
·Improve wetting-property of a
Conditioner board and inside wall.
PC 480 C ·Control electric potential to
improve adhesive strength of
palladium.
M/U
Working
Condition
•Strong ability to
control surface of
poly imide and BT
resin’s board
AP 1100:
250ml/L
Temp.: 40~50℃
Time : 1-3min
•Uniformity of
palladium adhesion.
•Improve reliability
of inside wall of the
hole.
PC 480C :
50ml/L
Temp.: 50-60℃
Time : 3-7min
Property
인천화학㈜
Incheon Chemical Co.,
7. PTH Chemical
Rigid Desmear
Process
Swelling
Smear
Etching
Product
Name
IPM-100S
IPM-101A
IPM-101B
IPM-103
Neutralization
Property
M/U
Working
Condition
Swelling of
epoxy resin
•Softening state
of epoxy resin by
organic solvent is
excellent.
IPM-100S 45%%V
IPM-101B 2.5%V
Temp.: 60℃
Time : 6min
30M²B/L
Resin etching
•Regular amount
of etching and
the maximum
adhesive strength
with copper.
IPM-101A: 60 g/L
IPM-101B: 7%V
Temp.: 70℃
Time :
10min
%Insoluble
ingredients
30 % and
below
Removing
insoluble MnO2
•Excellent effect
of removing
impurities without
copper foil’s
damage of inside
layer.
IPM-103: 10 %V
H2SO4 : 6%V
Temp.: 45℃
Time : 5min
Cu: 20g/L
Area: 15 M²
B/L
Application
Life of
solution
인천화학㈜
Incheon Chemical Co.,
7. PTH Chemical
Flexible Desmear
Process
Swelling
Smear
Etching
Neutralization
Product
Name
IPM-100S
IPM-101A
IPM-101B
IPM-103
Application
Property
Swelling of
epoxy resin
•Softening
state of epoxy
resin by
organic
solvent is
excellent.
Resin etching
•Regular
amount of
etching and
the maximum
adhesive
strength with
copper.
Removing
insoluble MnO2
•Excellent
effect of
removing
impurities
without
copper foil’s
damage of
inside layer.
M/U
IPM-100S 45%%V
IPM-101B 0.6%V
Working
Condition
Life of
solution
Temp.: 40℃
Time : 10min
30M²B/L
IPM-101A: 60 g/L
IPM-101B: 1.6%V
Temp.: 40℃
Time : 10min
%Insoluble
ingredients
30 % and
below
IPM-103: 10 %V
H2SO4 : 6%V
Temp.: 40±3
℃
Time : 5min
Cu: 20g/L
Area: 15 M²
B/L
인천화학㈜
Incheon Chemical Co.,
7. PTH Chemical
Colloid Pd Series
Process
Product
Name
M/U
M/U
Temperature
8.5%
2.6%
60℃
EP-230 PLUS
EP-230 PLUS
H2SO4
H2O2
2min
5 ml/L
70 ml/L
40 ml/L
R/T
Pre-dip
PCT-SALT
PCT-SALT
HCl
2min
225 g/L
10 ml/L
20℃
Catalyst
PCT-740
PCT-740
PCT-SALT
HCl
8min
3%
225 g/L
10 ml/L
30℃
Accelerator
PCT-747
PCT-747
2min
5%
R/T
Electroless copper
ICP-360A
ICP-360B
ICP-360C
Stabilizer
Formalin
E/L Copper
(Medium Copper)
30-40min
6%
5%
6%
25-30℃
Electroless copper
ICP-245A
ICP-245B
ICP-245C
Formalin
E/L Copper
(Thin Copper)
Micro etching
CP-9000N
NaOH
Time
5min
Cleaner- conditioner
CP-9000N
Working Condition
15-20min
8%
10%
Rep.
0.67%
23-27℃
인천화학㈜
Incheon Chemical Co.,
7. PTH Chemical
Ion Pd Series
Process
CleanerConditioner
Working Condition
Product
Name
M/U
Time
M/U
Temperature
CP-9000N
CP-9000N
NaOH
5min
9.5 %V
0.8 %V
40±3℃
EP-230 PLUS
EP-230 PLUS
H2SO4
H2O2
2min
3 ml/L
70 ml/L
64 ml/L
20±3℃
Pre-dip
PCT-645
PCT-645
H2SO4
pH
1-2min
1.0 %V
3 ml/L
1.0-1.5
R/T
Catalyst
PCT-640
3-5min
40±3℃
pH
80~120 ppm
<100 ppm
9.5~10.5
3-5min
5 ml/L
5 g/L
7.5~8.5
20±3℃
12%V
5.2%V
2%V
25±3℃
Micro etching
PCT-640
Reductant
PCT-646
PCT-646
H3BO3
pH
Electroless
copper
ICP-460M
ICP-460A
ICP-460B
E/L Copper
(Thin Copper)
15-20min
인천화학㈜
Incheon Chemical Co.,
7. PTH Chemical
Elector Plating Additive
Product
Name
HTP-CARRIER
HTP-ADDITIVE
ATP-200
(new version)
BVF-940
MVP-5000
PP-2000
Property
Superior solderability and throwing power.
