Transcript Interfaces - Micrel Lab @ DEIS
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Microcontrollers Interfaces & Orcad
Marco Benocci, PhD [email protected]
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Microcontrollers Interfaces
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Embedded
“specialized processor targeted for a specific application”
o o
Signal re-sampling Signal generation
: • Periodic: Cosinusoidal, Sinusoidal, Square, Rectangular, Saw tooth, Dirac seq.
• Non-periodic: Noise, Ramp, Step, Dirac.
o o
Operators :
Multiplication, Division, Sine, Cosine, Arc sine, Arc cosine, Absolute, Square root, Natural logarithm, Binary logarithm or base 2 logarithm, Common logarithm or base 10 logarithm, Exponential, Power, Random
Windowing :
Bartlett, Blackman, Hamming, Gauss, Hann, Kaiser, Welch o o
Vectors:
Power, Minimum, Maximum, Negate, Zero padding, Copy, Partial Convolution, Convolution
Filtering:
FIR, least mean square, interpolation, IIR o o
Transforms
(Complex Fast Fourier Transform, Complex inverse Fast Fourier Transform, Real to complex Fast Fourier Transform)
IMA/DVI ADPCM
Signal processing: math library.
Real-time nature: latency, scheduling.
Portability: lifetimey constraint (specially when battery-driven).
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
Photo: http://www.geekzone.co.nz
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Digital Processor: general VS special purpose
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Microprocessor (Central Processing Unit, CPU)
•
First design in late-1960s. MP944 implemented the F-14A Central Air Data Computer. Intel 4004 in 1971.
•
General purpose (i.e. Intel Core, PowerPC).
• •
Features
: ALU + sequencer + register (no memory or peripherals). Three basic tasks: perform mathematical operations, move data between memory locations and follow sets of instructions.
The job of starting up the computer specifically involves the
bootstrap
•
loader
.
The
assembler
translates semantic instructions developed by designers into a language the CPU can use.
Microcontroller (MCU)
•
The microcontroller is the integration of a number of useful functions into a single IC package specialized form of microprocessor designed to be self sufficient and cost-effective.
• • •
Texas Instruments TMS1802 single-chip (4-bit) calculator device was designed in 1971.
Features:
processor + data/program memory + digital IO
.
Application areas: automobiles, office machines, toys, and appliances.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Focus on MCU
Performance Metrics
: •
Low Power consumptions
:
Harvester needs less than 1uW i.e. Atmel PicoPower (165μA/MHz).
•
Cheap Price
:
consumer products.
i.e. MC9S08QG4 costs less than 1$ featuring 4 KB FLASH, 256 B RAM.
n.b. the package influences the final price due to the soldering.
•
Easiness of integration
:
number and kind of Interfaces i.e. STM32 (ARM Cortex M-3) provides USB Host, I2C, SPI, Ethernet, SDIO, CAN.
•
High computational power:
MIPS (Million of Instructions Per Seconds) i.e. ARM Cortex A-8: 2,000 MIPS @ 1.0 GHz.
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
CORTEX
• ARM Cortex family is a complete processor core that provides a standard CPU and system architecture.
• Three main profiles: A profile for high end applications, R for real time and M for cost-sensitive and microcontroller applications. • The Cortex-M3 provides a standardised microcontroller core which goes beyond the CPU to provide the entire heart of a microcontroller (including the interrupt system, SysTick timer, debug system and memory map).
