Transcript Equipment List (设备清单) - Vastbright Technology

ZHUHAI VASTBRIGHT TECHNOLOGY LIMITED
珠 海 创 鸿 电 路 板 有 限 公 司
Company profile
公 司 简 介
Jan 2011
1
珠海创鸿电路板有限公司
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珠海创鸿电路板有限公司
VT
Content (內容提要)
目
录
01 General Information[概括资料] ---------------------------------------------------------------------------------------------------- P.4-5
02 Production Capability & Capacity [生产能力] ---------------------------------------------------------------------------------
P.6
03 Mission / Goal [宗旨 / 目标] ----------------------------------------------------------------------------------------------------------- P.7
04 Certificate [认证证书] ----------------------------------------------------------------------------------------------------------------
P.8-10
05 Organization Chart [组织结构图] ---------------------------------------------------------------------------------------------------
P.11
06 Major Customers [主要客户] --------------------------------------------------------------------------------------------------------- P.12
07 Development Plan [发展计划] -------------------------------------------------------------------------------------------------------
P.13
08 Technology Road Map [制作技术路向图] --------------------------------------------------------------------------------------
P.14
09 Inner Layer Process Flow Chart [內层工艺流程图] -------------------------------------------------------------------------
P.16
10 Outer Layer Process Flow Chart [外层工艺流程图] ------------------------------------------------------------------------11 Technical Specification [技术规格] --------------------------------------------------------------------------------------------
P.17
P.18-20
12 Equipment List [设备清单] -------------------------------------------------------------------------------------------------------- P.21-25
13 Factory Location Map [工厂位置图] ----------------------------------------------------------------------------------------------
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珠海创鸿电路板有限公司
VT
P.26
General Information(概括资料 )
Company Established(公司成立)
November,2000
Capital(资
产)
USD 7 Million
H.K.Head Office(香港办事处)
Rm.107,1/F,hewlett Center,54 Hoi Yuen Road,Kwun Tong,Kowloon,Hong Kong.
香港九龙官塘开源道54号丰利中心1楼107室
Tel:(852)2797 0355
Contact:
Fax:(852)2191 7743
Mr.CY Ng,General Manager
[email protected]
Mr.Andy Ng,Marketing Manager
[email protected]
Factory Location(工厂位置)
Sanzao Hi-Tech Industrial Park,Sanzao,Zhuhai West District,Zhuhai,China.
中国广东省珠海市西区三灶镇三灶高新科技工业园
Tel:(86)756-7768 470
Contact:
Fax:(86)756-776 8473
[email protected]
Site Area(厂区面积)
252,000 square feet(site area)
180,000 square feet(factory area)
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珠海创鸿电路板有限公司
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General Information(概括资料 )
Products(产
品)
S/S,D/S and Multilayer Printed Circuit Boards
(单、双面及多层线路板)
Production Capacity (产
量)
300,000 square feet(27,880 square meters)per month
(每月300，000平方尺<27,880平方米>)
Certification(认
证)
UL-796 certified(E217854)
ISO9001:2008
Certified in April 2003
ISO/TS-16949:2009
Certified in April 2006
ISO-14001
Certified in Jan 2008
Total Employees(雇员人数)
500
Website(网
页)
EN(英文版)
www.vastbright.com
CH(中文版)
www.vastbright-zh.com
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Production Capability & Capacity(生产能力)
Product Type(产品类别) :From single-side up to 8-Layer PCBs(从单面板到8层板)
01、H.A.S.L.（喷锡板）
02、ENIG（沉金板）
03、Immersion Tin （沉錫板）
04、Electro Gold Flash & thick Gold Plating （闪金板及镀厚金板）
05、Organic Surface Preservation（有机保护膜板）
06、Immersion silver (沉银)
07、Lead Free HASL (无铅喷锡)
Capacity(生产量)
300,000 Square Feet per month
Market Share(市场分布)
80% Overseas 20% Local(80%海外
20%国内)
Lead Time(交货周期)
Sample(样板):
10Days for SS &DS(单双面需10天) ;14Days for 4L up(4层及以上需14天)
Mass production(批量生产)
Status/Time/Product
Double Side(双面板)
Multilayer(多层板)
New order(新单)
3weeks
4weeks
Repeat Order(Refresh)(返单)
1.5weeks
2weeks
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Mission / Goal (宗旨 / 目标)
Mission
宗
旨
To identify customers’ needs and to fulfil customers’ expectations and
demands with respect to quality, engineering support and on time
delivery.
（确定客户所需，并以产品质量，工程支援及准时交货以满足客人要求）
To ensure customer satisfaction by being pro-active and flexible;
focused on continuous improvement to produce quality products.