Superior throwing power performance over the all CD range on high aspect ratio boards.
A new and modern acid copper system, especially designed to have high T/P in the high aspect
ratio and produce uniform and bright copper deposit with superior throwing power and
distribution performances roe printed circuit apllications.
Microvia filling system especially designed for printed circuit applications.
Design for plating printed circuit boards in which smooth satin copper deposits are required.
The deposit structure is fine grained so have advantages of increasing ductility and strength.
Increases significantly productivity due to the use of high current density plating.
Reduce consumption of copper metal.
인천화학㈜
Incheon Chemical Co.,
8. ENIG Process
Product
Name
Application
Removing pollutants of
Acid Cleaning
copper’s surface and
CA-7000D
activation
Palladium
Catalyst
PCT-840
Non
electrolytic
Nickel
Ni-6000
Non
electrolytic
Nickel
Ni-7000
Deposited
gold plating
HMG-24
Property
Small quantity of
bubbles
Pd adhesion with copper’s
Using lactic acid
surface for simple Nickel
palladium
plating
M/U
Working
Condition
CA-7000 : 10.0 %V
Time : 1-3 min
Temp.: 40-50℃
H2SO4(98%): 4.5 %V
PCT-840: 50 ml/L
Time : 1 ~ 2min
Temp.: R.T.
Ductility of microcircuit
and general PCB plating
Ni-6000M : 150 ml/L
Semi-gloss plating
Ni-6000A : 45 ml/L
layer of low stress.
Ni-6000B
Ni-P alloy (P: 6~8%).
Ni-6000C
High solution stability.
Ni-6000S : 4 ml/L
Time : 15∼25min
Temp.: 82℃
Plating Velocity :
12㎛/hr
Ductility of microcircuit
and general PCB plating
and general components
Semi-gloss plating
layer of low stress.
Ni-P alloy (P: 6~8%).
High solution stability.
Ni-7000M : 100 ml/L
Ni-7000A : 55 ml/L
Ni-7000B
Ni-7000C
Time : 15∼25min
Temp.: 82℃
Plating Velocity:
12㎛/hr
PCB SMT
Restraint of Nickel
corrosion.
Increment of
soldering reliability
HMG-24:50(45~55) ml/L
Au: 1(0.8~1.2) g/L
PH: 5.5 (5.0~6.0)
Temp.: 85(80~89)℃
Plating Velocity:
1~4ｕ“
9. D/F & S/M Adhesive strength builder
Product
name
Application
Adhesion
Promoter
AEP 270
(non-etching)
Copper surface
pretreatment
(OSP, chemical
stannous,
chemical Ag
plating etc.)
Without etching of
copper D/F adhesive
strength is increasing by
organic matter coating
Dry film, S/M,
Fitness for
Immersion copper
pretreatment
Etching and organic
matter coating are the
same time progress by H
2SO4/H2O2.
Non-luster copper
surface formation
adhesive strength is
excellent by equable
organic matter coating
Adhesion
Promoter
AEP 275
property
m/u
인천화학㈜
Incheon Chemical Co.,
Working Etching
condition amount
10 %V
spray pressure:
0.8∼2.0 Kg/㎡
Temp.: normal
Temp.
Time: 30∼60S
-
AEP-275 : 5 %V
H2SO4: 4~8 %V
H2O2: 3~4 %V
Temp. :
25 ~ 30℃
Time: 30∼60S
(spray)
0.5∼1.0
㎛/min
(spray)
10. D/F developer, remover
Product
name
application
인천화학㈜
Incheon Chemical Co.,
property
m/u
achievement of excellent
resolution
•superior to side wall quality.
•developing equipment is
supported clean.
DEP-10 : 2 V%
Na2CO3 : 1.0wt%
Process
condition
•the
DEP-10
(developing
solution)
Additive for Na2CO3
developing solution
•the
DEP-20
(developing
solution)
High Concentration
K2CO3 solution
DSP-30
(exfoliation
solution)
Exclusive use of D/F
remover that can peel
off small particles in
high density patterns
achievement of excellent
resolution
•superior to side wall quality.