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Interfaces: policies
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Visions Transfert Modalities
Real-time behavior Efficient, economical
i.e. centralized power supply
Bandwidth and communication delay
Inverse relation between volume and urgency
Electrical robustness
Single-ended vs. differential signals
Fault tolerance
Error detecting & error correcting bus protocols
Maintainability Diagnosability Security & Safety
Error detecting and error correcting bus protocols
Privacy
Encryption, virtually private
• FIFO Buffer:
temporarily store acquired data
• Interrupts:
the slowest but most common method
• DMA (Direct Memory Access):
is a system whereby samples are automatically stored in system memory while the processor does something else
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Interfaces: signal acquisition
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Data acquisition system components: Analog
• Analog To Digital Converter (ADC) • Digital To Analog Converter (DAC) • …
Digital
Signal Conditioning Sensors and Actuator IEEE1451
Subsistem Control
Storage Connectivity
Low speed serial interfaces Programmable Timers GPIO Real time clock Watchdog Timer Host Interface Asynch Memory ATAPI/Serial ATA Flash Storage Card SDRAM/DDR USB PCI IEEE 802.3 (Ethernet) IEEE 802.11 a/b7g (WiFi) IEEE 802.15 (WPAN) IEEE 1394 (Firewire) Asynchronous Memory Flash Storage Card
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011 Data Streaming
Low Speed Serial Interfaces USB 2.0 Full Speed (12Mbps) 10BaseT Ethernet IEEE 802.11b
Synch Serial Audio/Data Ports Host Interface IEEE 802.11a/g 100BaseT Ehternet USB 2.0 High Speed (480Mbps) IEEE 1394 (Firewire) Parallel Video/Data Ports Gigabit Ethernet PCI/ PCI Express
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• The IEEE 1451 standard defines the architecture that achieve to the sensors, instruments and systems to work together with relative ease. • The IEEE 1451 vision underlines the change of the computer role: the intelligence is distributed over the network. The innovative concept of Smart sensor aims to: move intelligence closer to the point of measurement/control; create confluence of transducers, computation and communication towards common goal; make sensor cost effective to integrate/maintain distributed systems.
IEEE 1451
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
A TIM contains: • from 1 to 255 transducers (can be a mix of sensors and actuators); • signal conditioning and processing electronics; • address logic (or microprocessor) to implement a standardized Transducer Interface (wired or wireless) defined by IEEE 1451.X (.2, .3, .5, .6, ) between the TIM and NCAP; • a TEDS.
A NCAP integrates: • a neutral smart transducer object and data models that allow NCAP to communicate sensor data and information to any network; • NCAP to NCAP communications (defined by IEEE 1451.1); • application programming interfaces (API) and a common set to access transducers from a network (defined by IEEE 1451.0).
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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IEEE 1451.2: Smart Sensor
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Smart sensors
is a transducer or an actuator easy to install, maintain, modify and upgrade.
• Integration of extensible Transducer Electronic Data Sheet (TEDS): a memory area inside the sensor where sensor identification information, calibration data, measurement range are stored.
• Simplify the data exchange over the network (standard engineering units).
• Self-identification, self-diagnostic .
• Time aware’ for time stamping and correlation: Triggering and control model defines how channels are accessed.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Sensors: Classification
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
• The physics of their operation.
One physical principle can be used to measure many different phenomena.
e.g. piezoelectric effect can measure force, flexure, acceleration, heat, and acoustic vibrations.
• The particular phenomenon they measure.
One phenomenon can be measured by many physical principles.
e.g. sound waves can be measured by the piezoelectric effect, capacitance, electromagnetic field effects, and changes in resistance.
• By a particular application .
e.g. one could group all sensors together that can be used to measure distance.
•
Active
VS passive.
Passive: the physical phenomena observed modifies some electrical characteristics of the sensor that can be observed supply external power (e.g. RFID).
Self-generating sensor: the power is absorbed by the observed physical phenomena and transform in electric power in output (e.g. RFID & Sensing).
• Energy .
Middelhoek’s classification energy domain such as electrical, thermanl, radiation, nechanical, magnetic, (bio) chemical.
