Transcript Microsystem Packaging Ch 3 - Department of Electrical, Computer

Fundamentals of Microsystem
Packaging
Presented by:
Paul Kasemir
Ideen Taeb
Chapter 3 Role of Packaging in
Microsystems
What is an Electronic Product?
Examples
1. Computer
2. Telecommunication
3. Automotive
4. Medical and Consumer
Anatomy of a Microsystem
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Systems Packaging
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PWB/PCB
Physical
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Analog
Digital
RF
Photonic ICs
MEMS
Microsystem Classification
There are 6 categories
 Automotive
 Computer and
Business
 Communications
 Consumer
 Industrial and Medical
 Military and Aerospace
4.8%
38.6%
26.1%
11.3%
10.6%
8.7%
Components of a Cell Phone
Computers and the Internet
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Computers are the backbone of the
Internet
E-business
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Server farms handle e-business information
Streamline internal business and engineering
Employee communications
External relationships
Evolution of Computers
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1st Computer: The Eniac 18K vacuum tubes
Von Neumann’s Architecture 1945
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Presents basic digital stored-program computer
Unix in the late 1960s
DOS in 1981
Windows 3.1 in 1994
Windows 95/98/NT
Networked Computers
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Client-Server networks
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Simple low cost clients
Potential high speed computer networks
Remotely “booted”
Example Uses
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Customer support
Finance
Manufacturing
Role of Packaging in Computers
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Migrate from vacuum tubes to transistors
and finally to integrated circuits (ICs)
Bandwidth is the most important
parameter in computing
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Frequency times parallel operations equals
computing power
More computing power means more heat
produced, and needs packaging to cool
How Do Computers Work?
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Microprocessor (uP) computes data
I/O subsystem feeds instructions and data
to the microprocessor
Computer System Performance
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Performance is measured in MIPS
(Millions of Instructions Per Second)
Component of performance:
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Microprocessor speed
Instructions per cycle (MIPS/MHz)
Microprocessor utilization
Perf = (Speed) (MIPS/MHz) (Utilization)
Bandwidth and Performance
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Bandwidth measured in bits per second b/s
A 64 bit wide bus at 100MHz clock (using both
up and down edges) has 12.8 Gb/s
Memory that uses both edges is termed doubledata-rate DDR
Bus Bandwidth affects cache fill rate
Latency is also critical
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Too many requests to memory will introduce many
wait cycles
Packaging and Performance
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Packaging enables good bus performance
Wide busses
Put L2 cache on chip
Packaging is crucial for cooling the uP
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Copper heat sinks and heat pipes
Packaging and Bus Design
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High via and wire densities
High dielectric constants
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High propagation speeds
Low capacitance
Thin layers and many power planes
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Lower noise
Good power distribution
Example
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Intel’s IA-64 Itanium
Multiple caches
Efficient Heat Sink
Role of Packaging in
Telecommunications
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Communications have become much
more complex recently
Used to have different media for different
types of communication
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Voice on the phone line
Images on the TV
Data on computers
Multimedia
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Combination of multiple types of content into the
same message format
Content has different requirements
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Voice needs low delay
Data needs perfect accuracy
Packet switching technology guarantees quality
of service
Fiber optical cable provide high bandwidth for
multimedia communications
Mobile Phones
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Market is increasing very fast
Wireless Communications
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Bandwidth for wireless is much smaller
Mobile phone sizes are shrinking
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1985: 1000g
1990: 350g
Cell Phones
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Required components for the phone
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Radio frequency/intermediate frequency
(RF/IF)
Analog-to-digital (A/D) and digital-to-analog
(D/A) converters
Digital signal processing hardware
Power and battery management
Transmit/Receive Chain
Baseband Section
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CMOS technology used in DSPs
Can reduce the number of ICs
Can reduce the weight and size with
system-on-package (SOP)
RF Section
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Uses many materials such as silicon,
silicon germanium or gallium arsenide
CMOS and bipolar technology
100s of passive components for filters and
oscillators
These make size reduction in the RF
components difficult
Battery and Weight
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Long battery life is important
Monitor the health of battery
Charge when plugged in
Power digital and analog circuits of battery
Weight is reduced by shrinking the PCB
size and lowering the IC count
Surface Mount Devices (SMD) lower
power, weight and size
Role of Packaging in Automotive
Systems
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Automotive industry is as big as electronic
industry.
It accounts for less than 5% of total
equipment sales.