Goal
目
标
（以积极进取、灵活及持续改善的态度生产优质产品，确保客户满意）
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ISO9001:2008 Certificate (ISO9001认证证书)
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ISO/TS16949:2009 Certificate (ISO/TS认证证书)
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ISO14001:2004 Certificate (ISO14001:2004认证证书)
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珠海创鸿电路板有限公司
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Organization Chart (组织结构图）
President(总裁)
Mak Pui Yan(麦沛恩)
General Manager(总经理)
CY Ng(吴昌源)
Finance Dept.财务部
Administration Dept.行政部
Human Resource人力资源(Personnel人事 Training培训) General Affairs总务(Security保安)
QA Dept.品质部
Quality System 品质系统 FQC/FQA最终检查 Document Control文件控制 Quality Engineering品质工程
Laboratory实验室
Pre-Production Engineering Dept.产品工程部
Gerber Review数据分析 MI Preparation制作指示 Tooling Preparation制作工具
Process Engineering Dept.工艺工程部
Process Engineering工艺工程 IT网络
PMC Dept.计划部
Production Planning & Control生产计划及控制 Material Planning物料计划（Store仓库）
Marketing Dept.市场部
Sales销售 Customer Service客户服务
EHS Dept.环保安全部
Waste Water Treatment废水处理 Industrial Safety工业安全 EMS Maintenance环境管理体系维护
Maintenance Dept.维修部
Equipment Maintenance设备维修 Plant Maintenance厂房维修(Electrical/Mechanical电机工程
Construction土建工程)
Purchasing Dept.采购部
Production Dept.生产部
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Major Customers (主要客户)
Beru Electronics GMBH
(Automotive)
Coinco,Inc
(Coin acceptor)
GE-Group
(Automation)
Hunter
(Control Device)
Robert Bosch Co,Ltd
Siemens Group
(Security)
(Building Technologies/A&D)
UTC Fire & Security
(Alarm Sensor)
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Development Plan (发展计划)
Construction of a four-storey Administration Building has been completed at the end
of 2010. this Building will provide spaces for Inner layer press、AOI、Central Office、
Warehouse、 and Canteen facilities, It is scheduled to operate before June 2011.
*
四層高行政大樓已於2010年底完成,行政大樓將包含内层压板、AOI、中央寫字樓、倉
庫及飯堂等設施，預計2011年6月可運作。
Re-layout of the two factory buildings will be carried out after completion of
Administration Building. More new equipment and production lines will then be
installed so as to upgrade production capacity and engineering capability.
*
行政大樓啓用後，原廠房生產流程及機器佈置將會有新安排，並會增加新設備與生產
綫用以提升產量及工程能力。
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Technology Road Map(制作技术路向图)
层叠式多层板软硬结合板
sequential build-up Rigid-flex
2014
高密度互联板/埋孔板
HDI / Buried VIA
2013
高层数多层板/幼线路板
Higher layer count/ Fine Line PCB
2012
铝基材板/FR4软硬结合板
Aluminum base PCB /FR4 rigid-flex PCB
Item
2011
2011
2012
2013
2014
Line Width/Spacing
4mil/4mil
3mil/3mil
2mil/2mil
2mil/2mil
Achievable drill hole size
0.25mm
0.2mm
0.2mm
0.2mm
High Layer Count
10Layer
12Layer
12Layer
14Layer
PCB Type
Aluminum base PCB
/FR4 rigid-flex PCB
Higher layer count
/ Fine Line PCB
HDI / Buried VIA
sequential buildup Rigid-flex
Impedance Control
(50-100)Ω±5%
(50-100)Ω±5%
(50-100)Ω±5%
(50-100)Ω±5%
Surface Finish
Combination of
Various surface
finishing
Lead Free Process Study
RoHS compliance
Halogen free laminate
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珠海创鸿电路板有限公司
Lead-free
process
Electrolytic gold, ENIG, immersion tin, immersion silver, OSP & Lead Free HASL
are already in production.
(无铅制程)
已投产无铅工艺有电金、沉金、沉锡、沉银、有机保护膜及无铅喷锡。
For different combination of laminates, solder mask and surface finishing of our
products are tested by recognized Laboratory to verify the RoHS compliance. For
individual product RoHS compliance, we can provide upon customer request.
RoHS
(有害物质限制)
覆铜板、阻焊和表面涂覆等不同组合的产品已被认可的实验室测试符合RoHS的要
求，我们能提供客户对个别产品符合RoHS的需求。
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Inner Layer Process Flow Chart(內层工艺流程图)
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Outer Layer Process Flow Chart(外层工艺流程图)
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Technical Specification(技朮规格)
Technical Specification
Number of Layers
Remarks
1~8
Special Material On
Request(Roger,High Tg,
Halogen free,etc.)