• Technology .
e.g. MEMS
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Sensors: Calibration
Alma Mater Studiorum Facoltà di Ingegneria, Bologna • FSO (Full Scale Output)
Upper – Lower [endpoint of output]
• Calibration
Relationship between sensor output e applied physical input
• Error
Measured value – true value [% of FSO]
• Offset
Sensor output for zero applied input
• Hysteresis
Max [value approached with decreasing input - value approached with increasing input]
• Sensitivity
Max deviation of calibration point from straight line [% of FSO]
• Accuracy
Max deviation of calibration point from straight line [% of FSO]
• Repeatability
Max deviation of calibration point from straight line [% of FSO]
• Resolution
FS Smallest change in the physical variable that results in a detectable change in the sensor output
• Frequency response
Change with frequency of out/in magnitude ratio and phase difference for sinusoidally varying input
• Cross-sensitivity
Sensitivity of sensor of a variable than the physical quantity under measurement Bias Non Linearity
• Stability
Ability of sensor to reproduce output for identical input and condition over time Mechanical Misalignements (Factory) Saturation Vout - 10 -
Sensors: Signals
Nature
• continuous-time, continuous-valued (
real
) • discrete-time, continuous-valued (
sampled
) • continuous-time, discrete-valued (
quantified
) • discrete-time, discrete-valued (
numeric
)
Real
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Time interval definition (
t
0,
t
0+t)
Sampled
"
Conditioning
" of a signal basically means to manipulate a signal in such a way that it meets the requirements of the next stage for further processing.
translate the sensors output to a selected voltage modifying the sensors dynamic range to maximize the accuracy of the data acquisition system removing unwanted signals limiting the sensor's spectrum
Quantified
Features
Peak-Peak: Peak value (minus): Peak value (plus): Mean:
Numeric
(Time interval definition [t0, t0+t])
Signal “Nature” to Voltage Convertion
• • • • Current to Voltage Resistance to Voltage Signal Energy to Voltage Capacitance to Voltage RMS:
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Conditioning the FSR
Alma Mater Studiorum Facoltà di Ingegneria, Bologna FSR – Force Sensor Resistor
Force sensing resistors use the electrical property of resistance to measure the force (or pressure) applied to a sensor.
Resistance to Voltage FSR Inseguitore (Av=1) Thresholding
Hardware Interrupt generation FSR
If the sensor's voltage is greater than the threshold, the output of the circuit is maximum (typically 5V).
If the sensor's output is less than the threshold, the output of the circuit is minimum (usually 0V).
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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ADC
The analog and continuous time signals measured by the sensor and modified by the signal conditioning circuitry must converted into the form a computer can understand.
Aliasing
Impossible to reconstruct fast signals after slow sampling: multiple fast signals share same sampled sequence (mind Harry Nyquist) 0 -0.5
-1 -1.5
1.5
1 0.5
Sample and hold circuitry
• The ADC must have a
stable
signal in order to accurately perform a conversion: the sample and hold circuitry take a snapshot of the sensor signal and hold the value. •The switch connects the capacitor to the signal conditioning circuit once every
sample period
. •The capacitor then sample is acquired.
holds
the voltage value measured until a new
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011 Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Example: Signal: 5.6 Hz; Sampling: 9 Hz Equivalent circuit for the sample and hold
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ADC Architectures
There are many different ADC architectures:
Successive Approximation (SAR);
Sigma Delta (SD or
);
Slope or Dual Slope; Pipeline; Flash...as in quick, not memory.
Alma Mater Studiorum Facoltà di Ingegneria, Bologna Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
14
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ADC in MSP430 (SAR 12bit)
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Vin Key idea: binary search Set MSB='1‘ (if too large: reset MSB) Set MSB 1='1‘ (if too large: reset MSB-1)
e.g. successive approximation
V V -
N
= (approximated - real signal) called
quantization noise
.
V
in
1100 1010 1011 Quantum Resolution12bit 1000 V • • • • • • • •
Features:
resolution (i.e. 12bit) maximum conversion rate (i.e. 200 ksps)
e.g. quantization noise for sine wave
sampling periods controller (i.e. software or timers) on-chip reference voltage generation (i.e. 1.5 V or 2.5 V) individually configurable external input channels single-channel, repeat-single-channel, sequence, and repeat-sequence conversion modes number of storage registers cross-talking
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
t
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DAC Alma Mater Studiorum Facoltà di Ingegneria, Bologna
PWM signals are often used to create analog signals in embedded applications.