Growing in size every year
Electronic Content
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In year 1998, each vehicle had $843 worth
of electronics.
Wires and connectors and buses plays a
major role in Automotive electronics
Wiring and connectors account for 49% of
the average North American electronic
today
In ten years, it will only drop to 44%
Electronics in Automobile
Primary Characteristic of
Automotive is Harsh Environment
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Temperature plays a big role in Automotive Industry
For example, under the hood temperature can be as low as -40 deg
C.
And right after starting the car, it can get as high as 204 deg C
This harsh temp environment is combined with humidity, vibration
and etc.
Engine Compartment Thermal
Profile
Electronic Packaging
Technologies
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Three Different Technology
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Substrate Technologies
Assembly Technologies
System-Level Packaging Technologies
IC and System Substrate
Technologies
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Three different substrates are used in
automotive electronics:
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Organic,
Ceramic
and insulated metal
Organic Packaging
Technologies(FR-4)
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Most widely used substrate
Includes many layers
Substrates with higher glass are emerging for
higher temperature and communication-related
automotive applications
New generation with caps and resistors
embedded in the layers thus avoiding discrete
components
Ceramic Packaging Technologies
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Alumina is most commonly used ceramic
Laser trimmability of the thick film resistors
to obtain precision values is an attractive
feature of this technology.
Other examples are: HTCC, LTCC
In those, embedded passives are also
available
Aluminum nitride used for thermal
management
Ceramic Packaging in
Automotives
Metal Packaging Technologies
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Insulated with a dielectric layer on which
the circuitry is built.
More advantages in thermal management,
and geometric
Assembly
System-Level Packaging
Technologies
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Two different methods:
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Housing Techniques
Passivation/Conformal Coating
Housing Technique
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Includes die-cast aluminum, die-cast
plastic and sheet metal.
Wire-bonding and direct-solder-attach are
used to provide interconnection from the
circuit to substrate
Passivation/Conformal Coating
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Can be done at substrate or at final
assembly
Materials used: acrylics, epoxies,
urethanes, silicones and parylenes
Implantable Electromedical
Devices
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Widely used today: hearing aids, heart
pacemakers …
Developing in neurological: IPGs can used
to stimulate the spinal cord or the brain
directly to alleviate chronic pain.
Need to be reliable!!!!
Decreasing in size: ICDs from 120cc to
30cc
Implantable Cardiac Defibrillator
Microsystem Play a Dominant
Role in Medical Electronics
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Simple cardiac device can function:
 Sensing the heart’s electrical activity
 Sensing the motions and activity level of the patient
 Sensing the blood flow to and from the heart and etc
These functions require low-voltage microprocessors,AD
and AD converters and more functioning blocks
Packaging will put all these in small chip or device.
Role of Packaging in Consumer
Electronics
US Consumer Electronic
Products and Volumes
Characteristics of Consumer
Products
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Production is in the millions of units per year
Product life cycles are often short and production ramp
ups are fast
Designs tend to be stable during the product run
Product categories tend to saturate their available
market very quickly, so the industry is always looking for
the next application
Brutal and sustained cost reduction, favoring the oldest
technology that will do the jobs unless the small factor is
critical
Role of Packaging in Micro-Electromechanical
systems(MEMS) products
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What are MEMS?
Benefits of MEMS
MEMS play a major role in Medical
Electronics
MEMS applications
What are MEMS?
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Key to further development of the industrial,
medical, and control industry.
Combines electrical functions and the
micromachined elements to form a system-onchip(SOC) or system-on-package(SOP)
Compromised of microprocessor circuitry and
mechanical functions
Can be mass produced
Benefits of MEMS
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Can be used in nearly every industry
Have a beneficial cost, size and reliability
MEMS play a major role in
Medical Electronics
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20 million microscopic pressure sensors
are used each year in blood pressure
measurement
Many different applications such as
micropumps
MEMS Applications
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Used in measurement of gravity to determine
orientation tilt and inclination
Measurement of velocity and position
Measurement of vibration and shock
Automobile industry: braking systems,
accelerometer
MEMS market currently in excess of $5 billion
Summary and Future Trends
Summary and Future Trends
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Digital performance of the order of 10 GHz
digital computer clock speed
RF performance of the order of 100 GHz
RF/wireless speed
Optical performance of the order of 10
terabit per second
Summary and Future Trends
IC I/Os to be packaged in Various Systems