Material
FR4,CEM1,CEM3,ARLON
Finish Board Thickness
0.20mm~6.00mm(8mil~236mil)
Minimum Core Thickness
0.1mm(4mil)
Copper Thickness
Min.1/2 OZ, max. 3 OZ
Min.Trace Wide & Line
Space
Min.Hole Diameter
Single Sided
0.100mm(4mil)
Double Sided
0.100mm(4mil)
Drilling/PTH
φ0.25 mm ( 10mil )
Punching
φ0.90 mm ( 36mil )
Hole Position
Dimension Tolerance
±0.075 mm ( 3 mil )
Conductor Width(W)
±10%
Hole Diameter(H)
±0.03 mm ( 1.2 mil )
[ With PTH ±0.05 mm ( 2 mil ) ]
Outline Dimension
±0.10 mm ( 4 mil )
Conductors&Outline(C-O)
±0.15 mm ( 6 mil )
Warp and Twist
0.70%
Surface Treatment On Land Area
Nickel/Gold Plating/Immersion
Gold/Immersion Tin/immersion
Sliver/O.S.P/HASL/Lead Free
HASL
Isolation for electrical test
>10MΩ
Continue……
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Technical Specification(技朮规格)
Technical Specification
Continuity for electrical test
25-50Ω
Test voltage for electrical test
250V(max)
Minimum pitch for electrical Testing
0.3mm (12mil)
V-Cutting
0.2mm (8mil) with
conductive rubber
Panel Size
110 mm X 100 mm ( min. )
Board Thickness
0.40 mm (16mil) min.
Remain Thickness
0.20 mm (8mil) min.
Tolerance
± 0.1 mm (4mil)
Groove Width
0.50 mm (20mil) max.
Groove to Groove
15 mm (590mil) min.
Groove to Trace
0.45 mm (18mil) min.
L：±0.15 mm (6mil)
W：±0.10 mm (4mil)
Slot
Minimum spacing
between hole edges
Slot size tol.L≥2W
Remarks
Where: (1)L=Length of
Slot (2)W=Width of
slot"(3)Min.drill bit
size for multi-hit
drilling is 0.50mm"
NPTH slot
L：±0.125 mm (5mil)
W：±0.075 mm (3mil)
Hole diameter(mm)
0.30-1.60
0.10mm(4mil)
1.61-6.50
0.15mm(6mil)
Minimum spacing between hole edge to circuitry
pattern
PTH hole:
0.13mm (5mil)
NPTH hole: 0.18mm (7mil)
Continue……
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Technical Specification(技朮规格)
Technical Specification
Image transfer
Registration to
lerance
Registration
tolerance of
front/back image
Circuit pattern vs.index
hole
±0.075 mm (3mil)
Circuit pattern vs.2nd drill
hole
±0.10 mm (4mil)
Front image vs back image
0.075mm (3mil)
Remarks
4 layers:0.15mm (6mil) max.
Layer-layer misregistration
6 layers:0.2mm (8mil) max.
8 layers:0.25mm (10mil) max.
Min.spacing between board
outline to circuitry pattern
of aninner-layer
Multilayers
0.225mm (9mil)
4 layers: 0.35mm (14mil)
Min.board thickness
6 layers: 0.60mm (23.6mil)
8 layers: 1.00mm (40mil)
4 layers: +/-0.13mm (5mil)
Board thickness tolerance
6 layers: +/-0.15mm (6mil)
8 layers: +/-0.15mm (6mil)
Impedance control
Typical: 50Ω+/-5%
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Equipment List (设备清单)
*)Drilling Section（钻孔工序）
Compressor with Dryer（空压机）
6Sets
CNC Drilling Machine （钻机）
12Sets
Shearing Machine （剪板机）
3Sets
Stack Master （销钉机）
1Set
The central dust collection system （中央吸尘系统）
1Set
*)Multi-layer (Inner Process)多层（内层工序）
Copper Foil Cutter （切铜箔机)
1Set
Prepreg Cutter （切半固化机）
1Set
Acidic Etching Line
(酸性蚀板线)
1Set
Automatic Brown Oxide Treatment Line （自动棕化线）
1Set
Orbotech 1450 AOI with Repair Station （自动光学检测机）
2Sets
Target Hole Drilling Machine (CCD Type) （钻靶机）
1Set
Registration Bonding Machine （点粘合机）
1Set
Hot Pressing 350 Ton M/C with 6 Opening （350吨压机）
2Sets
Cold Pressing M/C（冷压机）
1Set
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Equipment List (设备清单)