We create a sine wave level with pulse-width modulated (PWM) signals from Timer_B
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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UART
Alma Mater Studiorum Facoltà di Ingegneria, Bologna UART
(universal asynchronous receiver / transmitter) , Goldon Bell 1971 (?) Asynchronous.
takes bytes of data and transmits the individual bits in a sequential fashion.
UART controller is the key component of the serial communications subsystem of a computer. The UART 7- or 8-bit data with odd, even, or non-parity LSB-first data transmit and receive Simple compatibility with RS232 The start bit is always a 0 (logic low), which is also called a space.
Cheap: serial transmission of digital information (bits) through a single wire or other medium is much more cost.
f Standard baudrate: 2400, 19200, 57600,115200, 921600… Focus: reliability The UART usually does not directly generate or receive the external signals used between different items of equipment. Typically, separate interface devices are used to convert the logic level signals of the UART to and from the external signaling levels.
than parallel transmission through multiple wires.
CTS
Clear to
This line indicates that the Modem is ready to exchange data.
Send
DCD DSR DTR RTS
Data Carrier Detect
When the modem detects a "Carrier" from the modem at the other end of the phone line, this Line becomes active.
Data Set
This tells the UART that the modem is ready to establish a link.
Ready Data Terminal
This is the opposite to DSR. This tells the Modem that the UART is ready to link.
Ready Request To Send
This line informs the Modem that the UART is ready to exchange data.
RI
Ring Indicator
Goes active when modem detects a ringing signal from the PSTN.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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UART
• • • •
Pros
Asynchronous serial devices, such as UARTs, do not share a common clock.
• Compatible with RS232C
Cons
Each device has its own, local clock. The devices must operate at exactly the same frequency (baudrate automatical detection).
Logic (within the UART) is required to detect the phase of the transmitted data and
phase lock
the receiver’s clock to this.
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
• •
RS232C
An old standard (1960), originally intended for connecting computer equipment (computers or terminals, referred to as DTE) to communication equipment (DCE).
• RS232C is are commonly used in conjunction with UART because they share the same protocol.
RS232 Voltages are +5..+25V for a logic 0, and -5V..-25V for a logic 1 (Reverse polarity)
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011 DB-25
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I2C Alma Mater Studiorum Facoltà di Ingegneria, Bologna I2C
(inter-integrated circuit), Philips1982 Philips Semiconductor I2C specification v2.1 ( http://www.nxp.com/acrobat_download2/literature/9398/39340011.pdf) IC (Inter Communication Bus) fabrication process (NMOS, CMOS, bipolar) Half-duplex, synchronous, multi-master bus Two wires: serial data (SDA), serial clock (SCL) receiver.
Each device is recognized by a unique address and can operate as either a transmitter or A master is the device which initiates a data transfer on the bus and generates the clock signals to permit that transfer. At that time, any device addressed is considered a slave.
mode. Standard-mode, up to 400 kbit/s in the Fast-mode, or up to 3.4 Mbit/s in the High-speed 10-bit extended addressing for new designs (7-bit addresses all exhausted).
Focus: minimizes interconnections eliminates the need for address decoders and other ‘glue logic’ connections the multi-master capability allows rapid testing of end-user equipment via external simple design/upgrade • • Clones: present restriction of timing and voltage levels, introduction of interrupt signal Intel SMBus (System Management Bus): speed 10 a 100 kHz Intel PMBus: speed < 400 kHz
DECT cordless phone base-station.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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I2C
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
•
Pros
multimaster • • no chip select or arbitration logic required • transmission control “Clock stretching” – when the slave (receiver) needs more time to process a bit, it can pull SCL low. The master waits until the slave has released SCL before sending the next bit.
• • • • • “General call” broadcast – addresses every device on the bus
Cons
The number of interfaces connected to the bus is solely dependent on the bus capacitance limit of 400 pF.
Limited to about 10 feet for moderate speeds.
Need external hardware: lines pulled high via resistors, pulled down via open-drain drivers (wired-AND) Half-duplex
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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SPI SPI (Serial Peripheral Interface Bus),
found on Motorola's M68HC11 family of CPUs in 2001
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
• • • • • Data is simultaneously transmitted and received. Master/slave relationship.