•developing equipment is
supported clean..
•the life of solution is
extended.
Temp. : 28~31℃
Time : 45∼55 sec
•High exfoliation speed
•Excellent oxidation preventer
effect
•the life of solution is
extended.
High exfoliation speed
Excellent oxidation
preventer effect.
•the life of solution is
extended.
• Application of D/F and LPR
at the same time is possible.
DEP-20 : 1.5 V%
Temp. : 28~31℃
Time : 45∼60 sec
DSP-30 : 3 V%
NaOH: 3 wt%
Temp. : 50∼60℃
Time : 30∼60sec
•
•
DSP-40
(exfoliation
solution)
Exclusive D/F stripper.
NaOH / KOH Base
DSP-40 : 7 V%
Temp. : 50∼60℃
Time : 30∼60sec
10. D/F developer, remover
Product
name
DSP-50
(exfoliation
solution)
DSP-60
(exfoliation
solution)
application
exclusive use of D/F
remover of Amine base
Exclusive use of
remover that apply to
partial Au-plating
product
property
•Amine base
•High exfoliation speed
• Excellent oxidation
preventer effect.
• the life of solution is
extended.
•Amine base
•High exfoliation speed
• Excellent oxidation
preventer effect.
• the life of solution is
extended.
인천화학㈜
Incheon Chemical Co.,
m/u
Process
condition
DSP-50 : 7 V%
Temp. : 50∼60℃
Time : 30∼60sec
DSP-60 :15∼25
V%
Temp. : 50∼60℃
Time : 30∼2min
11. Chemical Ag Plating process
인천화학㈜
Incheon Chemical Co.,
Product
name
m/u
Working
condition
CA-7000S : 10.0 %V
Temp.: 40-50℃
Time: 1-3 min
Spray
Cleaner
application
property
Refere
nce
removal of acid
CA-7000S
Pollutant removal
and activation of
copper surface
• low bubble
Soft Etching
EP-240S
Formation of
bright copper
surface
Increase of cling
between Ag and
copper surface
•stable etching
speed
•uniform and
bright copper
surface
EP-240S : 5 %V
H2SO4 : 4 %V
H2O2 : 4 %V
Temp.: R.T.
Time: 10-30S
Micro-etc
hing depth:
1.0µm
Pre-dip
IAG-902
Preparatory
deposition for
preventing from
polluting of Agplating solution
•maintain acidity
of plating solution
•pollution
preventation of
plating solution
•cling increment
between metals
IAG-902 : 10 V%
HNO3 : 1.0 V%
Temp.: 30~50℃
Time: 20~60 S
60 %
HNO3
11. Chemical Ag Plating process
인천화학㈜
Incheon Chemical Co.,
Product
name
Working
condition
Refere
nce
Temp.: 45 ~ 55℃
Time: 30~60 S
Plating
thickness:
0.2~0.4µ
m
Immersion Silver
IAG-903
Discoloration
preventer
IAG-904
application
property
m/u
Excellent
solderability Agplating layer is
formed
•bright silver plating
layer
•Under cut attack is
extremely low.
•uniform plating
layer
IAG-902 : 10 V%
HNO3 : 2.0 V%
IAG-903 : 5 V%
Preventation from
discoloring of Agplating layer
•excellent
discoloring
preventation effect
•Blocking effect of
moisture is excellent
•no effect to
solderability
IAG-904 : 15%V
Temp.: 50~55 ℃
Time: 10 ~ 60 S
12. Chemical Sn Plating Process
Product
name
removal of acid
CA-7000D
Acid pre-dip
ITP-500AD
Pre-Sn
plating
(1st)
application
Pollutant removal
and activation of
copper surface
• low bubble
Maintain activity
degree of copper
surface
Maintain acidity of
Sn-plating solution
•possible to plate to
uniform color.
Uniform
pre-plating
(0.02-0.05um)
•plating solution’s
balance maintenance
Immersion tin
(0.6-1.5um)
•Sn-plating layers of
bright white
•low aggression about
SM.
•Excellent solderability.
•plating structure is
close and no
discoloration.
ITP500
Sn plating
(2nd)
property
인천화학㈜
Incheon Chemical Co.,
m/u
Working
condition
CA-7000 D : 10.0 %V
Temp.: 40-50℃
Time: 1-3 min
ITP-500AD : 25.0%V
Temp.: R.T.
