Transcript Conquer

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Conquer Electronics
Thin Film Chip Fuse Introduction
Conquer
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現行市場SMD fuse製程種類
• Thin Film Process
– Ceramic substrate  Conquer, Sart, Vishay
– PCB substrate  Littelfuse
• Thick Film Process
– Ceramic substrate  Bussmann
– Injection molding  KOA
– LTCC Fuse AEM (SolidMatrix), Conquer
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Thin Film：Ceramic Type Process
Conquer 12, 06, 04 series
Vishay MFU series
KOA, Sart, AVX
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Thin Film：PCB Type Process
Littelfuse
466, 467, 468 series
Drawing Not to Scale
marking
PCB substrate
Cu element
Protect layer
*Element on PCB substrate surface
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Thick Film：Printing Process
Bussmann
3216FF, 1608FF
*Element on Ceramic substrate surface
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Conquer Electronics
Surface Mount Thin Film Chip Fuse
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薄膜晶片保險絲
• 黃光微影製程配合電鍍技術，線
路製作精緻。
• 產品特性可精準控制。
• 特殊開發之防爆隔絕層與聚熱層
也可確保熔斷特性。
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Chip Fuse Specifications
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Chip Fuse Dimensions
L
W
0402
0603
1206
T
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Type
1206
0603
0402
L
3.1±0.2
1.6±0.15
0.95±0.1
W
1.6±0.1
0.8±0.1
0.48±0.1
T
0.65±0.2
0.43±0.1
0.33±0.1
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Unit : mm
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Electrical Characteristics
CF series (Very Fast-Acting Fuse Series)
Rating Current Electrical Characteristics
100%
4 Hours min
200%
5 Sec max
300%
0.2 Sec max
CT series (Time Lag Fuse Series )
Rating Current
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Electrical Characteristics
100%
4Hrs min
200%
120 Sec max
300%
3 Sec max
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Temperature De-rating Curve
Conquer chip fuse T-Derating chart
• For circuit ,current rating
shall be derated in
accordance with the figure.
120
Percent of rating (%)
• Ambient temperature on
current-carrying capacity.
110
100
90
80
-20
0
20
40
60
80
100
Ambient temperature (℃)
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1206 Applications and Ratings
Type
12CF Series
Rate Current (A)
0.2A
0.5A
0.75A
Marking Code
Internal R (mΩ) at 25℃ max.
C
2300
F
440
G
250
Fusing Current/Fusing Time
(at 25℃)
1A
4A
5A
7A
H
K
N
O
P
S
125
51
36
27
22
15
Rated Current × 100% / 4 hours min.
Rated Current × 200% / 5 seconds max.
Rated Current × 300% / 0.2 seconds max.
T
11
U
7
4A
5A
7A
H
K
N
O
P
S
100
44
31
24
17
13
Rated Current × 100% / 4 hours min.
Rated Current × 200% / 120 seconds max.
Rated Current × 300% / 3 seconds max.
T
8
U
6
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
(Operating Temp. Range)
1.5A
-55℃ to + 125℃
12CT Series
0.2A
0.5A
0.75A
Marking Code
Internal R (mΩ) at 25℃ max.
C
1750
F
370
G
160
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3A
50 A
Rate Current (A)
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
(Operating Temp. Range)
2.5A
32V AC / 63V DC
Type
Fusing Current/Fusing Time
(at 25℃)
2A
1A
1.5A
2A
2.5A
3A
32V AC / 63V DC
50 A
-55℃ to + 125℃
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0603 Applications and Ratings
Type
06CF Series
Rate Current (A)
0.2A
0.5A
0.75A
Marking Code
Internal R (mΩ) at 25℃ max.
C
2800
F
460
G
200
Fusing Current/Fusing Time
(at 25℃)
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
(Operating Temp. Range)
1A
1.5A
3A
4A
5A
H
K
N
O
P
100
55
32
28
20
Rated Current × 100% / 4 hours min.
Rated Current × 200% / 5 seconds max.
Rated Current × 300% / 0.2 seconds max.
S
14
T
10
4A
5A
S
10
T
8
50 A
35 A
-55℃ to + 125℃
06CT Series
Rate Current (A)
0.2A
0.5A
0.75A
Marking Code
Internal R (mΩ) at 25℃ max.
C
1800
F
350
G
120
Fusing Current/Fusing Time
(at 25℃)
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2.5A
32V DC
Type
Rated Voltage
(Open Circuit Voltage)
Interrupting Rating
(at Rated Voltage)
Category Temp. Range
(Operating Temp. Range)
2A
1A
1.5A
2A
2.5A
3A
H
K
N
N
P
90
40
29
20
16
Rated Current × 100% / 4 hours min.