Interprocessor communications in a multiple-master system.
3-pin and 4-pin SPI operation 7- or 8-bit data length • • 2 data signals: • MOSI – master data output, slave data input • MISO – master data input, slave data output 2 control signals: • SCLK – clock • /SS – slave select (no addressing) • The serial clock line [SCK] synchronizes shifting and sampling of the information on the two serial data lines.
• The master places the information onto the MOSI line a half-cycle before the clock edge that the slave device uses to latch the data.
• Four possible timing relationships can be chosen by using the Clock Polarity [CPOL] and Clock Phase [CPHA] bits in the Serial Peripheral Control Register [SPCR]. • Data rates as high as 1 Mbit per second are accommodated when the system is configured as a master; rates as high as 2 Mbits per second are accommodated when the system is operated as a slave.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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SPI
Alma Mater Studiorum Facoltà di Ingegneria, Bologna Pros
Full duplex communication Higher throughput than I²C or SMBus Flexibility for the bits transferred (arbitrary choice of message size, content, and purpose) Simple hardware interfacing o Typically lower power requirements than I²C or SMBus due to less circuitry (including pullups) o o o Slaves use the master's clock, and don't need precision oscillators Slaves don't need a unique address - unlike I²C or GPIB or SCSI Signals are unidirectional allowing for easy Galvanic isolation
Cons
Requires more pins on IC packages than I²C No in-band addressing; out-of-band chip select signals are required on shared buses No hardware flow control No hardware slave acknowledgment Supports only one master device Only handles short distances compared to RS-232, RS-485, or CAN-bus
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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SPI vs. I
2
C
SPI Simultaneus transfert As the register transmits the byte to the slave on the MOSI signal line, the slave transfers the contents of
its
shift register back to the master on the MISO signal line, exchanging the contents of the two shift registers. For point-to-point , SPI is simple and efficient Less overhead than I 2 C due to lack of addressing, plus SPI is full duplex.
For multiple slaves , each slave needs separate slave select signal More effort and more hardware than I 2 C
Alma Mater Studiorum Facoltà di Ingegneria, Bologna Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
SPI I 2 C
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PWM
Alma Mater Studiorum Facoltà di Ingegneria, Bologna PWM
(Pulse-Width Modulated): communication throw a width-capture of a precise external pulse
i.e. drive servo-motors
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Interface a digital smart sensor
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
LIS302DL
o
3-axis digital accelerometer
o
Range: ±2g or ±8g
o
Output Interface: I2C or SPI (CMOS)
o
Max Data rate (ODR): 400Hz
o
Bandwidth: ODR/2
o o
Turn-on Time: 3/ODR Sensitivity: 18 or 72 mg/LSB No external conditioning circuit need for C/V convertion and voltage translation Internal 8 bit ADC Serial Bridge
Capacitive Sensor
Advantages provided by Smart sensors (ctrl flags, interrupts, energy duty-cycling, ...)
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Interface a digital sensor: SPI
Serial Bridge
Register Memory Mapping Alma Mater Studiorum Facoltà di Ingegneria, Bologna Control Registers SPI Communication Management
1. Init (RW=0; AD5:0=0x20; D7:0=0x47) Enable X, Y, Z axis – DR=400; FS = ±2g | n.b. CTRL_REG 2 does not need deafult value change 2. Read X Low Data (RW=1; AD5:0=0x29) Read D7:0 value
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
Enable Filter for Free-Fall Wake Up
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Field Busses
Alma Mater Studiorum Facoltà di Ingegneria, Bologna Fieldbus
(or
field bus
) is the name of a family of industrial computer network protocols used for real-time distributed control, now standardized as
IEC 61158
.
A complex automated industrial system — such as a manufacturing assembly line — usually needs an organized hierarchy of controller systems to function. In this hierarchy there is usually a Human Machine Interface (HMI) at the top, where an operator can monitor or operate the system. This is typically linked to a middle layer of programmable logic controllers (PLC) via a non-time critical communications system (e.g. Ethernet). At the bottom of the control chain is the fieldbus which links the PLCs to the components which actually do the work such as sensors, actuators, electric motors, console lights, switches, valves and contactors (
Wiki
).