Time: 1-2min
ITP-500: 100 %V
Temp.: R.T.
Time: 1min
ITP-500: 100 %V
Temp.: 55-65℃
Time: 5-15min
Plating speed:
0.1um/min
인천화학㈜
Incheon Chemical Co.,
13. OSP Process
Product
Name
removal of acid
CA-7000S
Soft Etching
EP-240S
OPF-100
Application
Property
M/U
Working
Condition
Pollutant removal
and activation of
copper surface
• low bubble
CA-7000 S : 10.0 %V
Temp.: 40-50℃
Time: 1-3 min
Formation of bright
copper surface
Increase of cling
between coating
layer and copper
surface
•stable etching speed
•uniform and bright
copper surface
EP-240S: 5 %V
H2SO4: 8 %V
H2O2 : 4 %V
Temp.: R.T.
Time: 10-30S
Pre-Flux Coating
(0.2-0.5um)
Suitability to smokeless
condition
Application to PCB that
has only copper circuit
• Excellent oxidation
preventer effect and
Excellent solderability.
• Excellent heat-resisting
property.
• long period of
preservation.
OPF-100 : 100 %V
Temp.: 40 ℃
Time: 1min
인천화학㈜
Incheon Chemical Co.,
13. OSP Process
Product
Name
OPF-200
Application
Pre-Flux Coating
(0.2-0.5um)
Property
• Suitability to smokeless
condition
• application to board that
has copper and gold at
the same time
• Excellent oxidation
preventer effect and
Excellent solderability.
• Excellent heat-resisting
property.
• long period of
preservation.
M/U
OPF-200 : 10 %V
Working
Condition
Temp.: 40 ℃
Time: 1min
14. METAL, S/M Remover
Product
Name
인천화학㈜
Incheon Chemical Co.,
M/U
Working
Condition
Sn or Sn/Pb remover
•remover including nitric acid
•no erode copper surface
•high metal meltage
100%V
Temp.: R.T.
Rack remover
SUS-ST
Copper and Sn or
Sn/Pb on the plating
of SUS are exfoliated
at the same time on
the plating of SUS
•use to add nitric acid
solution
•nitric acid gas emission is
minimum
10 %V
Temp.: R.T.
Ag remover
AG-ST
Remover for Agplating re-operations
•weak-acid matters
•fast exfoliation speed and no
copper erosion
100%V
Temp.: R.T.
hardened SM layers
os are exfoliated
•KOH/NaOH mixing solution
•no erode and discolor about
copper.
•minimize erosion about
board resin
100%V
Temp.: 60∼90℃
Time: 5∼20min
Sn/Pb remover
SNS-60 S (Spray)
SNS-60(deposition)
S/M remover
SMS-100
Application
Property
인천화학㈜
Incheon Chemical Co.,
15. The others product
Product
Name
Working
Condition
Application
Property
M/U
antifoamer
AF-100
D/F developing and other
process
• Excellent antifoam
effect
• include a very small
amount’s silicon.
• Excellent washing
1-2 ml/L
antifoamer
AF-200
D/F exfoliation and other
process
• Excellent antifoam
effect
• Excellent washing
1-2 ml/L
for a while corrosion
control of copper surface
• Excellent oxidation
preventer effect.
• Easy elimination by
acid pre-dip
5.0 %V
Temp.: R.T.
Time: 30∼60S
Special for screen cleaning
• use odorless organic
solvent
• wahing effect and
fast drying
100 %V
R.T.
Equipment washing system
• use odorless organic
solvent
• strong melting,
penetration
100%V
40-50
Discoloration
preventer of
copper
AT-100
Screen cleaner
AT-1000
EQC-1000
Refer
ence
Mesh
washing
16. Zn plating and trivalence cromate
Product
Name
Use
Special feature
인천화학㈜
Incheon Chemical Co.,
MU ratio
(ml/L)
ICZ-720
Zinc cyanide brightener
Plating layer of gloss property
Stable plating solution
chemically
ICZ-740
Acidity potassium chloride
brightener
Excellent gloss and ductility
Good throwing power
ICZ-740A : 40
ICZ-740B : 2
ICZ-Boster
White trivalence cromate
Excellent gloss
Excellent ductility and
covering
8-10% barrel
6-8% rack
ICZ-520
High temperature and natural
color trivalence cromate
Form natural color cromate
12-14% barrel
10-12% rack
ICZ-530
Normal temperature and
One-solution form
nature color
trivalence cromate
Form cromate layer of gloss
Long life of solution
Trivalence cromate of normal
temperature type
8-10%
ICZ-540R, S
Normal temperature and
two- solution form
nature color
trivalence cromate
Form natural color cromate
Long life of solution
Excellent corrosion
Trivalence cromate of normal
temperature type
ICZ-540R 8-10%
ICZ-540S 1-2%
ICZ-505TDS
4ml/L
Extent
17. Protective coating product
인천화학㈜
Incheon Chemical Co.,
Product
Application
Name
Property
S-510 M
protective coating
of trivalence and
hexavalent
cromate layer
• form translucent
coating layer
S-510M : 50 V% (Rack)
S-510M : 70 V% (Barrel)
15~40 ℃
10~30 sec
S-100B
protective coating
of trivalence and
hexavalent
cromate layer
• strong elasticity and
form transparent
coating layer
S-100B: 70 V% (Rack)
S-100B : 100 V% (Barrel)
15~40 ℃
10~30 sec
WS-510
protective coating
of trivalence and
hexavalent
cromate layer.