*)Plating Section（电镀工序）
Deburring Machine（粗磨机）
1Set
Automatic Electroless P.T.H. Line （自动沉铜线）
1Set
Automatic Copper Panel Line （整板镀铜线）
1Set
Scrubbing Machine（磨板机）
1Set
Automatic Tin Pattern Plating Line （自动镀锡线）
2Sets
Dry Film Stripping / Etching /Tin Stripping Line （退膜/蚀刻/退锡机）
1Set
HASL Pre-treatment Machine
1Set
（喷锡前处理机）
Vertical Hot Air Leveling Machine（喷锡机）
1Set
HASL Post-treatment Machine （喷锡后处理机）
1Set
Immersion Gold Line（沉镍金线）
1Set
Immersion Gold DI Post Clean Line（沉镍金去离子水后处理线）
1Set
Immersion Tin Line（沉锡线）
1Set
Immersion Silver Line（沉银线）
1Set
Immersion Silver DI Post Clean Line （沉银线离子水后处理线）
1Set
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Equipment List (设备清单)
Lead Free Hot Air Leveling Machine（无铅喷锡机）
1Set
Lead Free HASL Pre and Post-treatment Machine （无铅喷锡前后处理机）
1Set
Rinsing & Cleaning Machine （洗板机）
2Sets
Deionize (DI) Water System（去离子水系统）
1Set
Reverse Osmosis (RO) Water System
1Set
(逆渗透水处理系统)
*)Image Transfer Section(图形转移）
IS Pumice Flex Scrubbing Machine （IS火山灰磨板机）
1Set
Hot Roll Laminator（贴膜机）
2Sets
Dry Film Exposure M/C /5KW（干膜曝光机/5KW）
3Sets
Dry Film Developer （干膜显影机）
1Set
Diazo Film Developer （黄片显影机）
1Set
Wise Pumice Scrubbing Machine (火山灰磨板机)
1Set
Scrubbing Machine (磨板机)
1Set
Semi-Auto Silk Screen Printing Machine（半自动丝印机）
7Sets
Tunnel Oven - Pre Cure （隧道烘炉 – 预烘）
2Sets
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Equipment List (设备清单)
Wet Film S/M Exposure M/C /7KW （绿油曝光机/7KW）
3Sets
Wet Film S/M Developer （绿油显影机）
1Set
Tunnel Oven - Post Cure（隧道烘炉 – 后烘）
2Sets
Box Oven（烘炉）
2Sets
Stencil Making Set （网版制作系统）
1Set
*)Profiling Section（外形加工）
CNC Routing Machine （锣机）
7Sets
CNC V-Cutting Machine #NCV600 （电脑V-CUT机）
4Sets
Punching Machine (啤机)
5Sets
*) Quality Assurance / Engineering Section(质量保证/工程）
Fisher X-Ray Coating Thickness Measuring M/C （X-Ray测厚仪）
1Set
Glenbrook X-Ray inner inspection checking M/C （X光学内层检测仪）
1Set
Flying Probe Open/Short Tester （飞针测试机）
2Sets
Cross Section Molding Kit with Polisher （切片制作系统）
1Set
Ionic Contamination Tester,Omega meter 600SMD (离子污染测试仪)
1Set
High Power Microscope （高倍显微镜）
1Set
High Potential Voltage Tester （耐压测试仪）
1Set
Gel Time Tester GT-II (胶固化时间测试仪)
Resin Flow Press MRG-2.0E (树脂流动性测试系统)
1Set
1Set
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Equipment List (设备清单)
Ultrasonic Wire Bonder Tester （超声波铝线焊拉力仪）
1Set
PTX PTH Barrel Checking Kit （孔内铜厚测定仪）
1Set
Solderability Testing Kit （可焊性测定系统）
1Set
Peel Strength Tester (拉力仪)
1Set
V-score Tester (V-坑深度仪)
1Set
High Volt Open & Short Tester
9Sets
(高压开/短路测试机)
Barco CAD/CAM & Plotter #Silverwriter 815 (光绘系统)
1Set
Laser Photo Plotter Model:Silver Writer 8820-P (光绘机)
1Set
Kodamatic 7200 Processor （菲林显影机）
1Set
Optical Coordinates Checking M/C （光学数位测定仪）
2Sets
Viscosimeter (粘度计)
1Set
UV Spectrophotometer (分光光度计)
1Set
SHIMADZU Atomic Absorption Spectrophotometer AA-6300CF (原子吸收分光光度计)
1Set
Tektronix Impedance Control Test System DSA8200
1Set
(阻抗测试机)
*)Packing Section（包装）
2Sets
Vacuum Packing Machine (真空包装机)
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Factory Location Map (工厂位置图)
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ZHUHAI VASTBRIGHT TECHNOLOGY LIMITED
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