Relevant examples: •
CAN
: Controller Area Network •
Profibus
: Process Field Bus •
TTP
: Time-Triggered-Protocol •
FlexRay:
designed to be faster and more reliable than CAN and TTP •
MAP:
bus designed for car factories •
IEEE 488:
designed for laboratory equipment •
EIB
: European Installation Bus
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Alma Mater Studiorum Facoltà di Ingegneria, Bologna Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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ORCAD/Cadence
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
•
Computer-Aided Engineering (CAE) tools
manufacturing.
cover all aspects of engineering design from drawings to analysis to • Computer-aided design ( system design.
CAD
) is a category of CAE that is related to the physical layout and drawing development of a • Electronic design automation ( hardware.
EDA
) reduce development time and cost because they allow designs to be simulated and analyzed prior to purchasing and manufacturing •
Capture
contains extensive parts libraries that may be used to generate schematics that stand alone or that interact with PSpice, or Layout, or both simultaneously.
•The pins on a Capture part can be
mapped
physical package in Layout. into the pins of a PSpice model and/or the pins of a •
PSpice
is a CAE tool that contains the mathematical models for performing simulations, and Layout is a CAD tool that converts a symbolic schematic diagram into a physical representation of the design. •
Netlists
are used to interconnect parts within a design and connect each of the parts with its model and footprint. • In addition to being a CAD tool, Layout also functions as a
front-end CAM tool
by generating the data on which other CAM.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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PCB
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Printed Circuit Board (PCB) A PCB consists of two basic parts: a substrate (the board) printed wires (the copper traces). The substrate provides a structure that physically holds the circuit components and printed wires in place and provides electrical insulation between conductive parts. A common type of substrate is FR4, which is a fi berglass –epoxy laminate. Substrates are also made from Tefl on, ceramics, and special polymers.
During manufacturing the PCB starts out as a copper clad substrate as shown in Fig. 1-2. A rigid substrate is a C-stage laminate (fully cured epoxy). The copper cladding may be copper that is plated onto the substrate or copper foil that is glued to the substrate.
A substrate can have copper on one or both sides. Multilayer boards are made up of one or more single- or double-sided substrates called cores. A core is a copper-plated epoxy laminate. The cores are glued together with one or more sheets of a partially cured epoxy.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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PCB Design Process: OrCAD Layout
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Layout is used to design the PCB by generating a digital description of the board layers for photoplotters and CNC machines, which are used to manufacture the boards.
There are separate layers for : • routing copper traces on the top, bottom, and all inner layers; • drill hole sizes and locations; • soldermasks; • silk screens; • solder paste; • part placement; • board dimensions.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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OrCAD Layout: File format
Alma Mater Studiorum Facoltà di Ingegneria, Bologna Layout format files (.MAX)
Layout uses .MAX extension while you are designing your board.
Gerber Files
When you are ready to fabricate your board, Layout postprocesses the design and converts it into a format that the photoplotters and CNC machines can use (Gerber files).
A separate Gerber file is created for each of the layers (distinguible by the extension).
Assembly layers
These files are used for automated assembly of a finished board.
• Solder-paste layer. It is used to make a contact mask for selectively applying solder paste onto the PCB’s pads so that components can be reflow soldered to the board. There may be a solder-paste layer for the top side of the board (.SPT) and one for the bottom side (.SPB).
• Assembly layer, which contains information for automatic component placement machines (pick-and-place machines) as to the part type, its position, and its orientation on the board. As with the soldermask, there may be an assembly layer for the top side of the board (.AST) and one for the bottom side (.ASB).
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Overview of the Design Flow
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Basic procedure for generating a schematic in Capture and converting the schematic to a board design in Layout: 1.
Start Capture and set up a PCB project using the PC Board wizard.
2.
Make a circuit schematic using OrCAD Capture.
3.