• strong elasticity and
form transparent
coating layer
WS-510: 50V% (Rack)
WS-510 : 70~100 V%
(Barrel)
15~40 ℃
10~30 sec
M/U
Working Refer
Condition ence
18. Electrolysis plating process
Product
Application
Name
electrolysis
Ni-plating
ENP 2000
high speed
Ni-plating
ENP 2000
Acid hard gold
Co alloy
CA 500
Gloss
Ni-plating
for PCB
High CD PCB Niplating
Property
인천화학㈜
Incheon Chemical Co.,
Process
Condition
M/U
Nickel Sulfamate : 300 - 375 g/L
• Low stress and good elong
Nickel Chloride (6 H2O) : 7.5 - 15 g/L
ation.
Boric Acid : 45 - 53 g/L
• Half bright to full bright.
ENP-2000 Additive : 20 ml/L
• Excellent adhesion.
ENP-2000 Wetter : Up to 10 ml/L
Temp. : 52(50~60) ℃
The cathode CD: 1~5 ASD
PH: 4.0 (3.8~4.5)
• High purity, low stress,
excellent
elongation, form high
degree of purity Ni layer
• Possible for wide CD and
high speed plating
• Excellent durability about
impurities
• Easy to work and control.
• Excellent stability and
long life of solution.
Temp.: 55(50~65) ℃
CD: 5~50 ASD
PH: 4.0 (3.5~4.5)
•Easy high speed plating
by Barrel, rack
Hard gold barrel, rack •Alloy : 0.15 – 0.30% Co
•Hardness :130-200
and high speed.
Knoop
•Density: 17.5 g/cm3
Nickel Metal as Sulfamate :120 - 135 g/L
Nickel Chloride (6 H2O) : 0 - 15 g/L
Boric Acid : 37 - 53 g/L
ENP-2000 Additive : 20 ml/L
ENP-2000 Wetter : Up to 10 ml/L
CA 500 M
CA 500 C
Gold
concentration
Barrel Rack
500
25
4
500
30
8
High speed
500 ml/L
45 ml/L
12 g/L
Barrel& rack
High
speed
Temp.
CD 30-50℃
40-60℃
R: 0.1-3ASD
1-15ASD
B: 0.1-1.5 ASD
18. Electrolysis plating process
Product
Application
Name
Overall acid har
d gold Ni-alloy
plating
NA 500
Soft gold plating
GP 500
Property
Hard gold barrel, rack
and high speed.
•Use in barrel, rack,
high speed
•Purity : 0.15 – 0.30%
Ni
•Hardness :130-200
Knoop
•Density: 17.5 g/cm3
PCB pad and
all pattern
Au plating
• Excellent bonding
intensity
• Excellent
solderability
• Application to Rack,
barrel
• Purity : 99.9+%
• Hardness : 50~90
Knoop
• Density :19.3 g/cm3
인천화학㈜
Incheon Chemical Co.,
Process
Condition
M/U
NA 500 M
NA 500 N
Gold
concentration
GP 500 M
GP 500 A
Gold
concentration
Barrel
Rack
High speed
500
25
4
500
30
8
500 ml/L
45 ml/L
12 g/L
Barrel
Rack
High speed
500
5
6
500
5
8
500 ml/L
5 ml/L
12 g/L
Barrel& rack
High
speed
Temp.
CD 30-50℃
40-60℃
R: 0.1-3ASD
1-15ASD
B: 0.1-1.5 ASD
Barrel& rack
Temp.
CD 50℃
R: 0.1-0.5ASD
B: 0.1-1 ASD
High
speed
60℃
1-10ASD