Rated Current × 200% / 120 seconds max.
Rated Current × 300% / 3 seconds max.
32V DC
50 A
35 A
-55℃ to + 125℃
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薄膜晶片保險絲生產作業流程圖
Thin Film Chip Fuse Production Process Flow Chart
Start
正面印刷矽膠平坦層
Silicon Printing
電鍍銅,錫與蝕刻
Electroplate Copper,
Tin & Etching
背面印刷低溫銀膠
Backside Silver Resin Printing
壓膜光阻與曝光與顯影
Press Photoresist &
Optical Lithography
濺鍍鈦鎢與銅
Sputtering TiW/Cu
此二層為功得開發之防爆材料
印保護層,印字,折條與折粒
Marking Printing,
Snap wicker & granule
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滾鍍銅,鎳,錫
Roll electroplate Copper,
Nickel & Tin
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測試與包裝
IPQC & Packing
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Chip Fuse Materials
Outside electrode
Inner electrode
Tin layer
Nickel layer
Copper layer
Insulating layer
Ceramic substrate
& Silicon layer
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Marking layer
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Chip Fuse Multi-Layer Structure
Marking layer
Epoxy layer
Element layer
Silicon layer
Ceramic Substrate
Electrode
*Drawing Not to Scale
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Taping Diameter
Unit : mm
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Reel Dimensions
Unit : mm
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CF & CT Label
Product name & number
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Product name & number
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Reflow Profile
Reference : IPC-JEDEC J-STD 002B
Reflow Condition
Temperature Min（Ts（min））
Pre Heat Temperature Max（Ts（max））
Time （Min to Max ）（ts）
Temperature（TL）（Liquidus）
Reflow
Time（tL）
Peak Temperature（Tp)
Time within 5℃ of actual peak Temperature (tp)
Wave Soldering
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Pb-free assembly
150℃
200℃
60-180 seconds
217℃
60-150 seconds
＋0/-5℃
260
10 seconds
260℃,10seconds max
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Test Circuit Board
Test Circuit Board
Reference Dimensions
Unit : mm
1206
0603
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Reflow solder
Reflow solder
Reflow solder
L1
L2
W
1.1
1.52
1.78
0.66
0.76
1.0
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Peeling Force (EIA-481-1A)
•Peel-off forces are 0.1 N to 1.0 N (10 grams to 100 grams
calibrated scale reading) for 8 mm tape at a peel-off
speed of 300 mm ± 10 mm/minute.
•The peel-off angle should be between 165° and 180°.
Angle: 0~15∘
Standard: 10 ~100 grams
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Product Characteristics & Reliability Tests
Solderability
ANSI/J-STD 002C Test G1
Wetting balance globule test lead-free solder, time
to buoyancy corrected zero, Criteria ≦ 1 second.
Bending test
IEC 60127-4
90mm Between holding points.Bending 3mm,
3times.Continue holding 30sec/time. No
mechanical damages.
Resistance to Solder Heat
MIL-STD-202, Method 210
Max 260±5℃, 10 ± 1 Sec, ΔR<15%
Moisture Resistance
MIL-STD-202, Method 106
High Humidity (95±1% RH), Heat (40±0.5°C)
10days, ΔR<15%
ON /OFF Cycle Test
Refer to Conquer File
Surge current and 60% rated current; 1min ON,
2min OFF, 1000 Cycles, tolerance ΔR<20%
Salt spray
MIL-STD-202 Method 101
ΔR<15%, No excessive corrosion, 48 hours
exposure.
Thermal Shock
Vibration
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MIL-STD-202, Method 107
-40°C~125°C, 100 cycles, ΔR<15%
MIL-STD-202, Method 201A
10~55~10 Hz 1Min/cycle, X Y Z 120 cycles,
6 hours ΔR<15%
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Storage Conditions & Shelf Life
• The Maximum ambient temperature shall not
exceed 40°C.
• The Maximum relative humidity recommended
for storage is 70%.
• 1 years from manufacturing date
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Approval by
• UL JDYX8. E82636
Fuses, Supplemental Certified for Canada Component
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Interrupting Rating Photograph (X-ray)
200% rating current
DC 50A 63V
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1000% rating current
AC 50A 32V
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Application
Consumer
Electronics
Personal & Portable
Computing
Industry
System
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Network
Communications
Office
Machines
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Manufacturing Country & City
• CONQUER ELECTRONICS
CO., LTD.
( Taiwan – WuGu )
• Tel: 886-2-89902189
• Fax : 886-2-89902577
• RD Center
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Thanks for your attention!!
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