Use Capture to generate a Layout netlist and save it as a .MNL file for Layout.
4.
Start Layout and select a PCB technology template (.TCH file).
5.
Save the Layout project as a .MAX project file.
6.
Use Layout to import the .MNL netlist into the .MAX file.
7.
Make a board outline.
8.
Position the parts within the board outline.
9.
Autoroute the board.
10. Run the postprocessor to generate fi les used to manufacture the PCB.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Industry Standards
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
How big and what shape should the board outline be?
Where should the parts be placed and in what order? What kind of layer stackup should be used?
How wide and far apart should the traces be routed?
What grounding and shielding techniques should be used? Is there a “right” way to do it, and who says so?
There are several standards related to PCB design to solve these questions. The organizations below set standards that may be guides, rules for certification, or even laws: • • • • • • •
Institute for Printed Circuits (IPC-Association Connecting Electronics Industries) Electronic Industries Alliance (EIA) Joint Electron Device Engineering Council (JEDEC) International Engineering Consortium (IEC) Military Standards American National Standards Institute (ANSI) Institute of Electrical and Electronics Engineers (IEEE)
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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PCB Issues
Alma Mater Studiorum Facoltà di Ingegneria, Bologna Performance classes
PCBs can fall into any of three end-use performance classes.
● Class 1, General Electronic Products, includes general consumer products (televisions, electronic games, and personal computers) that are not expected to have extended service lives and are not likely to be subjected to extensive test or repairability requirements.
● Class 2, Dedicated-Service Electronic Products, includes commercial and military products that have specifi c functions such as communications, instrumentation, and sensor systems, from which high performance is expected over a longer period of time. Since these items usually have a higher cost they are usually repairable and must meet stricter testing requirements.
● Class 3, High-Reliability Electronic Products, includes commercial and military equipment that has to be highly reliable under a wide range of environmental conditions. Examples include critical medical equipment and weapons systems. They typically have more stringent test specifi cations and possess greater environmental robustness and reworkability.
Producibility levels
The three producibility levels are: ● Level A, general design—preferred complexity ● Level B, moderate design—standard complexity ● Level C, high design—reduced producibility complexity
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Minimum recommended spacing
Alma Mater Studiorum Facoltà di Ingegneria, Bologna Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Ground Issues
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
Typical signal and return connection schemes.
Left) parallel connected Right) Series connected Signal and return connection parallel and series schemes in Layout
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Common ground plane
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
• Solve routing problems • If the signal path is relatively close to the return path, the return signal will automatically flow through the GND plane directly below the signal trace (in DC circuits, current follows the path of least resistance).
• AC currents will follow the path of least impedance and, particularly on PCBs, the path of least inductance In a typical PCB the power distribution system contains one or more power and ground planes. The power and ground planes are like very wide traces (have little inductance) and are usually adjacent to each other (high capacitance). Ok for the power distribution system Problem occurs in high-speed digital systems when gates switch from one state to another: switching noise .
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Switching Noise
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
the supply voltages across the PCB while the gate is switching
Because the power and ground planes are not superconductors there is a drop in voltage between the supply pins of the gate and where power is connected to the PCB (same for the return plane).
Remember that there is always some amount of resistance and inductance even on the so-called ground plane.
Rail collapse : the drop in the positive rail Ground bounce : the rise in ground potential.
The primary purpose of bypass capacitors in digital circuits is to promote a stable PCB power distribution system and prevent rail collapse and ground bounce. The bypass capacitors act as lowpass fi ters and short out power supply transients (noise) before they get to the amplifliers.
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011
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Split power and ground planes
Alma Mater Studiorum Facoltà di Ingegneria, Bologna
The solution to the problem of digital noise being injected into analog circuitry through the supply planes is to segregate the analog components from the digital ones and eliminate common return paths. Segregating the components is straightforward; the components are physically placed in different places on the board.
a) Continuous plane b) Split plane c) Moated plane d) Isolated, coutinuous plane
Marco Benocci , PhD – Microcontroller Interfaces – MPHS 2010/2011